摘要:
A semiconductor structure includes a substrate, a sacrificial layer formed on or over the substrate, and a structural layer formed on or over the sacrificial layer. At least one opening is formed in the structural layer. At least one opening is formed in the sacrificial layer below the at least one opening in the structural layer. The at least one opening in the structural layer and the at least one opening in the sacrificial layer are at least partially filled with a filler material. At least one portion of the structural layer is removed to define at least one microstructure. The sacrificial layer is removed such that the at least one microstructure is released from the substrate and the filler material forms one or more protrusions on the at least one microstructure, and/or one or more anchors anchoring the at least one microstructure to the substrate.
摘要:
The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilicon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.
摘要:
The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.
摘要:
The present invention provides a micromechanical or microoptomechanical structure produced by a process comprising defining the structure in a single-crystal silicon layer separated by an insulator layer from a substrate layer; selectively etching the single crystal silicon layer; depositing and etching a polysilicon layer on the insulator layer, with remaining polysilicon forming mechanical elements of the structure; metalizing a backside of the structure; and releasing the formed structure.
摘要:
The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a pattern on a single crystal silicon layer separated by an insulator layer from a substrate layer; defining a structure in the single-crystal silicon layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; and releasing the formed structure.
摘要:
Methods and systems of ejecting ink drops from an inkjet printer are disclosed. The methods and systems can include a printhead with one or more tapered nozzles each with an associated taper angle and exit diameter. Ink can be received into the printhead and formed into ink drops in the tapered nozzles. The ink drops can each have an associated drop mass and drop speed. The tapered nozzles can be provided such that the exit diameter can independently dictate the drop mass and the taper angle can independently dictate the drop speed. As such, the complexity of jet design optimization is reduced.
摘要:
A thermal bubble jetting device including a substrate. A superoleophobic, textured surface is positioned on the substrate. The textured surface comprises one or more gaps configured for holding a gas. A receptacle is positioned in fluid communication with the textured surface. Both an inlet and nozzle are in fluid communication with the receptacle. The device includes a heater mechanism configured to expand a gas in the one or more gaps so as to sufficiently increase pressure in the receptacle to force liquid through the nozzle.
摘要:
A method and structure for an ink jet printhead aperture plate assembly which can be part of an ink jet printhead and an ink jet printer. The present teachings can include the use of a protective coverlay interposed between a press plate of a press and an anti-wetting coating on a polyimide layer which forms part of the aperture plate assembly. The coverlay can include a base material which has an elastic modulus which is at least a specified value. An embodiment of the present teachings can form an aperture plate assembly and an ink jet printhead having reduced dimpling and deformation around a nozzle opening in the aperture plate assembly.
摘要:
A chip used for dispensing a fluid such as ink provides ink-dispensing ejectors having an ink cavity over a supporting substrate, and further provides a heater for heating the ink in the cavity. The heater can be interposed between the substrate and the ink cavity to provide direct heating of ink as it is being dispensed. Various embodiments further comprise the use of the heater structure as a temperature probe to measure the temperature of the ink in the ink cavity. Other embodiments provides a chip having both a temperature probe and a heater as separate structures interposed between the ink cavity and the substrate. Further described is a temperature probe and/or heater which traverses a majority of a width of a substrate, and surrounds each drop ejector on at least two sides.
摘要:
Methods and systems of ejecting ink drops from an inkjet printer are disclosed. The methods and systems can include a printhead with one or more tapered nozzles each with an associated taper angle and exit diameter. Ink can be received into the printhead and formed into ink drops in the tapered nozzles. The ink drops can each have an associated drop mass and drop speed. The tapered nozzles can be provided such that the exit diameter can independently dictate the drop mass and the taper angle can independently dictate the drop speed. As such, the complexity of jet design optimization is reduced.