公开(公告)号：US20150090862A1

公开(公告)日：2015-04-02

申请号：US14498164

申请日：2014-09-26

Applicant: DENSO CORPORATION

Inventor： Takayuki MATSUI ,  Hisayoshi FUJIKAWA ,  Hideo IIZUKA ,  Hiroyuki WADO ,  Shuichi YAMASHITA

IPC: G02B3/00 ,  B29D11/00 ,  H01L27/146 ,  G02B1/00 ,  G02B13/14

Abstract: A lens reflecting a light of a predetermined wavelength, or transmitting and condensing or diverging the light is provided. The lens includes a substrate, and a quasi-periodic structure layer. A plane of the quasi-periodic structure layer is divided into unit cells and is filled with the unit cells in a two-dimensional period. The unit cell has a first region and a second region. An occupancy rate is changed as a distance from a center of the substrate. A resonance mode is defined by a relationship between the occupancy rate and the period length. A lowest order resonance mode is defined by the resonance mode. The period length is set to a predetermined value within a predetermined range including an optimum value. Another lens is provided. A minimum occupancy rate is defined by a smallest occupancy rate. A variation range of the occupancy rate changes across the minimum occupancy rate.

Abstract translation: 提供了反射预定波长的光，或透射和冷凝或发散光的透镜。 透镜包括基底和准周期性结构层。 准周期结构层的平面被划分为单位单元，并在二维周期内填充单位单元。 单元电池具有第一区域和第二区域。 占据率从衬底中心的距离变化。 谐振模式由占用率和周期长度之间的关系来定义。 最低阶谐振模式由谐振模式定义。 周期长度被设定在包括最佳值的预定范围内的预定值。 提供另一个镜头。 最低入住率由最小的入住率定义。 入住率的变化范围在最小入住率之间变化。

公开(公告)号：US20140015120A1

公开(公告)日：2014-01-16

申请号：US14024917

申请日：2013-09-12

Applicant: DENSO CORPORATION

Inventor： Kuniaki MAMITSU ,  Takahisa KANEKO ,  Masaya TONOMOTO ,  Masayoshi NISHIHATA ,  Hiroyuki WADO ,  Chikage NORITAKE ,  Eiji NOMURA ,  Toshiki ITOH

IPC: H01L23/473

CPC classification number: H01L23/473 ,  H01L23/3672 ,  H01L23/3736 ,  H01L23/427 ,  H01L23/4334 ,  H01L23/46 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/06181 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1517 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract translation: 半导体器件包括封装和冷却器。 半导体封装包括半导体元件，金属构件和用于封装半导体元件和金属构件的模制构件。 金属构件具有热连接到半导体元件的金属部分，金属部分上的绝缘层和绝缘层上的导电层。 导电层至少部分地暴露在模制构件的外部，并且用作用于辐射半导体元件的热的辐射表面。 冷却器具有冷却剂通道，冷却剂通过该通道冷却导电层。 导电层和冷却器电连接在一起。

公开(公告)号：US20140361425A1

公开(公告)日：2014-12-11

申请号：US14469698

申请日：2014-08-27

Applicant: DENSO CORPORATION

Inventor： Kuniaki MAMITSU ,  Takahisa KANEKO ,  Masaya TONOMOTO ,  Masayoshi NISHIHATA ,  Hiroyuki WADO ,  Chikage NORITAKE ,  Eiji NOMURA ,  Toshiki ITOH

IPC: H01L23/427 ,  H01L23/367

CPC classification number: H01L23/473 ,  H01L23/3672 ,  H01L23/3736 ,  H01L23/427 ,  H01L23/4334 ,  H01L23/46 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/06181 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1517 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

公开(公告)号：US20150036200A1

公开(公告)日：2015-02-05

申请号：US14327890

申请日：2014-07-10

Applicant: DENSO CORPORATION ,  National University Corporation TOYOHASHI UNIVERSITY OF TECHNOLOGY

Inventor： Noriyuki MATSUSHITA ,  Hiroyuki WADO ,  Makoto ISHIDA ,  Daisuke AKAI

IPC: G02B26/08 ,  H01L41/187 ,  H01L41/297 ,  H01L41/08 ,  G02B26/10

CPC classification number: H01L41/1876 ,  G02B6/3578 ,  G02B26/0858 ,  G02F2001/294 ,  H01L41/0478 ,  H01L41/081 ,  H01L41/0815 ,  H01L41/29 ,  H01L41/297 ,  H01L41/316 ,  H01L41/318 ,  H01L41/319 ,  Y10T29/42

Abstract: A piezoelectric element includes a substrate having a first surface with a predetermined orientation; a lower electrode layered on the first surface of the substrate; a piezoelectric thin film layered on the lower electrode and having a piezoelectric body; and an upper electrode layered on the piezoelectric thin film. A voltage is to be impressed between the lower electrode and the upper electrode to deform the piezoelectric thin film. The piezoelectric thin film is epitaxially grown on the lower electrode using a physical vapor deposition or a chemical vapor deposition.

Abstract translation: 压电元件包括​​具有预定取向的第一表面的基板; 在所述基板的第一表面上分层的下电极; 压电薄膜层叠在下电极上并具有压电体; 以及层叠在压电薄膜上的上电极。 在下电极和上电极之间施加电压以使压电薄膜变形。 使用物理气相沉积或化学气相沉积在下电极上外延生长压电薄膜。

公开(公告)号：US20130335748A1

公开(公告)日：2013-12-19

申请号：US13915830

申请日：2013-06-12

Applicant: Denso Corporation

Inventor： Tomoki TANEMURA ,  Shuichi YAMASHITA ,  Hiroyuki WADO ,  Yukihiro TAKEUCHI

IPC: G01B9/02

CPC classification number: G01B9/02 ,  G01B9/02023

Abstract: A Fabry-Perot interferometer includes an input mirror and an output mirror arranged facing the input mirror via a gap. Each mirror includes a pair of high-refractive layers and a space layer arranged selectively between the high-refractive layers. At least one of an input-side bridge part and an output-side bridge part arranged crossing the gap, is movable as a membrane. Each bridge part includes a transmission portion and a periphery portion. Each transmission portions includes a mirror element in which the space layer is sandwiched by the pair of high-refractive layers. In a second direction perpendicular to the first direction, the mirror element of the input mirror has a width larger than seven times of a maximum wavelength of a transmission light output from the output mirror, and functions as a diffraction restriction mirror.

Abstract translation: 法布里 - 珀罗干涉仪包括经由间隙面向输入反射镜布置的输入反射镜和输出反射镜。 每个反射镜包括一对高折射层和选择性地布置在高折射层之间的空间层。 布置在间隙上的输入侧桥接部分和输出侧桥接部分中的至少一个可以作为膜移动。 每个桥接部分包括传动部分和周边部分。 每个透射部分包括其中空间层被一对高折射层夹在其中的反射镜元件。 在垂直于第一方向的第二方向上，输入反射镜的反射镜元件的宽度大于从输出镜输出的透射光的最大波长的七倍，并且用作衍射限制镜。

公开(公告)号：US20140320943A1

公开(公告)日：2014-10-30

申请号：US14258130

申请日：2014-04-22

Applicant: DENSO CORPORATION

Inventor： Koichi OYAMA ,  Hideaki NISHIKAWA ,  Akio TSUGE ,  Kenichi SAKAI ,  Hiroyuki WADO

IPC: G02B26/08

CPC classification number: G02B26/0858 ,  B81B3/0043 ,  B81B2201/042 ,  B81B2203/0154

Abstract: An optical scanning device has a reflecting portion and a supporting body for supporting the reflecting portion. The reflecting portion has a reflecting surface for reflecting light beam. A pair of outside beam members is arranged between the reflecting portion and the supporting body in a longitudinal direction of the device. The device also has a first driving portion, one end of which is connected to the supporting body, while the other end of which is connected to a driving point of the reflecting portion. When the first driving portion is inflected, the reflecting portion is oscillated in a twisting vibration manner at a first axis. The driving point of the reflecting portion is located at a position separated from the first axis.

Abstract translation: 光学扫描装置具有反射部分和用于支撑反射部分的支撑体。 反射部具有用于反射光束的反射面。 一对外梁构件沿着装置的纵向方向布置在反射部分和支撑体之间。 该装置还具有第一驱动部分，其一端连接到支撑体，而另一端连接到反射部分的驱动点。 当第一驱动部分弯曲时，反射部分以第一轴线的扭转振动方式摆动。 反射部的驱动点位于与第一轴分离的位置。

公开(公告)号：US20140203426A1

公开(公告)日：2014-07-24

申请号：US14220277

申请日：2014-03-20

Applicant: DENSO CORPORATION

Inventor： Kuniaki MAMITSU ,  Takahisa KANEKO ,  Masaya TONOMOTO ,  Masayoshi NISHIHATA ,  Hiroyuki WADO ,  Chikage NORITAKE ,  Eiji NOMURA ,  Toshiki ITOH

IPC: H01L23/473

CPC classification number: H01L23/473 ,  H01L23/3672 ,  H01L23/3736 ,  H01L23/427 ,  H01L23/4334 ,  H01L23/46 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/06181 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1517 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

公开(公告)号：US20130320214A1

公开(公告)日：2013-12-05

申请号：US13905268

申请日：2013-05-30

Applicant: DENSO CORPORATION

Inventor： Shuichi YAMASHITA ,  Hiroyuki WADO ,  Takayuki MATSUI ,  Atsushi MIURA

IPC: G01N21/27

CPC classification number: G01N21/27 ,  G01N21/0303 ,  G01N21/3577

Abstract: A liquid component sensor includes: an infrared light source; a detection cell including: two substrates made of material for penetrating an infrared light therethrough and stacked each other; a passage for flowing liquid arranged between facing surfaces of the substrates; and a detection portion for detecting the liquid provided by at least a part of the passage; a spectrometer for dispersing light penetrating the detection cell; and a light detector for detecting dispersed light. Each substrate includes outside and facing surfaces, so that two substrates provide four surfaces totally. The detection cell further includes a filter for passing the infrared light having a predetermined wavelength selectively. The filter is disposed on at least one of four surfaces at a predetermined position, which corresponds to at least the detection portion.

Abstract translation: 液体成分传感器包括：红外光源; 检测单元，包括：由穿过其中并且彼此堆叠的红外光的材料制成的两个基板; 用于流动液体的通道，其布置在所述基板的相对表面之间; 以及用于检测由所述通道的至少一部分提供的液体的检测部分; 用于分散穿透检测单元的光的光谱仪; 以及用于检测分散光的光检测器。 每个基板包括外部和面对的表面，使得两个基板完全提供四个表面。 检测单元还包括用于选择性地使具有预定波长的红外光通过的滤波器。 过滤器设置在至少对应于检测部分的预定位置处的四个表面中的至少一个表面上。