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1.发明授权
公开(公告)号：US5999901A
公开(公告)日：1999-12-07
申请号：US990045
申请日：1997-12-12
CPC分类号： H04B3/23 , H04M3/002 , H04M3/493 , G10L2021/02082 , H04M2201/40
摘要： The present invention provides a telephone network apparatus for performing speech recognition services in a telephone system in substantially real time. The apparatus uses a telephone channel signal to determine the echo delay of a telephone channel and then uses this delay to configure an echo cancellation filter for use in performing speech recognition. Use of echo delay in configuring the filter allows the echo cancellation function to be done using much less computational time than would be needed without its use, thereby granting a speech recognition unit greater access to a resident microprocessor to perform its function in substantially real time.
摘要翻译： 本发明提供一种实质上实时地在电话系统中执行语音识别服务的电话网络装置。 该装置使用电话信道信号来确定电话信道的回波延迟，然后使用该延迟来配置用于执行语音识别的回声消除滤波器。 在配置滤波器中使用回波延迟允许使用比不需要使用的更少的计算时间来完成回波消除功能，从而授予语音识别单元更大的访问驻留微处理器以基本上实时地执行其功能。
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公开(公告)号：US5761638A
公开(公告)日：1998-06-02
申请号：US406352
申请日：1995-03-17
CPC分类号： H04B3/23 , H04M3/002 , H04M3/493 , G10L2021/02082 , H04M2201/40
摘要： The present invention provides a telephone network apparatus for performing speech recognition services in a telephone system in substantially real time. The apparatus uses a telephone channel signal to determine the echo delay of a telephone channel and then uses this delay to configure an echo cancellation filter for use in performing speech recognition. Use of echo delay in configuring the filter allows the echo cancellation function to be done using much less computational time than would be needed without its use, thereby granting a speech recognition unit greater access to a resident microprocessor to perform its function in substantially real time.
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公开(公告)号：US5255346A
公开(公告)日：1993-10-19
申请号：US458158
申请日：1989-12-28
申请人： Frank H. Wu , Kalyan Ganesan
发明人： Frank H. Wu , Kalyan Ganesan
CPC分类号： G06K9/6272 , G06T9/002 , H03M7/3082 , H04N19/94
摘要： A method and apparatus for the design of a robust vector quantizer is disclosed. The initial output vector set is equal to the centroid of a training sequence of input vectors. A neural-network simulation and neighborhood functions are utilized for splitting and optimizing the output vectors. In this manner, the entire output vector set is sensitive to each input vector and therefore optimal output vector locations with respect to specified distortion criteria are obtained. The resulting vector quantizer is robust for the class of signals represented by the training sequence.
摘要翻译： 公开了一种用于设计鲁棒矢量量化器的方法和装置。 初始输出向量集合等于输入向量的训练序列的质心。 神经网络模拟和邻域函数用于分割和优化输出向量。 以这种方式，整个输出向量集合对每个输入向量敏感，因此获得关于指定的失真准则的最佳输出向量位置。 所得到的矢量量化器对于由训练序列表示的信号类是鲁棒的。
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4.发明授权Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices 失效具有U形带和共面信号迹线的单芯双面基板，以及用于封装IC器件的分割回绕（SWA）或分割通孔连接（SVC）的电源和接地层
公开(公告)号：US5825084A
公开(公告)日：1998-10-20
申请号：US795478
申请日：1997-02-11
申请人： John H. Lau , Yung Shih Chen , Tai-Yu Chou , Frank H. Wu , Kuan Luen Chen , Wei H. Koh
发明人： John H. Lau , Yung Shih Chen , Tai-Yu Chou , Frank H. Wu , Kuan Luen Chen , Wei H. Koh
IPC分类号： H01L23/498 , H01L23/50 , H01L23/12 , H01L23/28
CPC分类号： H01L23/49805 , H01L23/4985 , H01L23/50 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/1532 , H01L2924/15747
摘要： The present invention discloses a new substrate with two metal layer circuit structure and layout for semiconductor packaging. The speed and performance characteristics of the semiconductor device are optimized while the packaging structure is simplified by utilizing only one dielectric layer and conventional printed circuit board fabrication process. The difficulties encountered due to the complexities and higher cost of production required for the multiple layer and high density configuration are thus avoided. The improved circuit structure is achieved by implementing a segmented ring on one side of a substrate and a split plane on the other side thus forming a single layer substrate structure. The edges of the substrate are coated with metal layer to provide inter-layer connections. In addition to the benefits of high performance, low cost, the improved circuit structure and package layout provide flexibility allowing higher degree of freedom for selecting the location and number of input and output signal lines and connections to the ground and power planes from the semiconductor device.
摘要翻译： 本发明公开了一种具有两个金属层电路结构和半导体封装布局的新基片。 通过仅使用一个电介质层和传统的印刷电路板制造工艺简化了封装结构，优化了半导体器件的速度和性能特性。 因此避免了由于多层和高密度构造所需的复杂性和更高的生产成本而遇到的困难。 改进的电路结构通过在衬底的一侧上实现分段环并在另一侧上实现分裂平面来实现，从而形成单层衬底结构。 衬底的边缘涂有金属层以提供层间连接。 除了高性能，低成本的优点之外，改进的电路结构和封装布局提供了灵活性，允许更高的自由度来选择输入和输出信号线的位置和数量以及从半导体器件到地面和电源平面的连接 。
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