公开(公告)号：US20120056923A1

公开(公告)日：2012-03-08

申请号：US13219515

申请日：2011-08-26

申请人： Eliyahu Vronsky ,  Valerie Gassend ,  Dariusz Golda ,  Hyeun-Su Kim

发明人： Eliyahu Vronsky ,  Valerie Gassend ,  Dariusz Golda ,  Hyeun-Su Kim

IPC分类号： B41J29/38

CPC分类号： B41J2/14 ,  B41J2/0456 ,  B41J2/04565 ,  B41J2/0458 ,  B41J2/0459 ,  B41J2/175 ,  B41J2/195 ,  B41J2/2142 ,  B41J3/407 ,  B41J2202/09 ,  H01L51/0005

摘要： Embodiments of methods and apparatus for micro-printing films are disclosed. According to various embodiments, the printing apparatus includes printheads with ink-jets for dispensing droplets of ink formed from a carrier liquid and a print material. The printheads also include thermal-jets for depositing the print material onto a substrate from the droplets of ink dispensed by ink-jets. The droplets of ink dispensed by ink-jets flow into micro-structures on the thermal-jets and the thermal-jets are heated to evaporate the carrier liquid and to vaporize and direct the print material onto a substrate. The printing apparatus further includes a control unit that is configured to automatically adjust an output from one or more printheads based on one or more measured quantities.

摘要翻译： 公开了微印膜的方法和装置的实施例。 根据各种实施例，印刷装置包括具有用于分配由载体液体和印刷材料形成的油墨液滴的喷墨头的打印头。 打印头还包括热喷射器，用于将喷墨材料从喷墨分配的墨滴上沉积到基底上。 由喷墨喷射的油墨液滴流入热射流上的微结构，加热热射流以蒸发载液并蒸发并将印刷材料引导到基底上。 打印设备还包括控制单元，该控制单元被配置为基于一个或多个测量量自动地调整来自一个或多个打印头的输出。

公开(公告)号：US20110293818A1

公开(公告)日：2011-12-01

申请号：US12954910

申请日：2010-11-29

申请人： Conor F. Madigan ,  Hyeun-Su Kim ,  Dariusz Golda ,  Valerie Gassend ,  Manush Birang ,  Alexander Sou-Kang Ko ,  Eliyahu Vronsky

发明人： Conor F. Madigan ,  Hyeun-Su Kim ,  Dariusz Golda ,  Valerie Gassend ,  Manush Birang ,  Alexander Sou-Kang Ko ,  Eliyahu Vronsky

IPC分类号： B05D5/06 ,  B05B5/025 ,  B05C1/00 ,  B05C11/00 ,  B05C5/00 ,  B05C5/04

CPC分类号： B41F16/00 ,  B41M3/003 ,  H01L51/001

摘要： The disclosure generally relates to a method and apparatus for depositing a substantially solid film onto a substrate. The solid film can be an Organic Light-Emitting Diode (“OLED”). In one embodiment, the disclosure relates to using a material supply, a rotating or moving mechanism having at least one transfer surface which is supplied with film material in one orientation and delivers film material to the substrate at a second orientation such that film material delivered to the substrate deposits in substantially solid form. The delivery to the substrate can be performed without the transfer surface materially contacting the substrate. The film material can be deposited on the transfer surface in either solid form or in liquid form (e.g., as a mixture of carrier liquid and dissolved or suspended film material).

摘要翻译： 本发明一般涉及用于将基本上固体的膜沉积到基底上的方法和装置。 固体膜可以是有机发光二极管（“OLED”）。 在一个实施方案中，本公开涉及使用材料供应源，旋转或移动机构，其具有至少一个转移表面，该转移表面以一个取向供应薄膜材料，并以第二取向将薄膜材料输送到基底，使得薄膜材料输送到 基材以基本上固体形式沉积。 可以在没有转印表面与基底材料接触的情况下进行到基底的输送。 膜材料可以以固体形式或液体形式（例如作为载体液体和溶解或悬浮膜材料的混合物）沉积在转印表面上。

公开(公告)号：US08596747B2

公开(公告)日：2013-12-03

申请号：US13327745

申请日：2011-12-15

申请人： Dariusz Golda ,  Valerie Gassend ,  Hyeun-Su Kim

发明人： Dariusz Golda ,  Valerie Gassend ,  Hyeun-Su Kim

IPC分类号： B41J2/015 ,  B05D5/06 ,  H01L21/00

CPC分类号： B41J2/3359 ,  B41J2/335 ,  B81C1/00309 ,  H01L2924/0002 ,  H01L2924/00

摘要： The disclosure generally relates to a modular printhead configured for ease of access and quick replacement of the printhead. In one embodiment, the disclosure is directed to an integrated printhead which includes: a printhead die supporting a plurality of micropores thereon; a support structure for supporting the printhead die; a heater interposed between the printhead die and the support structure; and an electrical trace connecting the heater to a supply source. The support structure accommodates the electrical trace through a via formed within it so as to form a solid state printhead containing all of the connections within and providing easily replaceable printhead.

公开(公告)号：US20120086764A1

公开(公告)日：2012-04-12

申请号：US13327745

申请日：2011-12-15

申请人： Dariusz Golda ,  Valerie Gassend ,  Hyeun-Su Kim

发明人： Dariusz Golda ,  Valerie Gassend ,  Hyeun-Su Kim

IPC分类号： B41J2/335 ,  H01L21/00

CPC分类号： B41J2/3359 ,  B41J2/335 ,  B81C1/00309 ,  H01L2924/0002 ,  H01L2924/00

摘要： The disclosure generally relates to a modular printhead configured for ease of access and quick replacement of the printhead. In one embodiment, the disclosure is directed to an integrated printhead which includes: a printhead die supporting a plurality of micropores thereon; a support structure for supporting the printhead die; a heater interposed between the printhead die and the support structure; and an electrical trace connecting the heater to a supply source. The support structure accommodates the electrical trace through a via formed within it so as to form a solid state printhead containing all of the connections within and providing easily replaceable printhead.

摘要翻译： 本公开总体上涉及一种模块化打印头，其被配置为便于访问并快速更换打印头。 在一个实施例中，本公开涉及一种集成打印头，其包括：在其上支撑多个微孔的打印头芯片; 用于支撑打印头芯片的支撑结构; 介于所述打印头芯片和所述支撑结构之间的加热器; 以及将加热器连接到供应源的电迹线。 支撑结构通过其中形成的通孔来容纳电迹线，以便形成固态打印头，其中包含所有连接并提供易于更换的打印头。

公开(公告)号：US08556389B2

公开(公告)日：2013-10-15

申请号：US13154419

申请日：2011-06-06

申请人： Dariusz Golda ,  Hyeun-Su Kim ,  Valerie Gassend

发明人： Dariusz Golda ,  Hyeun-Su Kim ,  Valerie Gassend

IPC分类号： B41J2/05

CPC分类号： B41J2/3359 ,  B41J2/335 ,  B81C1/00309 ,  H01L2924/0002 ,  H01L2924/00

摘要： A thermal printhead die is formed from an SOI structure as a MEMS device. The die has a printing surface, a buried oxide layer, and a mounting surface opposite the printing surface. A plurality of ink delivery sites are formed on the printing surface, each site having an ink-receiving and ink-dispensing structure. An ohmic heater is formed adjacent to each structure, and an under-bump metallization (UBM) pad is formed on the mounting surface and is electrically connected to the ohmic heater, so that ink received by the ink-delivery site and electrically heated by the ohmic heater may be delivered to a substrate by sublimation. A through-silicon-via (TSV) plug may be formed through the thickness of the die and electrically coupled through the buried oxide layer from the ohmic heater to the UBM pad. Layers of interconnect metal may connect the ohmic heater to the UBM pad and to the TSV plug.

摘要翻译： 热打印头芯片由作为MEMS器件的SOI结构形成。 模具具有印刷表面，掩埋氧化物层和与印刷表面相对的安装表面。 在打印表面上形成多个墨水输送部位，每个部位都具有墨水接收和墨水分配结构。 在每个结构附近形成欧姆加热器，并且在安装表面上形成凸块下金属化（UBM）焊盘，并与欧姆加热器电连接，使得由油墨传送部位接收的电和由 欧姆加热器可以通过升华被输送到基板。 可以通过芯片的厚度形成贯通硅通孔（TSV）插头，并通过掩埋氧化层从欧姆加热器电耦合到UBM焊盘。 互连金属层可以将欧姆加热器连接到UBM焊盘和TSV插头。

公开(公告)号：US20120200640A1

公开(公告)日：2012-08-09

申请号：US13154419

申请日：2011-06-06

申请人： Dariusz Golda ,  Hyeun-Su Kim ,  Valerie Gassend

发明人： Dariusz Golda ,  Hyeun-Su Kim ,  Valerie Gassend

IPC分类号： B41J2/05 ,  H01L21/28 ,  H01L21/302

CPC分类号： B41J2/3359 ,  B41J2/335 ,  B81C1/00309 ,  H01L2924/0002 ,  H01L2924/00

摘要： A thermal printhead die is formed from an SOI structure as a MEMS device. The die has a printing surface, a buried oxide layer, and a mounting surface opposite the printing surface. A plurality of ink delivery sites are formed on the printing surface, each site having an ink-receiving and ink-dispensing structure. An ohmic heater is formed adjacent to each structure, and an under-bump metallization (UBM) pad is formed on the mounting surface and is electrically connected to the ohmic heater, so that ink received by the ink-delivery site and electrically heated by the ohmic heater may be delivered to a substrate by sublimation. A through-silicon-via (TSV) plug may be formed through the thickness of the die and electrically coupled through the buried oxide layer from the ohmic heater to the UBM pad. Layers of interconnect metal may connect the ohmic heater to the UBM pad and to the TSV plug.

摘要翻译： 热打印头芯片由作为MEMS器件的SOI结构形成。 模具具有印刷表面，掩埋氧化物层和与印刷表面相对的安装表面。 在打印表面上形成多个墨水输送部位，每个部位都具有墨水接收和墨水分配结构。 在每个结构附近形成欧姆加热器，并且在安装表面上形成凸块下金属化（UBM）焊盘，并与欧姆加热器电连接，使得由油墨传送部位接收的电和由 欧姆加热器可以通过升华被输送到基板。 可以通过芯片的厚度形成贯通硅通孔（TSV）插头，并通过掩埋氧化层从欧姆加热器电耦合到UBM焊盘。 互连金属层可以将欧姆加热器连接到UBM焊盘和TSV插头。

公开(公告)号：US20120038705A1

公开(公告)日：2012-02-16

申请号：US13218451

申请日：2011-08-26

申请人： Conor Francis Madigan ,  Jianglong Chen ,  Dariusz Golda ,  Hyeun-Su Kim ,  Valerie Gassend ,  Manush Birang

发明人： Conor Francis Madigan ,  Jianglong Chen ,  Dariusz Golda ,  Hyeun-Su Kim ,  Valerie Gassend ,  Manush Birang

IPC分类号： B41J2/175

CPC分类号： B41J2/14 ,  B05B17/0638 ,  B41J2202/09 ,  B41J2202/16 ,  H01L51/0005 ,  H01L51/56

摘要： The disclosure relates to a method for loading ink material into discharge nozzle having a non-discharge surface and a plurality of micropores. The, method includes the steps of providing a quantity of liquid ink material defined by a carrier fluid containing dissolved or suspended film material; delivering the quantity of liquid ink onto the discharge nozzle and directing a portion of the delivered ink into at least one micropore; flowing a pressurized gas over the surface to drive the delivered ink material into the least one nozzle; evaporating the carrier fluid from the delivered ink to form a substantially carrier-free ink material at the micropore; and dispensing the substantially carrier-free ink material from the nozzle. The surface can be configured to reject the ink and the plurality of nozzles are configured to receive the ink.

摘要翻译： 本发明涉及将油墨材料装入具有非排放表面和多个微孔的排放喷嘴中的方法。 该方法包括以下步骤：提供由含有溶解或悬浮的薄膜材料的载体流体所限定的液体墨水材料; 将液体墨水的量输送到排出喷嘴上并将输送的油墨的一部分引导到至少一个微孔中; 将加压气体流过表面以将输送的油墨材料驱动到至少一个喷嘴中; 从所输送的油墨蒸发载体流体，以在微孔处形成基本上无载体的油墨材料; 并从喷嘴分配基本上无载体的油墨材料。 表面可以被配置为拒绝墨水，并且多个喷嘴被配置为接收墨水。

公开(公告)号：US08415767B1

公开(公告)日：2013-04-09

申请号：US13543675

申请日：2012-07-06

申请人： Dariusz Golda ,  Andreas Bibl

发明人： Dariusz Golda ,  Andreas Bibl

IPC分类号： H01L29/06

CPC分类号： B81C99/002 ,  H01L21/76898 ,  H01L24/75 ,  H01L24/95 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/00

摘要： A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.

公开(公告)号：US07557470B2

公开(公告)日：2009-07-07

申请号：US11709596

申请日：2007-02-22

申请人： Martin L. Culpepper ,  Dariusz Golda

发明人： Martin L. Culpepper ,  Dariusz Golda

IPC分类号： H02K41/00 ,  H02K33/00

CPC分类号： B81B3/0062 ,  B81B2201/038 ,  B81B2203/0109 ,  B81B2203/053 ,  B81B2203/055 ,  B81B2203/058 ,  Y10T74/20348

摘要： A MEMS actuator includes a coil stack in the form of microfabricated, electrically conductive first and second superposed layers. A magnet array is superposed in magnetic communication with the coil stack, with first and second coils being selectively, electrically actuatable to generate relative movement between the coil stack and the magnet array both in-plane and out-of-plane. In various embodiments, a plurality of the actuators are integrally coupled to a microfabricated compliant mechanism to provide a high bandwidth, six degree of freedom nanopositioner.

摘要翻译： MEMS致动器包括呈微加工，导电的第一和第二叠置层的形式的线圈堆叠。 磁体阵列叠加成与线圈堆叠磁连通，其中第一和第二线圈被选择性地电致动以在线圈堆叠和磁体阵列之间在平面内和平面外产生相对运动。 在各种实施例中，多个致动器整体地耦合到微制造的柔性机构以提供高带宽六自由度的纳米定位器。

公开(公告)号：US20070220882A1

公开(公告)日：2007-09-27

申请号：US11709596

申请日：2007-02-22

申请人： Martin Culpepper ,  Dariusz Golda

发明人： Martin Culpepper ,  Dariusz Golda

IPC分类号： B81B7/02

CPC分类号： B81B3/0062 ,  B81B2201/038 ,  B81B2203/0109 ,  B81B2203/053 ,  B81B2203/055 ,  B81B2203/058 ,  Y10T74/20348

摘要： A MEMS actuator includes a coil stack in the form of microfabricated, electrically conductive first and second superposed layers. A magnet array is superposed in magnetic communication with the coil stack, with first and second coils being selectively, electrically actuatable to generate relative movement between the coil stack and the magnet array both in-plane and out-of-plane. In various embodiments, a plurality of the actuators are integrally coupled to a microfabricated compliant mechanism to provide a high bandwidth, six degree of freedom nanopositioner.

摘要翻译： MEMS致动器包括呈微加工，导电的第一和第二叠置层的形式的线圈堆叠。 磁体阵列叠加成与线圈堆叠磁连通，其中第一和第二线圈被选择性地电致动以在线圈堆叠和磁体阵列之间在平面内和平面外产生相对运动。 在各种实施例中，多个致动器整体地耦合到微制造的柔性机构以提供高带宽六自由度的纳米定位器。