公开(公告)号：US20170162469A1

公开(公告)日：2017-06-08

申请号：US15115955

申请日：2015-02-02

Applicant: DENKA COMPANY LIMITED

Inventor： Motonori KINO ,  Hideki HIROTSURU ,  Takeshi MIYAKAWA

IPC: H01L23/373 ,  B23P15/26 ,  H01L21/48

CPC classification number: H01L23/3738 ,  B23P15/26 ,  B23P2700/10 ,  H01L21/4871 ,  H01L23/367 ,  H01L23/3731 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2924/0002 ,  H01L2924/00

Abstract: [Problem] To inexpensively provide a heat dissipating component that has thermal conductivity, as well as a low specific gravity, and a coefficient of thermal expansion close to that of a ceramic substrate, and furthermore having warpage so as to be able to be joined with good closeness of contact to a heat dissipating component or the like. [Solution] A silicon carbide composite which is a plate-shaped composite formed by impregnation of a porous silicon carbide molded article by a metal having aluminum as a main component, wherein the amount of warpage with respect to 10 cm of length of the main surface of the composite is 250 μm or less, and the amount of warpage of a power module using the plate-shaped composite is 250 μm or less; and a heat dissipating component using the same.

公开(公告)号：US20170092560A1

公开(公告)日：2017-03-30

申请号：US15311268

申请日：2015-05-26

Applicant: DENKA COMPANY LIMITED

Inventor： Takeshi MIYAKAWA ,  Motonori KINO ,  Yosuke ISHIHARA

IPC: H01L23/373 ,  B23K35/30 ,  H01L21/48 ,  B22F1/02 ,  B22F1/00 ,  H01L23/367 ,  B23K1/00 ,  B23K35/36

CPC classification number: H01L23/3737 ,  B22F1/0011 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/02 ,  B22F7/064 ,  B22F2301/255 ,  B22F2302/25 ,  B23K1/0016 ,  B23K35/3006 ,  B23K35/3602 ,  C22C5/06 ,  C22C5/08 ,  C22C26/00 ,  C22C30/02 ,  C22C30/06 ,  H01L21/4882 ,  H01L23/047 ,  H01L23/10 ,  H01L23/367 ,  H01L23/373 ,  H01L23/3732 ,  H01L23/3736 ,  H01L23/40 ,  H01L2924/16195

Abstract: A semiconductor package having, stacked in the following order, a heat dissipating member, a joining layer and an insulation member, wherein the heat dissipating member has an aluminum-diamond composite containing diamond grains and a metal containing aluminum; and the joining layer that joins the heat dissipating member and the insulation member is formed using a composite material having silver oxide fine particles or organic-coated silver fine particles having an average particle size of at least 1 nm and at most 100 μm.

公开(公告)号：US20170236767A1

公开(公告)日：2017-08-17

申请号：US15500210

申请日：2015-07-29

Applicant: DENKA COMPANY LIMITED

Inventor： Takeshi MIYAKAWA ,  Motonori KINO ,  Hideki HIROTSURU

IPC: H01L23/373 ,  B22D19/00 ,  B22D18/02 ,  B22D17/00 ,  B32B9/00 ,  H05K1/02 ,  B32B9/04 ,  B32B15/20 ,  B21J5/00 ,  B21J1/00 ,  H01L23/367 ,  B22D21/00 ,  B32B3/26

Abstract: An aluminum-silicon carbide composite including flat-plate-shaped composited portion containing silicon carbide and an aluminum alloy, and aluminum layers containing an aluminum alloy provided on both plate surfaces of composited portion, wherein circuit board is mounted on one plate surface and the other plate surface is used as heat-dissipating surface, wherein: the heat-dissipating-surface-side plate surface of the composited portion has a convex curved shape; the heat-dissipating-surface-side aluminum layer has a convex curved shape; ratio (Ax/B) between the average (Ax) of the thicknesses at the centers on opposing short sides of outer peripheral surfaces and thickness (B) at central portions of the plate surfaces satisfies the relationship: 0.91≦Ax/B≦1.00; and a ratio (Ay/B) between the average (Ay) of the thicknesses at the centers on opposing long sides of outer peripheral surfaces and thickness (B) at central portions of the plate surfaces satisfies the relationship: 0.94≦Ay/B≦1.00 and production method therefor.

公开(公告)号：US20170142859A1

公开(公告)日：2017-05-18

申请号：US15322494

申请日：2015-07-03

Applicant: DENKA COMPANY LIMITED

Inventor： Takeshi MIYAKAWA ,  Motonori KINO

IPC: H05K7/20 ,  C22C21/02 ,  C09K5/14 ,  B22D19/14 ,  C04B41/51 ,  C04B41/00 ,  C22C21/08 ,  B22D21/00

CPC classification number: H05K7/209 ,  B22D19/00 ,  B22D19/14 ,  B22D21/007 ,  C04B41/009 ,  C04B41/5155 ,  C09K5/14 ,  C22C21/02 ,  C22C21/08 ,  H01L23/3733 ,  H01L23/4006

Abstract: A heat-dissipating component, and a method for manufacturing the same, the component provided with a composited portion including a plate-shaped molded body containing silicon carbide, and hole-formation portions formed in a peripheral edge portion of the composited portion; through-holes being formed in the hole formation sections; the hole-formation portions containing inorganic fibers; the molded body and the inorganic fibers being impregnated with an aluminum-containing metal; and the hole-formation portions forming a part of the outer peripheral surface of the heat-dissipating component.