摘要:
Potential of a word line connected to any selected one of memory cells is lowered and potential of word lines connected to non-selected memory cells are raised. The potential of the plate line is raised and lowered. The potential of the bit line is raised and lowered. After this, reading data from the memory cells after potential raising and lowering of the plate line and potential raising and lowering of the bit line have been alternately performed at least one time, thereby to determine attenuation of polarization in the ferroelectric capacitor.
摘要:
A MOS dynamic random access memory includes a plurality of pairs of bit lines, and word lines transverse to the bit lines to define cross points, at which an array of memory cells are arranged. Each cell has a storage capacitor and a transfer gate MOS transistor having a gate electrode coupled to a word line and being connected between the capacitor and a bit line. Sense amplifier circuits are connected to the bit line pairs, and have a first and a second common source line. A decoder and a word line driver are connected to the word lines. A MOS transistor is connected between the power supply voltage and the first common source line, for selectively supplying it with a first voltage which potentially defines a high-level voltage for the bit line pairs. A voltage generator is connected through a MOS transistor to the second common source line, for generating a second voltage which potentially defines a low-level voltage for the bit line pairs, and which is selectively supplied to the second common source line. The second voltage is greater in potential than the ground potential, which is employed as a source voltage.
摘要:
A chain type ferroelectric random access memory has a memory cell unit including ferroelectric memory cells electrically connected in series to each other, a plate line connected to an electrode of the memory cell unit, a bit line connected to the other electrode of the memory cell unit via a switching transistor, a sense amplifier which amplifies the voltages of this bit line and its complementary bit line, and a transistor inserted between the switching transistor and the sense amplifier. A value, being the minimum value of the gate voltage in the transistor obtained during elevation of the plate line voltage and comparative amplification, is smaller than a value, being the maximum value of the gate voltage in the transistor obtained during fall of the plate line voltage and comparative amplification. With these features, decrease in the accumulated charge of polarization in the memory cell is reduced and occurrence of disturb is prevented during read/write operations.
摘要:
A semiconductor memory device includes active regions arranged on a semiconductor substrate such that those of the active regions which are adjacent in the word line direction deviate in the bit line direction, MOS transistors respectively formed in the active regions and each having a source and a drain one of which is connected to the bit line, a plurality of trenches each arranged to another set of source an drain regions and arranged to deviate in the word line direction in the respective active regions, those of the trenches which are adjacent with a through word line disposed therebetween being arranged to deviate in the bit line direction so as to be set closer to each other, a plurality of storage electrodes respectively formed in the trenches with capacitor insulative films disposed therebetween, and connection electrodes arranged between the word lines and each connecting the other of the source and drain to the storage electrode.
摘要:
A word-line drive voltage generation circuit for use in a dynamic random-access memory is disclosed which is connected to a word line via a row decoder including MOS transistors. The circuit includes a charge-bootstrap capacitor having insulated electrodes, one of which is connected to a first reference voltage generator via a switching MOS transistor, and the other of which is connected via a MOS transistor to a second reference voltage generator. These voltage generators provide the capacitor with the constant d.c. voltage that are essentially insensitive to variation in the power supply voltage for the memory. The resultant word-line drive voltage may thus be free from variation in the power supply voltage during the operation modes of the memory. This enables the word-line voltage to be high enough to allow successful "H" level writing at a selected memory cell without creation of any unwantedly increased dielectric breakdown therein, in the entire allowable range of the power supply voltage.
摘要:
A dynamic random access memory has a substrate, plural pairs of parallel bit lines provided on the substrate, parallel word lines insulatively crossing the parallel bit lines to define cross points therebetween, and memory cells provided at the cross points. Each memory cell has a data storage capacitor and a transistor. Sense amplifiers are provided at bit line pairs, respectively, to sense a data voltage. A discharge control section, which is associated with the sense amplifiers, forms discharge paths branched between the bit line pairs and the substrate grounded to progress the discharging of charges, when a certain word line is designated and a memory cell is selected from those memory cells which are connected to the certain word line, whereby the operational speed of the memory is increased.
摘要:
A dynamic-type semiconductor memory device comprises bit lines, every two bit lines forming a folded bit line pair, every two pairs forming a bit-line unit such that one of the bit lines of the first pair extends between the bit lines of the second pair, and the bit lines of the second pair are twisted at middle portion, word lines intersecting with the bit lines, dummy word lines, extending parallel to the word lines, two of the dummy word lines being arranged on one side of the crossing portions of the bit lines of the second pair, and the other two of the dummy word lines being arranged on the other side of the crossing portions of the bit lines of the second pair, memory cells connected to selected ones of the intersections of the bit lines and the word lines, such that any adjacent memory cells connected to the same word line form a group which is arranged every two bit lines, and any adjacent two memory cells connected to the same bit line are shifted by half-pitch distance with respect to the corresponding two adjacent memory cells connected to either adjacent bit line, a plurality of dummy cells connected to selected ones of the intersections of the bit lines and the word lines, such that at least one dummy cell is connected to each bit line, and sense amplifiers provided for the pairs of bit lines, respectively.
摘要:
A chain type ferroelectric random access memory has a memory cell unit including ferroelectric memory cells electrically connected in series to each other, a plate line connected to an electrode of the memory cell unit, a bit line connected to the other electrode of the memory cell unit via a switching transistor, a sense amplifier which amplifies the voltages of this bit line and its complementary bit line, and a transistor inserted between the switching transistor and the sense amplifier. A value, being the minimum value of the gate voltage in the transistor obtained during elevation of the plate line voltage and comparative amplification, is smaller than a value, being the maximum value of the gate voltage in the transistor obtained during fall of the plate line voltage and comparative amplification. With these features, decrease in the accumulated charge of polarization in the memory cell is reduced and occurrence of disturb is prevented during read/write operations.
摘要:
In a MIS transistor, the top surfaces of source/drain regions (S/D diffusion layers) formed on a semiconductor substrate 1 are arranged nearer to a gate electrode than a channel plane on the semiconductor substrate, and the top surfaces of the source/drain regions are arranged nearer than the channel plane than the interface between a gate insulator film provided on the upper side of the channel plane and the gate electrode. In this transistor, a groove is selectively formed in the surface of the semiconductor substrate, and a polycrystalline silicon deposited in the groove may be used as a mask to form impurity diffusion layers serving as source/drain regions to laminate and form a gate insulator film of a high dielectric film and a gate electrode. Alternatively, the polycrystalline silicon may be selectively formed to be used as a mask to elevate and form the impurity diffusion layer to laminate and form the gate insulator film and the gate electrode. Thus, it is possible to achieve both of the reduction of the resistance of the S/D diffusion layers and the reduction of the gate parasitic capacitance.
摘要:
A chain type ferroelectric random access memory has a memory cell unit comprising ferroelectric memory cells electrically connected in series to each other, a plate line connected to an electrode of the memory cell unit, a bit line connected to the other electrode of the memory cell unit via a switching transistor, a sense amplifier which amplifies the voltages of this bit line and its complementary bit line, and a transistor inserted between the switching transistor and the sense amplifier, and that a value, being the minimum value of the gate voltage in the transistor obtained during elevation of the plate line voltage and comparative amplification, is smaller than a value, being the maximum value of the gate voltage in the transistor obtained during fall of the plate line voltage and comparative amplification. With these features, decrease in the accumulated charge of polarization in the memory cell is reduced and occurrence of disturb is prevented during read/write operations.