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    HIGH THROUGHPUT LOW TOPOGRAPHY COPPER CMP PROCESS
    2.
    发明申请
    HIGH THROUGHPUT LOW TOPOGRAPHY COPPER CMP PROCESS 审中-公开
    高通量低地层铜沉积工艺

    公开(公告)号：US20090057264A1

    公开(公告)日：2009-03-05

    申请号：US12201370

    申请日：2008-08-29

    申请人： DAVID H. MAI ,  Stephen Jew ,  Shih-Haur Walters Shen ,  Zhihong Wang

    发明人： DAVID H. MAI ,  Stephen Jew ,  Shih-Haur Walters Shen ,  Zhihong Wang

    IPC分类号： H01B13/00

    CPC分类号： H01L21/3212 ,  B24B37/042

    摘要： Embodiments described herein generally provide a method for processing metals disposed on a substrate in a chemical mechanical polishing system. The apparatus advantageously facilitates efficient bulk and residual conductive material removal from a substrate. In one embodiment a method for chemical mechanical polishing (CMP) of a conductive material disposed on a substrate is provided. A substrate comprising a conductive material disposed over an underlying barrier material is positioned on a first platen containing a first polishing pad. The substrate is polished on a first platen to remove a bulk portion of the conductive material. A rate quench process is performed in order to reduce a metal ion concentration in the polishing slurry. The substrate is polished on the first platen to breakthrough the conductive material exposing a portion of the underlying barrier material.

    摘要翻译： 本文描述的实施方案通常提供用于在化学机械抛光系统中处理设置在基底上的金属的方法。 该装置有利地有助于从衬底去除有效的体积和残余导电材料。 在一个实施例中，提供了一种用于设置在基板上的导电材料的化学机械抛光（CMP）的方法。 包括设置在下面阻挡材料上方的导电材料的基板被定位在包含第一抛光垫的第一压板上。 将衬底在第一压板上抛光以除去导电材料的主体部分。 进行速率骤冷处理以减少抛光浆料中的金属离子浓度。 衬底在第一压板上被抛光以穿透暴露一部分下面的阻挡材料的导电材料。

    Control Of Overpolishing Of Multiple Substrates On the Same Platen In Chemical Mechanical Polishing
    7.
    发明申请
    Control Of Overpolishing Of Multiple Substrates On the Same Platen In Chemical Mechanical Polishing 审中-公开
    在化学机械抛光相同的台板上多台基板的抛光控制

    公开(公告)号：US20140024293A1

    公开(公告)日：2014-01-23

    申请号：US13553209

    申请日：2012-07-19

    申请人： Jimin Zhang ,  Zhihong Wang ,  David H. Mai ,  Ingemar Carlsson ,  Stephen Jew ,  Boguslaw A. Swedek

    发明人： Jimin Zhang ,  Zhihong Wang ,  David H. Mai ,  Ingemar Carlsson ,  Stephen Jew ,  Boguslaw A. Swedek

    IPC分类号： B24B49/00 ,  B24B49/12 ,  B24B49/10

    CPC分类号： B24B37/013 ,  B24B49/10 ,  B24B49/12

    摘要： A polishing method includes simultaneously polishing a first substrate and a second substrate on the same polishing pad, storing a default overpolishing time, determining first and second polishing endpoint times of the first and substrates with the in-situ monitoring system, determining a difference between the first and second polishing endpoint times, and determining whether the difference exceeds a threshold. If the difference is less than the threshold, then an overpolishing stop time is calculated and polishing of the first substrate and the second substrates is halted simultaneously at the overpolishing stop time. If the difference is greater than the threshold, then first and second overpolishing stop times that equal the first and second endpoint times plus the default overpolishing time are calculated, and polishing of the first and second substrates is halted at the first and second overpolishing stop times, respectively.

    摘要翻译： 抛光方法包括同时在同一抛光垫上抛光第一基底和第二基底，存储默认的过度抛光时间，用原位监测系统确定第一和第二基底的第一和第二抛光终点时间，确定 第一和第二抛光终点时间，以及确定差异是否超过阈值。 如果差小于阈值，则计算过度抛光停止时间，并且在过度抛光停止时间同时停止第一基板和第二基板的抛光。 如果该差值大于阈值，则计算等于第一和第二终点时间加上默认过度抛光时间的第一和第二过度抛光停止时间，并且在第一和第二过度抛光停止时间停止第一和第二基板的抛光 ， 分别。

    DEVICE AND METHOD FOR PROCESSING SHORT MESSAGE SERVICE
    8.
    发明申请
    DEVICE AND METHOD FOR PROCESSING SHORT MESSAGE SERVICE 有权
    用于处理短消息服务的设备和方法

    公开(公告)号：US20120184251A1

    公开(公告)日：2012-07-19

    申请号：US13432663

    申请日：2012-03-28

    申请人： Li Feng ,  Zhihong Wang ,  Lei Shi

    发明人： Li Feng ,  Zhihong Wang ,  Lei Shi

    IPC分类号： H04W4/14 ,  H04W4/12

    CPC分类号： H04W4/14 ,  H04L67/1002 ,  H04L67/1034

    摘要： A device and a method for processing a short message service are capable of high-reliably processing a short message service. The device for processing a short message service includes a plurality of access units and a plurality of service processing units, where each of the access units is connected to the plurality of service processing units. The access unit is configured to receive the short message service and send it to one of the service processing units, and send out the processed short message service from the service processing unit . The service processing unit is configured to process the short message service, and send out the processed short message service through one of the access units.

    摘要翻译： 用于处理短消息服务的设备和方法能够高可靠地处理短消息服务。 用于处理短消息服务的设备包括多个接入单元和多个业务处理单元，其中每个接入单元连接到多个业务处理单元。 访问单元被配置为接收短消息服务并将其发送到服务处理单元之一，并从服务处理单元发出处理的短消息服务。 服务处理单元被配置为处理短消息服务，并且通过其中一个访问单元发送经处理的短消息服务。

    TECHNIQUES FOR MATCHING MEASURED SPECTRA TO REFERENCE SPECTRA FOR IN-SITU OPTICAL MONITORING
    9.
    发明申请
    TECHNIQUES FOR MATCHING MEASURED SPECTRA TO REFERENCE SPECTRA FOR IN-SITU OPTICAL MONITORING 审中-公开
    将测量光谱匹配到用于现场光学监测的参考光谱的技术

    公开(公告)号：US20120034845A1

    公开(公告)日：2012-02-09

    申请号：US13198635

    申请日：2011-08-04

    申请人： Xiaoyuan Hu ,  Zhihong Wang ,  Harry Q. Lee ,  Zhize Zhu ,  Jeffrey Drue David ,  Dominic J. Benvegnu ,  Jimin Zhang ,  Wen-Chiang Tu

    发明人： Xiaoyuan Hu ,  Zhihong Wang ,  Harry Q. Lee ,  Zhize Zhu ,  Jeffrey Drue David ,  Dominic J. Benvegnu ,  Jimin Zhang ,  Wen-Chiang Tu

    IPC分类号： B24B49/00 ,  B24B51/00

    CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B37/107 ,  B24B37/205 ,  B24B49/045 ,  B24B49/12

    摘要： A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum.

    摘要翻译： 控制抛光的方法包括：存储具有多个参考光谱的库，抛光衬底，在抛光期间测量来自衬底的光的光谱序列，对于光谱序列的每个测量光谱，使用 除了平方差的和以产生最佳匹配参考光谱的序列之外的匹配技术，以及基于最佳匹配参考光谱的序列来确定抛光终点或抛光速率的调整中的至少一个。 找到最佳匹配的参考光谱可以包括执行所测量的光谱与来自文库的多个参考光谱中的两个或更多个的互相关，并且选择与所测量的光谱具有最大相关性的参考光谱作为最佳匹配参考 光谱。

    SPECTROGRAPHIC MONITORING USING INDEX TRACKING AFTER DETECTION OF LAYER CLEARING
    10.
    发明申请
    SPECTROGRAPHIC MONITORING USING INDEX TRACKING AFTER DETECTION OF LAYER CLEARING 审中-公开
    检测层清除后使用索引跟踪进行光谱监测

    公开(公告)号：US20120034844A1

    公开(公告)日：2012-02-09

    申请号：US12851467

    申请日：2010-08-05

    申请人： Jimin Zhang ,  Zhihong Wang ,  Harry Q. Lee ,  Wen-Chiang Tu

    发明人： Jimin Zhang ,  Zhihong Wang ,  Harry Q. Lee ,  Wen-Chiang Tu

    IPC分类号： B24B49/12

    CPC分类号： B24B37/042 ,  B24B37/013 ,  B24B49/12

    摘要： A method of controlling polishing includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, polishing a substrate having a second layer overlying a first layer, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, detecting exposure of the first layer, fitting a function to a portion of the sequence of index values corresponding to spectra measured after detection of exposure of the first layer, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the function.

    摘要翻译： 控制抛光的方法包括存储具有多个参考光谱的库，多个参考光谱的每个参考光谱具有存储的相关索引值，抛光具有覆盖第一层的第二层的衬底，测量第 对于光谱序列的每个测量光谱，找到最佳匹配参考光谱以产生最佳匹配参考光谱序列，从最佳匹配参考序列确定每个最佳匹配光谱的相关索引值 光谱以产生索引值序列，检测第一层的曝光，将功能拟合到对应于在检测到第一层的曝光之后测量的光谱的索引值序列的一部分，以及确定抛光终点中的至少一个 或基于该功能的抛光速率的调整。