Abstract:
The disclosure aims at providing an antenna array for 5G communications that has superior thermal dissipation and crosstalk suppression effect. To achieve the above-described object, an antenna array 1 for 5G communications according to the disclosure includes a substrate 10; at least one high-frequency semiconductor device 20, a noise-suppressing thermally conductive sheet 20, and a first thermal dissipation member 41 sequentially formed on one surface 10a of the substrate 10; and at least one antenna 50 and a second thermal dissipation member 42 sequentially formed on the other surface 10b of the substrate 10.
Abstract:
Provided is a coil module which is reduced in size and made slimmer by incorporating a material and structure resistant to magnetic saturation. The coil module has: a magnetic resin layer containing magnetic particles; and a spiral coil, wherein the magnetic resin layer contains magnetic particles having a spherical shape or a spheroid shape having a dimensional ratio of not more than 6, the dimensional ratio being expressed as a ratio of the major diameter to the minor diameter.
Abstract:
An invented antenna device includes a spiral coil having terminal wires extending from an inner periphery side thereof and from an outer periphery side thereof, a magnetic layer supporting the spiral coil and being formed with a cutoff portion extending from an inner periphery side thereof to an outer periphery side thereof, and a circuit board having a pair of terminal portions for connecting to the terminal wire and a connecting terminal for connecting an external circuit. The circuit board is placed in the cutoff portion, and the terminal wire extending from the inner periphery side of the spiral coil is coupled to the terminal portion located on an inner periphery side of the circuit board whereas the terminal wire extending from the outer periphery side of the spiral coil is coupled to the terminal portion located on an outer periphery side of the circuit board.
Abstract:
An antenna device according to the invention includes a spiral coil, a magnetic layer supporting the spiral coil and including a recess or a through hole for containing an extension from an inner periphery of the spiral coil, and a circuit board having a plurality of conducting patterns and being formed with a first terminal connecting the spiral coil to the conducting patterns and with a second terminal connecting the conducting patterns to an external circuit. The magnetic layer has at least a part of the circuit board inside. This invented antenna device is formed in a thinner size.
Abstract:
An antenna device incorporated in an electronic apparatus to communicate with an external apparatus via an electromagnetic field signal includes a first conductor provided inside a housing of the electronic apparatus and opposing the external apparatus, a loop antenna having an antenna coil conductively coupled to the external apparatus and coiling thereon, a sheet-like second conductor provided as being spaced with a predetermined space from the first conductor and partially overlapping or making contact with a surface of the loop antenna opposite to a surface opposing the external apparatus, and a sheet-like third conductor provided between the first conductor and the second conductor and having one end overlapping or making contact with the first conductor and other end partially overlapping or making contact with the second conductor.
Abstract:
An electronic device incorporated with a coil module that achieves favorable communication characteristics is provided. In an electronic device incorporated with a coil module, the coil module includes a loop coil wounded in a planar shape and a sheet-shaped magnetic sheet which is formed of a magnetic material and which overlaps with a part of the loop coil, and the magnetic sheet is arranged on at least one side extending from a center of the loop coil.
Abstract:
Provided is a semiconductor device having excellent heat transferring performance and electromagnetic wave suppression effect. A semiconductor device 1 comprises: a semiconductor element 30 formed on a substrate 50; a conductive shield can 20 having an opening 21, covering at least a part of the semiconductor element 30, and connected to a ground 60; a cooling member 40 located above the conductive shield can 20; and an electromagnetic wave absorbing thermal conductive sheet 10 formed between the semiconductor element 30 and the cooling member 40 at least through the opening 21 of the conductive shield can 20.
Abstract:
Provided is a heat conductive sheet having an excellent electromagnetic wave suppressing effect in addition to excellent thermal conductivity. A heat conductive sheet 1 includes a heat conductive sheet body 10 containing a binder resin 11 and fibrous heat conductive fillers 12, and a low permittivity partition member 20 which has a lower dielectric constant than the heat conductive sheet body 10 and separates at least part of the heat conductive sheet body 10.
Abstract:
Disclosed is an electromagnetic wave absorbing heat conductive sheet having superior heat conductivity and electromagnetic wave absorbency. The electromagnetic wave absorbing heat conductive sheet comprises a polymer matrix component; a magnetic metal power; and a fibrous heat conductive filler oriented in one direction.
Abstract:
Provided is a wireless communication system which has excellent communication characteristics even between antenna modules having antenna coils between which there is a large difference in outside diameter. The wireless communication system includes: a first antenna module including a first antenna coil; and a second antenna module including a second antenna coil and capable of communication by receiving a magnetic field transmitted from the first antenna module, in which the first antenna coil and the second antenna coil have mutually different outside diameters, and, out of the first antenna coil and the second antenna coil, the antenna coil having a larger outside diameter is formed in such a way that the area of an opening portion inside the innermost perimeter of an antenna pattern is not more than 120% of the outside diameter area of the other antenna coil having a smaller outside diameter.