INTEGRATION SCHEME FOR CONSTRAINED SEG GROWTH ON POLY DURING RAISED S/D PROCESSING
    1.
    发明申请
    INTEGRATION SCHEME FOR CONSTRAINED SEG GROWTH ON POLY DURING RAISED S/D PROCESSING 审中-公开
    在加速S / D处理期间聚合的SEG增长的集成方案

    公开(公告)号:US20090236664A1

    公开(公告)日:2009-09-24

    申请号:US12471600

    申请日:2009-05-26

    IPC分类号: H01L29/786

    摘要: A method for constraining lateral growth of gate caps formed during an epitaxial silicon growth process to achieve raised source/drain regions on poly silicon is presented. The method is appropriate for integration into a manufacturing process for integrated circuit semiconductor devices. The method utilizes selective etch processes, dependant upon the material comprising the protective layer (hard mask) over the gate and the material of the spacers, e.g., oxide mask/nitride spacers, or nitride mask/oxide spacers.

    摘要翻译: 提出了一种限制在外延硅生长过程中形成的栅极盖的横向生长以在多晶硅上实现凸起的源极/漏极区域的方法。 该方法适用于集成到集成电路半导体器件的制造工艺中。 该方法利用选择性蚀刻工艺,取决于包含栅极上的保护层(硬掩模)的材料和间隔物的材料,例如氧化物掩模/氮化物间隔物或氮化物掩模/氧化物间隔物。

    Integration scheme for constrained SEG growth on poly during raised S/D processing
    2.
    发明授权
    Integration scheme for constrained SEG growth on poly during raised S/D processing 有权
    在提升的S / D处理期间,聚合物对SEG增长的集成方案

    公开(公告)号:US07553732B1

    公开(公告)日:2009-06-30

    申请号:US11150923

    申请日:2005-06-13

    IPC分类号: H01L21/336

    摘要: A method for constraining lateral growth of gate caps formed during an epitaxial silicon growth process to achieve raised source/drain regions on poly silicon is presented. The method is appropriate for integration into a manufacturing process for integrated circuit semiconductor devices. The method utilizes selective etch processes, dependant upon the material comprising the protective layer (hard mask) over the gate and the material of the spacers, e.g., oxide mask/nitride spacers, or nitride mask/oxide spacers.

    摘要翻译: 提出了一种限制在外延硅生长过程中形成的栅极盖的横向生长以在多晶硅上实现凸起的源极/漏极区域的方法。 该方法适用于集成到集成电路半导体器件的制造工艺中。 该方法利用选择性蚀刻工艺,取决于包含栅极上的保护层(硬掩模)的材料和间隔物的材料,例如氧化物掩模/氮化物间隔物或氮化物掩模/氧化物间隔物。

    Removable spacer technique
    3.
    发明授权
    Removable spacer technique 有权
    可拆卸间隔技术

    公开(公告)号:US06506642B1

    公开(公告)日:2003-01-14

    申请号:US10020931

    申请日:2001-12-19

    IPC分类号: H01L218238

    摘要: Submicron-dimensioned MOS and/or CMOS transistors are fabricated utilizing a simplified removable sidewall spacer technique, enabling effective tailoring of individual transistors to optimize their respective functionality. Embodiments include forming a first sidewall spacer having a first thickness on the side surfaces of a plurality of gate electrodes of transistors, selectively removing the first sidewall spacers from the gate electrodes of certain transistors, and then depositing second sidewall spacers on remaining first sidewall spacers and on the side surfaces of the gate electrodes from which the first sidewall spacers have been removed. Embodiments enable separately tailoring n- and p-MOS transistors as well as individual n- or p-MOS transistors having different functionality, e.g., different drive current and voltage leakage requirements.

    摘要翻译: 亚微米尺寸的MOS和/或CMOS晶体管使用简化的可移除侧壁间隔物技术制造,使得能够有效地定制各个晶体管以优化它们各自的功能。 实施例包括在晶体管的多个栅极电极的侧表面上形成具有第一厚度的第一侧壁间隔物,从某些晶体管的栅电极选择性地去除第一侧壁间隔物,然后在剩余的第一侧壁间隔物上沉积第二侧壁间隔物, 在栅电极的已经被去除了第一侧壁间隔物的侧表面上。 实施例能够单独定制n型和p型MOS晶体管以及具有不同功能的单独n型或p型MOS晶体管,例如不同的驱动电流和电压泄漏要求。

    Semiconductor device and method of manufacturing a semiconductor device
    4.
    发明授权
    Semiconductor device and method of manufacturing a semiconductor device 有权
    半导体装置及其制造方法

    公开(公告)号:US07910996B2

    公开(公告)日:2011-03-22

    申请号:US12496133

    申请日:2009-07-01

    IPC分类号: H01L29/12

    CPC分类号: H01L29/66628 H01L29/66772

    摘要: A semiconductor device is disclosed having a conductive gate structure overlying a semiconductor layer having a major surface. An isolation material is recessed within a trench region below the major surface of the semiconductor layer. An epitaxial layer is formed overlying a portion of the major surface and on an active region forming a sidewall of the trench.

    摘要翻译: 公开了一种半导体器件,其具有覆盖具有主表面的半导体层的导电栅极结构。 隔离材料凹陷在半导体层的主表面下方的沟槽区域内。 形成外延层,覆盖主表面的一部分和形成沟槽侧壁的有源区。

    SRAM cell with individual electrical device threshold control
    7.
    发明授权
    SRAM cell with individual electrical device threshold control 有权
    具有独立电气设备阈值控制的SRAM单元

    公开(公告)号:US09048136B2

    公开(公告)日:2015-06-02

    申请号:US13282261

    申请日:2011-10-26

    摘要: A static random access memory cell is provided formed in a silicon layer over a buried oxide layer on a substrate and including first and second inverters each having a pull-up and pull-down transistor configured to form a cell node. Each of the pull-down transistors of the first and second inverters are formed over first regions below the buried oxide layer with the first regions having a first doping level forming first backgates for the pull-down transistors. A pair of passgate transistors respectively couples to the cell nodes of the first and second inverters and each are formed over second regions below the buried oxide layer with the second regions having a second doping level forming second backgates for the passgate transistors. Active bias circuitry applies potentials to the first and second backgates during read, standby and write operations of the static random access memory cell.

    摘要翻译: 提供了在衬底上的掩埋氧化物层上的硅层中形成的静态随机存取存储器单元,并且包括第一和第二反相器,每个具有被配置为形成单元节点的上拉和下拉晶体管。 第一和第二反相器的每个下拉晶体管形成在掩埋氧化物层下方的第一区域上,其中第一区域具有形成用于下拉晶体管的第一衬底的第一掺杂级。 一对通道晶体管分别耦合到第一和第二反相器的单元节点,并且每一个均形成在掩埋氧化物层下方的第二区域上,其中第二区域具有形成用于通路晶体管的第二衬底的第二掺杂水平。 主动偏置电路在静态随机存取存储器单元的读取,备用和写入操作期间将电位施加到第一和第二后挡板。

    SRAM CELL WITH INDIVIDUAL ELECTRICAL DEVICE THRESHOLD CONTROL
    8.
    发明申请
    SRAM CELL WITH INDIVIDUAL ELECTRICAL DEVICE THRESHOLD CONTROL 有权
    具有独立电气设备阈值控制的SRAM单元

    公开(公告)号:US20130107610A1

    公开(公告)日:2013-05-02

    申请号:US13282299

    申请日:2011-10-26

    摘要: A static random access memory cell is provided that includes first and second inverters formed on a substrate each having a pull-up and pull-down transistor configured to form a cell node. Each of the pull-down transistors of the first and second inverters resides over first regions below the buried oxide layer and having a first doping level and applied bias providing a first voltage threshold for the pull-down transistors. A pair of passgate transistors is coupled the cell nodes of the first and second inverters, and each is formed over second regions below the buried oxide layer and having a second doping level and applied bias providing a second voltage threshold for the passgate transistors. The first voltage threshold differs from the second voltage threshold providing electrical voltage threshold control between the pull-down transistors and the passgate transistors.

    摘要翻译: 提供了一种静态随机存取存储单元,其包括形成在基板上的第一和第二反相器,每个具有被配置为形成单元节点的上拉和下拉晶体管。 第一和第二反相器的每个下拉晶体管驻留在掩埋氧化物层下方的第一区域上,并且具有第一掺杂水平和施加的偏压,为下拉晶体管提供第一电压阈值。 一对通道晶体管耦合第一和第二反相器的单元节点,并且每一个形成在掩埋氧化物层下方的第二区域上,并且具有第二掺杂水平,并且施加的偏置为通路晶体管提供第二电压阈值。 第一电压阈值与提供下拉晶体管和通道晶体管之间的电压阈值控制的第二电压阈值不同。

    SRAM CELL WITH INDIVIDUAL ELECTRICAL DEVICE THRESHOLD CONTROL
    9.
    发明申请
    SRAM CELL WITH INDIVIDUAL ELECTRICAL DEVICE THRESHOLD CONTROL 有权
    具有独立电气设备阈值控制的SRAM单元

    公开(公告)号:US20130107608A1

    公开(公告)日:2013-05-02

    申请号:US13282261

    申请日:2011-10-26

    IPC分类号: G11C11/00 H01L27/12

    摘要: A static random access memory cell is provided formed in a silicon layer over a buried oxide layer on a substrate and including first and second inverters each having a pull-up and pull-down transistor configured to form a cell node. Each of the pull-down transistors of the first and second inverters are formed over first regions below the buried oxide layer with the first regions having a first doping level forming first backgates for the pull-down transistors. A pair of passgate transistors respectively couples to the cell nodes of the first and second inverters and each are formed over second regions below the buried oxide layer with the second regions having a second doping level forming second backgates for the passgate transistors. Active bias circuitry applies potentials to the first and second backgates during read, standby and write operations of the static random access memory cell.

    摘要翻译: 提供了在衬底上的掩埋氧化物层上的硅层中形成的静态随机存取存储器单元,并且包括第一和第二反相器,每个具有被配置为形成单元节点的上拉和下拉晶体管。 第一和第二反相器的每个下拉晶体管形成在掩埋氧化物层下方的第一区域上,其中第一区域具有形成用于下拉晶体管的第一衬底的第一掺杂级。 一对通道晶体管分别耦合到第一和第二反相器的单元节点,并且每一个均形成在掩埋氧化物层下方的第二区域上,其中第二区域具有形成用于通路晶体管的第二衬底的第二掺杂水平。 主动偏置电路在静态随机存取存储器单元的读取,备用和写入操作期间将电位施加到第一和第二后挡板。