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1.发明申请IMAGE SENSOR PACKAGE, RELATED METHOD OF MANUFACTURE AND IMAGE SENSOR MODULE 审中-公开图像传感器封装，相关制造方法和图像传感器模块公开(公告)号：US20080055438A1
公开(公告)日：2008-03-06
申请号：US11842993
申请日：2007-08-22
IPC分类号： H04N5/335
CPC分类号： H04N5/2253 , H01L31/0203 , H01L31/02325 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H04N5/2254 , H04N5/2257 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： The image sensor package includes: an image sensor chip including an image sensing unit which is positioned in an upper central portion thereof and including a plurality of chip bonding pads formed around the image sensing; a transparent board including a lower surface on which a first line electrically connected to the chip bonding pads is formed and the transparent board being arranged with the image sensor chip so that the lower surface faces the image sensing unit; and a plurality of second lines connected to the first line and extending along sidewalls of the image sensor chip to be exposed under a lower surface of the image sensor chip.
摘要翻译： 图像传感器封装包括：图像传感器芯片，其包括位于其上部中央的图像感测单元，并且包括形成在图像感测周围的多个芯片接合焊盘; 形成有与所述芯片接合焊盘电连接的第一线的下表面的透明板，并且所述透明板与所述图像传感器芯片配置使得所述下表面面对所述图像感测单元; 以及连接到第一线并且沿着图像传感器芯片的侧壁延伸以暴露在图像传感器芯片的下表面下方的多个第二线。
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2.发明授权Pre-package and methods of manufacturing semiconductor package and electronic device using the same 有权半导体封装的预封装和制造方法以及使用其的电子器件公开(公告)号：US09478514B2
公开(公告)日：2016-10-25
申请号：US14838389
申请日：2015-08-28
申请人： Gun-ho Chang , Un-byoung Kang , Tae-je Cho
发明人： Gun-ho Chang , Un-byoung Kang , Tae-je Cho
IPC分类号： H01L21/77 , H01L23/00 , H01L21/683
CPC分类号： H01L21/6836 , H01L21/304 , H01L21/6835 , H01L21/76898 , H01L21/78 , H01L23/36 , H01L23/544 , H01L24/02 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/95 , H01L25/0657 , H01L25/50 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2221/68386 , H01L2223/5446 , H01L2224/02331 , H01L2224/02372 , H01L2224/02373 , H01L2224/0239 , H01L2224/0401 , H01L2224/05024 , H01L2224/11002 , H01L2224/11009 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11614 , H01L2224/11849 , H01L2224/13026 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13562 , H01L2224/13611 , H01L2224/13613 , H01L2224/1362 , H01L2224/13639 , H01L2224/13647 , H01L2224/13664 , H01L2224/14519 , H01L2224/16145 , H01L2224/16227 , H01L2224/16245 , H01L2224/17181 , H01L2224/73253 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06544 , H01L2225/06555 , H01L2225/06582 , H01L2225/06589 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01073 , H01L2924/01074 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/15311 , H01L2924/15313 , H01L2924/18161
摘要： Methods of fabricating semiconductor packages are provided. One of the methods includes forming a protection layer including metal on a first surface of a substrate to cover a semiconductor device disposed on the first surface of the substrate, attaching a support substrate to the protection layer by using an adhesive member, processing a second surface of the substrate opposite to the protection layer to remove a part of the substrate, and detaching the support substrate from the substrate.
摘要翻译： 提供制造半导体封装的方法。 其中一种方法包括在衬底的第一表面上形成包括金属的保护层，以覆盖设置在衬底的第一表面上的半导体器件，通过使用粘合构件将支撑衬底附着到保护层上，处理第二表面 的衬底相对于保护层去除衬底的一部分，以及从衬底分离支撑衬底。
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3.发明申请PRE-PACKAGE AND METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE USING THE SAME 有权使用其制造半导体封装和电子器件的预包装和方法公开(公告)号：US20160141260A1
公开(公告)日：2016-05-19
申请号：US14838389
申请日：2015-08-28
申请人： Gun-ho Chang , Un-byoung Kang , Tae-je Cho
发明人： Gun-ho Chang , Un-byoung Kang , Tae-je Cho
IPC分类号： H01L23/00 , H01L21/683
CPC分类号： H01L21/6836 , H01L21/304 , H01L21/6835 , H01L21/76898 , H01L21/78 , H01L23/36 , H01L23/544 , H01L24/02 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/95 , H01L25/0657 , H01L25/50 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2221/68386 , H01L2223/5446 , H01L2224/02331 , H01L2224/02372 , H01L2224/02373 , H01L2224/0239 , H01L2224/0401 , H01L2224/05024 , H01L2224/11002 , H01L2224/11009 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11614 , H01L2224/11849 , H01L2224/13026 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13562 , H01L2224/13611 , H01L2224/13613 , H01L2224/1362 , H01L2224/13639 , H01L2224/13647 , H01L2224/13664 , H01L2224/14519 , H01L2224/16145 , H01L2224/16227 , H01L2224/16245 , H01L2224/17181 , H01L2224/73253 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06544 , H01L2225/06555 , H01L2225/06582 , H01L2225/06589 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01073 , H01L2924/01074 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/15311 , H01L2924/15313 , H01L2924/18161
摘要： Methods of fabricating semiconductor packages are provided. One of the methods includes forming a protection layer including metal on a first surface of a substrate to cover a semiconductor device disposed on the first surface of the substrate, attaching a support substrate to the protection layer by using an adhesive member, processing a second surface of the substrate opposite to the protection layer to remove a part of the substrate, and detaching the support substrate from the substrate.
摘要翻译： 提供制造半导体封装的方法。 其中一种方法包括在衬底的第一表面上形成包括金属的保护层，以覆盖设置在衬底的第一表面上的半导体器件，通过使用粘合构件将支撑衬底附着到保护层上，处理第二表面 的衬底相对于保护层去除衬底的一部分，以及从衬底分离支撑衬底。
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4.发明申请Multi-path printed circuit board having heterogeneous layers and power delivery system including the same 审中-公开具有异质层的多路径印刷电路板和包括其的功率输送系统公开(公告)号：US20060157826A1
公开(公告)日：2006-07-20
申请号：US11247307
申请日：2005-10-12
申请人： Hee-seok Lee , Un-byoung Kang , Yun-hyeok Im
发明人： Hee-seok Lee , Un-byoung Kang , Yun-hyeok Im
IPC分类号： H01L23/58
CPC分类号： H05K3/4641 , H01L23/66 , H01L2924/0002 , H05K1/0237 , H05K1/09 , H05K2201/0338 , H05K2201/0352 , H01L2924/00
摘要： A multi-path printed circuit board (PCB) comprising separate direct current (DC) and alternating current (AC) paths, and a power delivery system including the same are provided. The multi-path PCB comprises a plurality of planar layers, each comprising a metal layer, and a plurality of insulators interposed between the planar layers. The metal layers may have different conductivities. The power delivery system includes a power source, a semiconductor IC, and the multi-path PCB. The multi-path PCB is adapted to function as a power delivery path for delivering power from the power source to the semiconductor IC.
摘要翻译： 提供了包括单独的直流（DC）和交流（AC）路径的多路径印刷电路板（PCB），以及包括其的电力输送系统。 多路径PCB包括多个平面层，每个平面层包括金属层，以及介于平面层之间的多个绝缘体。 金属层可以具有不同的电导率。 电力输送系统包括电源，半导体IC和多路PCB。 多路径PCB适于用作将功率从电源传送到半导体IC的功率传递路径。
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