摘要:
The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition, dielectric inorganic fine particles having a specific dielectric constant of greater than or equal to 10, and fine particles having a specific dielectric constant of less than 10.
摘要:
The present invention relates to microparticles comprising: at least one type of a platinum-based catalyst; and a thermoplastic polyolefin resin with a Z-average (Mz) of a weight average molecular weight (Mw) of at least 2500 and Mz/Mw of not more than 2.0, wherein the platinum-based catalyst is dispersed in the thermoplastic polyolefin resin. The microparticles make it possible to obtain a one-component curable organopolysiloxane composition having characteristics such as excellent storage stability.
摘要:
The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition, dielectric inorganic fine particles having a specific dielectric constant of greater than or equal to 10, and fine particles having a specific dielectric constant of less than 10.
摘要:
An adhesion promoter that can achieve excellent initial adhesion improvement effects towards various types of substrates, a curable organopolysiloxane composition containing the adhesion promoter, and a protective agent or adhesive composition for electric and electronic components, are provided. The adhesion promoter comprises the following components (A) to (C) in a specific weight ratio: (A) a reaction mixture of an organoalkoxysilane having an amino group and an organoalkoxysilane having an epoxy group; (B) an organic compound having at least two alkoxysilyl groups in a molecule and having a bond other than a silicone-oxygen bond between these silyl groups; and (C) a silane containing an epoxy group or a partially hydrolyzed condensate thereof.
摘要:
A curable organopolysiloxane composition that can achieve excellent initial adhesion improvement effects towards various types of substrates, and a protective agent or adhesive composition for electric and electronic components, are provided. The curable organopolysiloxane composition comprises (A) either i) (a1) an organopolysiloxane having a specific alkoxysilyl-containing group and at least an average of 0.5 alkenyl groups, or ii) a mixture of (a1) and (a2) an organopolysiloxane that has at least two alkenyl groups in a molecule, and that does not have the aforementioned group having an alkoxysilyl group. In the mixture, the amount of component (a1) is 10 to less than 100 mass %. The curable organopolysiloxane composition further comprises (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in each molecule, (C) a catalyst for a hydrosilylation reaction, and (D) a catalyst for a condensation reaction.
摘要:
A curable silicone composition comprises at least (A) an organopolysiloxane having at least two alkenyl groups in a molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (C) a hydrosilylation reaction catalyst, (D) an approximately spherical silica fine powder having an average particle diameter of 50 μm or less and (E) glass fibers having an average fiber length of 1,000 μm or less and an average fiber diameter of 30 μm or less. A cured product produced by curing the curable silicone composition is also disclosed.
摘要:
A curable silicone composition comprises at least (A) an organopolysiloxane having at least two alkenyl groups in a molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (C) a hydrosilylation reaction catalyst, (D) an approximately spherical silica fine powder having an average particle diameter of 50 μm or less and (E) glass fibers having an average fiber length of 1,000 μm or less and an average fiber diameter of 30 μm or less. A cured product produced by curing the curable silicone composition is also disclosed.
摘要:
Disclosed is a curable organopolysiloxane composition, comprising: (A) a curing reactive organopolysiloxane component formed by curing or semi-curing and reacting at least two or more types of organopolysiloxanes in the presence of one or more types of catalysts; and (B) a peroxide. The composition is a non-fluid at 25° C., and the melt viscosity at 100° C. is 8000 Pa·s or lower. A sealing agent comprising the curable organopolysiloxane composition and a cured product of the curable organopolysiloxane composition are also disclosed, along with a method of molding a cured product and a semiconductor device comprising the cured product.
摘要:
The present invention relates to microparticles comprising: at least one type of a platinum-based catalyst; and a thermoplastic polyolefin resin with a Z-average (Mz) of a weight average molecular weight (Mw) of at least 2500 and Mz/Mw of not more than 2.0, wherein the platinum-based catalyst is dispersed in the thermoplastic polyolefin resin. The microparticles make it possible to obtain a one-component curable organopolysiloxane composition having characteristics such as excellent storage stability.