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公开(公告)号：US20170098746A1
公开(公告)日：2017-04-06
申请号：US15280438
申请日：2016-09-29
Applicant: Cree, Inc.
Inventor： Michael John Bergmann , Matthew Donofrio , Peter Scott Andrews , Colin Blakely , Troy Gould , Jack Vu
CPC classification number: H01L33/60 , H01L25/0753 , H01L25/167 , H01L33/06 , H01L33/10 , H01L33/20 , H01L33/22 , H01L33/32 , H01L33/382 , H01L33/387 , H01L33/405 , H01L33/44 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2224/14 , H01L2224/16225 , H01L2933/0041
Abstract: Flip chip LEDs incorporate multi-layer reflectors and light transmissive substrates patterned along an internal surface adjacent to semiconductor layers. A multi-layer reflector may include a metal layer and a dielectric layer containing conductive vias. Portions of a multi-layer reflector may wrap around a LED mesa including an active region, while being covered with passivation material. A substrate patterned along an internal surface together with a multi-layer reflector enables reduction of optical losses. A light transmissive fillet material proximate to edge emitting surfaces of an emitter chip may enable adequate coverage with lumiphoric material. An emitter chip may be elevated with increased thickness of solder material and/or contacts, and may reduce luminous flux loss when reflective materials are present on a submount. Methods for coating emitter chips with lumiphoric material include one or more of angled spray coating, fillet formation prior to spray coating, stencil island coating, and releasable tape coating.
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公开(公告)号：US20190074417A1
公开(公告)日：2019-03-07
申请号：US15694591
申请日：2017-09-01
Applicant: Cree, Inc.
Inventor： Peter Scott Andrews , Joseph G. Clark , Troy Gould , Erin R. F. Welch
IPC: H01L33/60 , H01L23/00 , H01L25/075
CPC classification number: H01L33/60 , H01L24/48 , H01L25/0753 , H01L33/0095 , H01L33/505 , H01L33/56 , H01L33/62 , H01L2224/48137 , H01L2924/12041 , H01L2933/0033 , H01L2933/005 , H01L2933/0058
Abstract: Light emitting diode components and devices with a wall of reflective material and having improved performance and beam angle, are provided. Reflective material provided with light emitting diode devices is configured to optimize light reflectivity by altering the composition, thickness, placement and/or angle thereof. Methods of making and assembly light emitting diode components and devices with reflective materials and improved performance, are also provided.
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公开(公告)号：US10672957B2
公开(公告)日：2020-06-02
申请号：US15654323
申请日：2017-07-19
Applicant: Cree, Inc.
Inventor： Troy Gould , Colin Kelly Blakely , Jesse Colin Reiherzer , Craig William Hardin
IPC: H01L33/54 , H01L33/00 , H01L25/075
Abstract: Light emitting diode (LED) apparatuses and methods having a high lumen output density. An example apparatus can include a substrate with one or more LEDs enclosed by an encapsulant. The encapsulant comprises beveled edges and/or top surface facets. By providing facets in the encapsulant and minimizing the chip-to-area ratio through efficient via placement, a high lumen density is achieved. Facets and bevels can be created by removing material from the encapsulant with a beveled blade.
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公开(公告)号：US20190355701A1
公开(公告)日：2019-11-21
申请号：US16525100
申请日：2019-07-29
Applicant: Cree, Inc.
Inventor： Troy Gould , Colin Kelly Blakely , Jesse Colin Reiherzer , Joseph G. Clark
Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.
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公开(公告)号：US10410997B2
公开(公告)日：2019-09-10
申请号：US15593042
申请日：2017-05-11
Applicant: Cree, Inc.
Inventor： Troy Gould , Colin Kelly Blakely , Jesse Colin Reiherzer , Joseph G. Clark
Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.
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Patent Agency Ranking
公开(公告)号：US20190027658A1
公开(公告)日：2019-01-24
申请号：US15654323
申请日：2017-07-19
Applicant: Cree, Inc.
Inventor： Troy Gould , Colin Kelly Blakely , Jesse Colin Reiherzer , Craig William Hardin
IPC: H01L33/54 , H01L25/075 , H01L23/62
Abstract: Light emitting diode (LED) apparatuses and methods having a high lumen output density. An example apparatus can include a substrate with one or more LEDs enclosed by an encapsulant. The encapsulant comprises beveled edges and/or top surface facets. By providing facets in the encapsulant and minimizing the chip-to-area ratio through efficient via placement, a high lumen density is achieved. Facets and bevels can be created by removing material from the encapsulant with a beveled blade.
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公开(公告)号：US20180331078A1
公开(公告)日：2018-11-15
申请号：US15593042
申请日：2017-05-11
Applicant: Cree, Inc.
Inventor： Troy Gould , Colin Kelly Blakely , Jesse Colin Reiherzer , Joseph G. Clark
CPC classification number: H01L25/075 , H01L33/46 , H01L33/502 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2933/0058
Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.
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公开(公告)号：US20170069606A1
公开(公告)日：2017-03-09
申请号：US15264547
申请日：2016-09-13
Applicant: Cree, Inc.
Inventor： Troy Gould , Colin Kelly Blakely , Kyle Damborsky , Jesse Colin Reiherzer
IPC: H01L25/075 , H01L33/56 , H01L33/54 , H01L33/50
Abstract: Light emitting diode (LED) devices, components and systems are provided. LED devices include a submount with a plurality of LEDs disposed thereon. The LEDs mounted on a submount can be spaced apart at predetermined dimensions to control the gaps between each of the plurality of LEDs. By controlling the gaps between LEDs the optical output from the LED device can be optimized, including improving emission and/or color uniformity, minimizing or eliminating deadspots in the light emission, and/or minimizing or eliminating an optical cross. A phosphor layer can be disposed on the plurality of LEDs and between the LEDs in the gaps therebetween.
Abstract translation: 提供发光二极管（LED）设备，组件和系统。 LED装置包括其上布置有多个LED的基座。 安装在基座上的LED可以以预定尺寸间隔开以控制多个LED中的每一个之间的间隙。 通过控制LED之间的间隙，可以优化来自LED器件的光学输出，包括改善发射和/或颜色均匀性，最小化或消除光发射中的死点，和/或最小化或消除光学十字。 磷光体层可以在它们之间的间隙中设置在多个LED上以及LED之间。
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公开(公告)号：US10991861B2
公开(公告)日：2021-04-27
申请号：US15280438
申请日：2016-09-29
Applicant: Cree, Inc.
Inventor： Michael John Bergmann , Matthew Donofrio , Peter Scott Andrews , Colin Blakely , Troy Gould , Jack Vu
IPC: H01L25/16 , H01L33/06 , H01L33/10 , H01L33/20 , H01L33/22 , H01L33/38 , H01L33/40 , H01L33/44 , H01L33/48 , H01L33/50 , H01L33/54 , H01L33/60 , H01L33/62 , H01L25/075 , H01L33/32
Abstract: Flip chip LEDs incorporate multi-layer reflectors and light transmissive substrates patterned along an internal surface adjacent to semiconductor layers. A multi-layer reflector may include a metal layer and a dielectric layer containing conductive vias. Portions of a multi-layer reflector may wrap around a LED mesa including an active region, while being covered with passivation material. A substrate patterned along an internal surface together with a multi-layer reflector enables reduction of optical losses. A light transmissive fillet material proximate to edge emitting surfaces of an emitter chip may enable adequate coverage with lumiphoric material. An emitter chip may be elevated with increased thickness of solder material and/or contacts, and may reduce luminous flux loss when reflective materials are present on a submount. Methods for coating emitter chips with lumiphoric material include one or more of angled spray coating, fillet formation prior to spray coating, stencil island coating, and releasable tape coating.
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公开(公告)号：US20210057390A1
公开(公告)日：2021-02-25
申请号：US17092939
申请日：2020-11-09
Applicant: Cree, Inc.
Inventor： Troy Gould , Colin Kelly Blakely , Jesse Colin Reiherzer , Joseph G. Clark
Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.
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