公开(公告)号：US20160211193A1

公开(公告)日：2016-07-21

申请号：US14914580

申请日：2014-08-28

Applicant: DENSO CORPORATION

Inventor： Yasuhiro MIZUNO ,  Isao TAMADA ,  Tomohiro SHIMAZU ,  Hiroshi HAMADA ,  Yuusuke TAKAGI ,  Eiji NAKAGAWA

IPC: H01L23/473 ,  H01L25/11 ,  F28F9/26 ,  H01L23/367 ,  H01L23/40 ,  F28F3/08 ,  H01L25/07 ,  H01L25/18

CPC classification number: H01L23/473 ,  F28D1/0333 ,  F28D1/05308 ,  F28D1/05358 ,  F28F3/086 ,  F28F9/0075 ,  F28F9/0131 ,  F28F9/26 ,  F28F2225/04 ,  H01L23/3675 ,  H01L23/40 ,  H01L25/07 ,  H01L25/074 ,  H01L25/117 ,  H01L25/18 ,  H01L2924/0002 ,  H05K7/20927 ,  H01L2924/00

Abstract: A stacked cooler includes flow pipes that are stacked, each of the flow pipes having a flat shape and including a medium passage in which a heat medium flows, a heat exchange object that is disposed between each adjacent two of the flow pipes and is clamped between their flat planes, a protruding pipe part that is connected to at least one of the flow pipes and protrudes in a stacking direction of the flow pipes, and a load restraining part that restrains a load applied to a connection portion of the at least one of the flow pipes to the protruding pipe part as compared with a load applied to the other portion of the at least one of the flow pipes.

Abstract translation: 堆叠冷却器包括堆叠的流动管道，每个流动管道具有扁平形状并且包括热介质流动的介质通道，设置在每个相邻的两个流动管道之间并被夹在 它们的平面，连接到至少一个流动管道并沿着流动管道的堆叠方向突出的突出管部分，以及限制施加到流体管的至少一个的连接部分的负载的负载限制部分 与施加到所述至少一个流动管道的另一部分的负载相比，到所述突出管部分的流动管道。

公开(公告)号：US20180130721A1

公开(公告)日：2018-05-10

申请号：US15866853

申请日：2018-01-10

Applicant: DENSO CORPORATION

Inventor： Yasuhiro MIZUNO ,  Isao TAMADA ,  Tomohiro SHIMAZU ,  Hiroshi HAMADA ,  Yuusuke TAKAGI ,  Eiji NAKAGAWA

IPC: H01L23/473 ,  H01L23/367 ,  H01L25/11 ,  H01L25/07 ,  H01L23/40 ,  F28F9/26 ,  F28F3/08 ,  H01L25/18

CPC classification number: H01L23/473 ,  F28D1/0333 ,  F28D1/05308 ,  F28D1/05358 ,  F28F3/086 ,  F28F9/0075 ,  F28F9/0131 ,  F28F9/26 ,  F28F2225/04 ,  H01L23/3675 ,  H01L23/40 ,  H01L25/07 ,  H01L25/074 ,  H01L25/117 ,  H01L25/18 ,  H01L2924/0002 ,  H05K7/20927 ,  H01L2924/00

Abstract: A stacked cooler includes flow pipes that are stacked, each of the flow pipes having a flat shape and including a medium passage in which a heat medium flows, a heat exchange object that is disposed between each adjacent two of the flow pipes and is clamped between their flat planes, a protruding pipe part that is connected to at least one of the flow pipes and protrudes in a stacking direction of the flow pipes, and a load restraining part that restrains a load applied to a connection portion of the at least one of the flow pipes to the protruding pipe part as compared with a load applied to the other portion of the at least one of the flow pipes.

公开(公告)号：US20160079145A1

公开(公告)日：2016-03-17

申请号：US14852909

申请日：2015-09-14

Applicant: DENSO CORPORATION

Inventor： Eiji NAKAGAWA

IPC: H01L23/40 ,  H01L23/473

CPC classification number: H01L23/4012 ,  G06F1/20 ,  H01L23/40 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/473 ,  H01L23/481 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electric power converter includes a laminated semiconductor unit, a beam member that supports the laminated semiconductor unit from a rear end in a laminating direction, a frame, and a plurality of pressing plates. The frame that accommodates the laminated semiconductor unit, and has an insertion opening in a rear thereof in the laminating direction into which the laminated semiconductor unit can be inserted. The plurality of pressing plates are accommodated between a front wall portion of the frame and the laminated semiconductor unit, and the pressing plates press the laminated semiconductor unit in a direction from the front toward the rear. The plurality of pressing plates are laminated in the laminating direction with each other, and are compressed and elastically deformed in the laminating direction. The beam member is fixed to the frame.

Abstract translation: 电力转换器包括层叠半导体单元，从层叠方向的后端支撑层叠半导体单元的梁构件，框架和多个按压板。 容纳层叠半导体单元的框架，并且在层叠半导体单元能够插入的层叠方向上在其后方具有插入开口。 多个按压板容纳在框架的前壁部分和层叠半导体单元之间，并且压板在从前向后的方向上按压层压半导体单元。 多个按压板在层叠方向上层叠，并且在层叠方向上被压缩并弹性变形。 梁构件固定在框架上。