公开(公告)号：US20180294076A1

公开(公告)日：2018-10-11

申请号：US15480611

申请日：2017-04-06

Applicant: DELL PRODUCTS, L.P.

Inventor： SANDOR FARKAS ,  BHYRAV M. MUTNURY

IPC: H01B11/18 ,  H05K1/11 ,  H01B7/02 ,  H01B11/00

CPC classification number: H05K1/112 ,  H01R12/62 ,  H01R43/0256 ,  H05K1/0219 ,  H05K1/0245 ,  H05K1/0298 ,  H05K3/3405 ,  H05K2201/09145 ,  H05K2201/10356

Abstract: A cable assembly includes a printed circuit board having a first surface and a second surface. A first post and a second post extend from one side of the printed circuit board. A first signal pad, a second signal pad, and a first ground pad are each coupled to the first surface. A first cable has a first signal wire at least partially covered by a first insulator and a second signal wire at least partially covered by a second insulator. The first cable further has a first ground shield at least partially covering the first and second insulators. A first end of a first cable is mounted between the first and second posts. A conductive attachment couples the first ground shield to the first ground pad.

公开(公告)号：US20190053378A1

公开(公告)日：2019-02-14

申请号：US16160622

申请日：2018-10-15

Applicant: DELL PRODUCTS, L.P.

Inventor： KEVIN W. MUNDT ,  SANDOR FARKAS ,  BHYRAV M. MUTNURY ,  YESHASWY RAJUPALEPU

IPC: H05K1/18 ,  H01L23/498 ,  H01L21/48 ,  H05K3/40 ,  H05K1/11

Abstract: An information handling system (IHS) has a circuit board assembly with a dual-sided interposer substrate that is inserted between a baseboard and a processor integrated circuit having a second pattern of electrical contacts. The dual interposer substrate formed of a stack of printed circuit boards (PCBs) provides communication channels between a first coupling pad on the baseboard that has a first pattern of electrical contacts and a second coupling pad on top of the dual interposer substrate that provides the second pattern of electrical contacts. The second pattern receives another type of processor integrated circuit than a type supported by the first pattern. Stacked vias formed through the stack of PCBs electrically connect respective electrical contacts of the first and second coupling pads to form a corresponding communication channel. One or more grounded vias mitigate signal integrity (SI) anomalies on the communication channels.

公开(公告)号：US20180288876A1

公开(公告)日：2018-10-04

申请号：US15474945

申请日：2017-03-30

Applicant: DELL PRODUCTS, L.P.

Inventor： KEVIN W. MUNDT ,  SANDOR FARKAS ,  BHYRAV M. MUTNURY ,  YESHASWY RAJUPALEPU

IPC: H05K1/18 ,  H01R12/70 ,  H05K1/11 ,  H05K3/40 ,  H01L23/498 ,  H01L21/48

CPC classification number: H05K1/181 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01R12/7076 ,  H05K1/111 ,  H05K3/4007 ,  H05K2201/10378 ,  H05K2201/10704 ,  H05K2201/10734

Abstract: An information handling system (IHS) has a circuit board assembly with a dual-sided interposer substrate that is inserted between a baseboard and a processor integrated circuit having a second pattern of electrical contacts. The dual interposer substrate formed of a stack of printed circuit boards (PCBs) provides communication channels between a first coupling pad on the baseboard that has a first pattern of electrical contacts and a second coupling pad on top of the dual interposer substrate that provides the second pattern of electrical contacts. The second pattern receives another type of processor integrated circuit than a type supported by the first pattern. Stacked vias formed through the stack of PCBs electrically connect respective electrical contacts of the first and second coupling pads to form a corresponding communication channel. One or more grounded vias mitigate signal integrity (SI) anomalies on the communication channels.

公开(公告)号：US20160247526A1

公开(公告)日：2016-08-25

申请号：US15146865

申请日：2016-05-04

Applicant: DELL PRODUCTS, L.P.

Inventor： SANDOR FARKAS ,  SYED S. AHMED

IPC: G11B5/55 ,  G11B19/04

CPC classification number: G11B5/5582 ,  G11B17/228 ,  G11B19/042

Abstract: A method implemented in a storage system that has moveable storage devices includes a motion controller receiving movement related data of a storage device from at least one sensor associated with the storage device. In response to the received movement related data indicating at least one pre-identified condition, a park command is issued that triggers the reading head of the storage device to enter a parked state in which the storage device is protected from damage that can occur due to motion of the reading head while the pre-identified condition exists.