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    CONTROL SYSTEMS AND METHODS FOR THERMAL-JET PRINTING
    1.
    发明申请
    CONTROL SYSTEMS AND METHODS FOR THERMAL-JET PRINTING 审中-公开
    热喷涂的控制系统和方法

    公开(公告)号：US20120056923A1

    公开(公告)日：2012-03-08

    申请号：US13219515

    申请日：2011-08-26

    申请人： Eliyahu Vronsky ,  Valerie Gassend ,  Dariusz Golda ,  Hyeun-Su Kim

    发明人： Eliyahu Vronsky ,  Valerie Gassend ,  Dariusz Golda ,  Hyeun-Su Kim

    IPC分类号： B41J29/38

    CPC分类号： B41J2/14 ,  B41J2/0456 ,  B41J2/04565 ,  B41J2/0458 ,  B41J2/0459 ,  B41J2/175 ,  B41J2/195 ,  B41J2/2142 ,  B41J3/407 ,  B41J2202/09 ,  H01L51/0005

    摘要： Embodiments of methods and apparatus for micro-printing films are disclosed. According to various embodiments, the printing apparatus includes printheads with ink-jets for dispensing droplets of ink formed from a carrier liquid and a print material. The printheads also include thermal-jets for depositing the print material onto a substrate from the droplets of ink dispensed by ink-jets. The droplets of ink dispensed by ink-jets flow into micro-structures on the thermal-jets and the thermal-jets are heated to evaporate the carrier liquid and to vaporize and direct the print material onto a substrate. The printing apparatus further includes a control unit that is configured to automatically adjust an output from one or more printheads based on one or more measured quantities.

    摘要翻译： 公开了微印膜的方法和装置的实施例。 根据各种实施例，印刷装置包括具有用于分配由载体液体和印刷材料形成的油墨液滴的喷墨头的打印头。 打印头还包括热喷射器，用于将喷墨材料从喷墨分配的墨滴上沉积到基底上。 由喷墨喷射的油墨液滴流入热射流上的微结构，加热热射流以蒸发载液并蒸发并将印刷材料引导到基底上。 打印设备还包括控制单元，该控制单元被配置为基于一个或多个测量量自动地调整来自一个或多个打印头的输出。

    Method and Apparatus for Depositing A Film Using A Rotating Source
    2.
    发明申请
    Method and Apparatus for Depositing A Film Using A Rotating Source 审中-公开
    使用旋转源沉积薄膜的方法和装置

    公开(公告)号：US20110293818A1

    公开(公告)日：2011-12-01

    申请号：US12954910

    申请日：2010-11-29

    申请人： Conor F. Madigan ,  Hyeun-Su Kim ,  Dariusz Golda ,  Valerie Gassend ,  Manush Birang ,  Alexander Sou-Kang Ko ,  Eliyahu Vronsky

    发明人： Conor F. Madigan ,  Hyeun-Su Kim ,  Dariusz Golda ,  Valerie Gassend ,  Manush Birang ,  Alexander Sou-Kang Ko ,  Eliyahu Vronsky

    IPC分类号： B05D5/06 ,  B05B5/025 ,  B05C1/00 ,  B05C11/00 ,  B05C5/00 ,  B05C5/04

    CPC分类号： B41F16/00 ,  B41M3/003 ,  H01L51/001

    摘要： The disclosure generally relates to a method and apparatus for depositing a substantially solid film onto a substrate. The solid film can be an Organic Light-Emitting Diode (“OLED”). In one embodiment, the disclosure relates to using a material supply, a rotating or moving mechanism having at least one transfer surface which is supplied with film material in one orientation and delivers film material to the substrate at a second orientation such that film material delivered to the substrate deposits in substantially solid form. The delivery to the substrate can be performed without the transfer surface materially contacting the substrate. The film material can be deposited on the transfer surface in either solid form or in liquid form (e.g., as a mixture of carrier liquid and dissolved or suspended film material).

    摘要翻译： 本发明一般涉及用于将基本上固体的膜沉积到基底上的方法和装置。 固体膜可以是有机发光二极管（“OLED”）。 在一个实施方案中，本公开涉及使用材料供应源，旋转或移动机构，其具有至少一个转移表面，该转移表面以一个取向供应薄膜材料，并以第二取向将薄膜材料输送到基底，使得薄膜材料输送到 基材以基本上固体形式沉积。 可以在没有转印表面与基底材料接触的情况下进行到基底的输送。 膜材料可以以固体形式或液体形式（例如作为载体液体和溶解或悬浮膜材料的混合物）沉积在转印表面上。

    Low-profile MEMS thermal printhead die having backside electrical connections
    3.
    发明授权
    Low-profile MEMS thermal printhead die having backside electrical connections 有权
    具有背面电气连接的薄型MEMS热敏打印头芯片

    公开(公告)号：US08556389B2

    公开(公告)日：2013-10-15

    申请号：US13154419

    申请日：2011-06-06

    申请人： Dariusz Golda ,  Hyeun-Su Kim ,  Valerie Gassend

    发明人： Dariusz Golda ,  Hyeun-Su Kim ,  Valerie Gassend

    IPC分类号： B41J2/05

    CPC分类号： B41J2/3359 ,  B41J2/335 ,  B81C1/00309 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A thermal printhead die is formed from an SOI structure as a MEMS device. The die has a printing surface, a buried oxide layer, and a mounting surface opposite the printing surface. A plurality of ink delivery sites are formed on the printing surface, each site having an ink-receiving and ink-dispensing structure. An ohmic heater is formed adjacent to each structure, and an under-bump metallization (UBM) pad is formed on the mounting surface and is electrically connected to the ohmic heater, so that ink received by the ink-delivery site and electrically heated by the ohmic heater may be delivered to a substrate by sublimation. A through-silicon-via (TSV) plug may be formed through the thickness of the die and electrically coupled through the buried oxide layer from the ohmic heater to the UBM pad. Layers of interconnect metal may connect the ohmic heater to the UBM pad and to the TSV plug.

    摘要翻译： 热打印头芯片由作为MEMS器件的SOI结构形成。 模具具有印刷表面，掩埋氧化物层和与印刷表面相对的安装表面。 在打印表面上形成多个墨水输送部位，每个部位都具有墨水接收和墨水分配结构。 在每个结构附近形成欧姆加热器，并且在安装表面上形成凸块下金属化（UBM）焊盘，并与欧姆加热器电连接，使得由油墨传送部位接收的电和由 欧姆加热器可以通过升华被输送到基板。 可以通过芯片的厚度形成贯通硅通孔（TSV）插头，并通过掩埋氧化层从欧姆加热器电耦合到UBM焊盘。 互连金属层可以将欧姆加热器连接到UBM焊盘和TSV插头。

    LOW-PROFILE MEMS THERMAL PRINTHEAD DIE HAVING BACKSIDE ELECTRICAL CONNECTIONS
    4.
    发明申请
    LOW-PROFILE MEMS THERMAL PRINTHEAD DIE HAVING BACKSIDE ELECTRICAL CONNECTIONS 有权
    低配置型微电子热敏打印机具有背面电气连接

    公开(公告)号：US20120200640A1

    公开(公告)日：2012-08-09

    申请号：US13154419

    申请日：2011-06-06

    申请人： Dariusz Golda ,  Hyeun-Su Kim ,  Valerie Gassend

    发明人： Dariusz Golda ,  Hyeun-Su Kim ,  Valerie Gassend

    IPC分类号： B41J2/05 ,  H01L21/28 ,  H01L21/302

    CPC分类号： B41J2/3359 ,  B41J2/335 ,  B81C1/00309 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A thermal printhead die is formed from an SOI structure as a MEMS device. The die has a printing surface, a buried oxide layer, and a mounting surface opposite the printing surface. A plurality of ink delivery sites are formed on the printing surface, each site having an ink-receiving and ink-dispensing structure. An ohmic heater is formed adjacent to each structure, and an under-bump metallization (UBM) pad is formed on the mounting surface and is electrically connected to the ohmic heater, so that ink received by the ink-delivery site and electrically heated by the ohmic heater may be delivered to a substrate by sublimation. A through-silicon-via (TSV) plug may be formed through the thickness of the die and electrically coupled through the buried oxide layer from the ohmic heater to the UBM pad. Layers of interconnect metal may connect the ohmic heater to the UBM pad and to the TSV plug.

    摘要翻译： 热打印头芯片由作为MEMS器件的SOI结构形成。 模具具有印刷表面，掩埋氧化物层和与印刷表面相对的安装表面。 在打印表面上形成多个墨水输送部位，每个部位都具有墨水接收和墨水分配结构。 在每个结构附近形成欧姆加热器，并且在安装表面上形成凸块下金属化（UBM）焊盘，并与欧姆加热器电连接，使得由油墨传送部位接收的电和由 欧姆加热器可以通过升华被输送到基板。 可以通过芯片的厚度形成贯通硅通孔（TSV）插头，并通过掩埋氧化层从欧姆加热器电耦合到UBM焊盘。 互连金属层可以将欧姆加热器连接到UBM焊盘和TSV插头。

    Method and Apparatus for Delivering Ink Material from a Discharge Nozzle
    5.
    发明申请
    Method and Apparatus for Delivering Ink Material from a Discharge Nozzle 审中-公开
    从排放喷嘴输送墨水材料的方法和装置

    公开(公告)号：US20120038705A1

    公开(公告)日：2012-02-16

    申请号：US13218451

    申请日：2011-08-26

    申请人： Conor Francis Madigan ,  Jianglong Chen ,  Dariusz Golda ,  Hyeun-Su Kim ,  Valerie Gassend ,  Manush Birang

    发明人： Conor Francis Madigan ,  Jianglong Chen ,  Dariusz Golda ,  Hyeun-Su Kim ,  Valerie Gassend ,  Manush Birang

    IPC分类号： B41J2/175

    CPC分类号： B41J2/14 ,  B05B17/0638 ,  B41J2202/09 ,  B41J2202/16 ,  H01L51/0005 ,  H01L51/56

    摘要： The disclosure relates to a method for loading ink material into discharge nozzle having a non-discharge surface and a plurality of micropores. The, method includes the steps of providing a quantity of liquid ink material defined by a carrier fluid containing dissolved or suspended film material; delivering the quantity of liquid ink onto the discharge nozzle and directing a portion of the delivered ink into at least one micropore; flowing a pressurized gas over the surface to drive the delivered ink material into the least one nozzle; evaporating the carrier fluid from the delivered ink to form a substantially carrier-free ink material at the micropore; and dispensing the substantially carrier-free ink material from the nozzle. The surface can be configured to reject the ink and the plurality of nozzles are configured to receive the ink.

    摘要翻译： 本发明涉及将油墨材料装入具有非排放表面和多个微孔的排放喷嘴中的方法。 该方法包括以下步骤：提供由含有溶解或悬浮的薄膜材料的载体流体所限定的液体墨水材料; 将液体墨水的量输送到排出喷嘴上并将输送的油墨的一部分引导到至少一个微孔中; 将加压气体流过表面以将输送的油墨材料驱动到至少一个喷嘴中; 从所输送的油墨蒸发载体流体，以在微孔处形成基本上无载体的油墨材料; 并从喷嘴分配基本上无载体的油墨材料。 表面可以被配置为拒绝墨水，并且多个喷嘴被配置为接收墨水。

    Modular printhead for OLED printing
    6.
    发明授权
    Modular printhead for OLED printing 有权

    公开(公告)号：US08596747B2

    公开(公告)日：2013-12-03

    申请号：US13327745

    申请日：2011-12-15

    申请人： Dariusz Golda ,  Valerie Gassend ,  Hyeun-Su Kim

    发明人： Dariusz Golda ,  Valerie Gassend ,  Hyeun-Su Kim

    IPC分类号： B41J2/015 ,  B05D5/06 ,  H01L21/00

    CPC分类号： B41J2/3359 ,  B41J2/335 ,  B81C1/00309 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The disclosure generally relates to a modular printhead configured for ease of access and quick replacement of the printhead. In one embodiment, the disclosure is directed to an integrated printhead which includes: a printhead die supporting a plurality of micropores thereon; a support structure for supporting the printhead die; a heater interposed between the printhead die and the support structure; and an electrical trace connecting the heater to a supply source. The support structure accommodates the electrical trace through a via formed within it so as to form a solid state printhead containing all of the connections within and providing easily replaceable printhead.

    MODULAR PRINTHEAD FOR OLED PRINTING
    7.
    发明申请
    MODULAR PRINTHEAD FOR OLED PRINTING 有权
    用于OLED打印的模块化打印头

    公开(公告)号：US20120086764A1

    公开(公告)日：2012-04-12

    申请号：US13327745

    申请日：2011-12-15

    申请人： Dariusz Golda ,  Valerie Gassend ,  Hyeun-Su Kim

    发明人： Dariusz Golda ,  Valerie Gassend ,  Hyeun-Su Kim

    IPC分类号： B41J2/335 ,  H01L21/00

    CPC分类号： B41J2/3359 ,  B41J2/335 ,  B81C1/00309 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The disclosure generally relates to a modular printhead configured for ease of access and quick replacement of the printhead. In one embodiment, the disclosure is directed to an integrated printhead which includes: a printhead die supporting a plurality of micropores thereon; a support structure for supporting the printhead die; a heater interposed between the printhead die and the support structure; and an electrical trace connecting the heater to a supply source. The support structure accommodates the electrical trace through a via formed within it so as to form a solid state printhead containing all of the connections within and providing easily replaceable printhead.

    摘要翻译： 本公开总体上涉及一种模块化打印头，其被配置为便于访问并快速更换打印头。 在一个实施例中，本公开涉及一种集成打印头，其包括：在其上支撑多个微孔的打印头芯片; 用于支撑打印头芯片的支撑结构; 介于所述打印头芯片和所述支撑结构之间的加热器; 以及将加热器连接到供应源的电迹线。 支撑结构通过其中形成的通孔来容纳电迹线，以便形成固态打印头，其中包含所有连接并提供易于更换的打印头。

    METHOD AND APPARATUS FOR CONTROLLING THE TEMPERATURE OF AN ELECTRICALLY-HEATED DISCHARGE NOZZLE
    10.
    发明申请
    METHOD AND APPARATUS FOR CONTROLLING THE TEMPERATURE OF AN ELECTRICALLY-HEATED DISCHARGE NOZZLE 审中-公开
    用于控制电加热排放喷嘴温度的方法和装置

    公开(公告)号：US20100188457A1

    公开(公告)日：2010-07-29

    申请号：US12580831

    申请日：2009-10-16

    申请人： Connor F. Madigan ,  Martin A. Schmidt ,  Valerie Gassend

    发明人： Connor F. Madigan ,  Martin A. Schmidt ,  Valerie Gassend

    IPC分类号： B41J29/38

    CPC分类号： B41J2/175 ,  B41J2/14 ,  H01L51/0005

    摘要： In an embodiment, the disclosure relates to a method and apparatus for fault monitoring and controlling operation of a discharge nozzle in a large array of discharge nozzles. An exemplary apparatus includes a thin, thermally conductive membrane, with an integrated thin-film electrical heater. When a fixed voltage is applied to the heater, and as the heater heats, the resistance of the heater will increase which will cause a concomitant decrease in the electrical current flowing through the heater. By measuring the resistance of the heater it can readily be determined whether the device is functioning properly.

    摘要翻译： 在一个实施例中，本公开涉及一种用于故障监测和控制排放喷嘴在大排放喷嘴中的操作的方法和装置。 示例性装置包括薄的导热膜，具有集成的薄膜电加热器。 当固定的电压施加到加热器时，并且当加热器加热时，加热器的电阻将增加，这将导致流过加热器的电流的伴随下降。 通过测量加热器的电阻，可以容易地确定设备是否正常工作。