公开(公告)号：US20070040268A1

公开(公告)日：2007-02-22

申请号：US11590099

申请日：2006-10-31

申请人： David Sherrer ,  Larry Rasnake ,  John Fisher

发明人： David Sherrer ,  Larry Rasnake ,  John Fisher

IPC分类号： H01L23/34

CPC分类号： G02B6/4248 ,  G01B11/16 ,  G01B11/26 ,  G02B6/3692 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/421 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4239 ,  G02B6/4243 ,  G02B6/4244 ,  G02B6/4257 ,  G02B6/4271 ,  G02B6/4292 ,  H01L23/481 ,  H01L2924/0002 ,  H01S5/0014 ,  H01S5/022 ,  H01S5/02208 ,  H01S5/02216 ,  H01S5/0222 ,  H01S5/02252 ,  H01S5/02272 ,  H01S5/02284 ,  H01S5/02288 ,  H01S5/02415 ,  H01S5/02469 ,  H01S5/0683 ,  H01L2924/00012 ,  H01L2924/00

摘要： Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.

公开(公告)号：US20050110157A1

公开(公告)日：2005-05-26

申请号：US10941667

申请日：2004-09-15

申请人： David Sherrer ,  Larry Rasnake ,  John Fisher

发明人： David Sherrer ,  Larry Rasnake ,  John Fisher

IPC分类号： H01L23/02 ,  G01R31/26 ,  G02B6/36 ,  G02B6/42 ,  H01L21/28 ,  H01L21/66 ,  H01L23/48 ,  H01L29/22 ,  H01S5/00 ,  H01S5/022 ,  H01S5/024 ,  H01L33/00

CPC分类号： G02B6/4248 ,  G01B11/16 ,  G01B11/26 ,  G02B6/3692 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/421 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4239 ,  G02B6/4243 ,  G02B6/4244 ,  G02B6/4257 ,  G02B6/4271 ,  G02B6/4292 ,  H01L23/481 ,  H01L2924/0002 ,  H01S5/0014 ,  H01S5/022 ,  H01S5/02208 ,  H01S5/02216 ,  H01S5/0222 ,  H01S5/02252 ,  H01S5/02272 ,  H01S5/02284 ,  H01S5/02288 ,  H01S5/02415 ,  H01S5/02469 ,  H01S5/0683 ,  H01L2924/00012 ,  H01L2924/00

摘要： Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.

摘要翻译： 提供形成密封通孔结构的方法。 一种方法包括：（a）提供具有第一表面和与第一表面相对的第二表面的半导体衬底; （b）在所述基板的第一表面上形成层; （c）从所述第二表面到所述层蚀刻穿过所述基板的通孔，所述通孔在所述第一表面具有第一周边; （d）在所述层中形成孔，其中所述孔在所述第一周边内具有第二周边; 和（e）提供用于密封通孔结构的导电结构。 还提供了密封通孔结构，检测密封器件封装中的泄漏的方法，密封器件封装，具有冷却结构的器件封装以及将第一元件接合到第二元件的方法。

公开(公告)号：US20070164419A1

公开(公告)日：2007-07-19

申请号：US11590592

申请日：2006-10-31

申请人： David Sherrer ,  Larry Rasnake ,  John Fisher

发明人： David Sherrer ,  Larry Rasnake ,  John Fisher

IPC分类号： H01L23/48 ,  H01L23/12

CPC分类号： G02B6/4248 ,  G01B11/16 ,  G01B11/26 ,  G02B6/3692 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/421 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4239 ,  G02B6/4243 ,  G02B6/4244 ,  G02B6/4257 ,  G02B6/4271 ,  G02B6/4292 ,  H01L23/481 ,  H01L2924/0002 ,  H01S5/0014 ,  H01S5/022 ,  H01S5/02208 ,  H01S5/02216 ,  H01S5/0222 ,  H01S5/02252 ,  H01S5/02272 ,  H01S5/02284 ,  H01S5/02288 ,  H01S5/02415 ,  H01S5/02469 ,  H01S5/0683 ,  H01L2924/00012 ,  H01L2924/00

摘要： Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.

摘要翻译： 提供形成密封通孔结构的方法。 一种方法包括：（a）提供具有第一表面和与第一表面相对的第二表面的半导体衬底; （b）在所述基板的第一表面上形成层; （c）从所述第二表面到所述层蚀刻穿过所述基板的通孔，所述通孔在所述第一表面具有第一周边; （d）在所述层中形成孔，其中所述孔在所述第一周边内具有第二周边; 和（e）提供用于密封通孔结构的导电结构。 还提供了密封通孔结构，检测密封器件封装中的泄漏的方法，密封器件封装，具有冷却结构的器件封装以及将第一元件接合到第二元件的方法。

公开(公告)号：US20070072321A1

公开(公告)日：2007-03-29

申请号：US11590629

申请日：2006-10-31

申请人： David Sherrer ,  Larry Rasnake ,  John Fisher

发明人： David Sherrer ,  Larry Rasnake ,  John Fisher

IPC分类号： H01L21/00 ,  H01L21/30 ,  G02B6/12

CPC分类号： G02B6/4248 ,  G01B11/16 ,  G01B11/26 ,  G02B6/3692 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/421 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4239 ,  G02B6/4243 ,  G02B6/4244 ,  G02B6/4257 ,  G02B6/4271 ,  G02B6/4292 ,  H01L23/481 ,  H01L2924/0002 ,  H01S5/0014 ,  H01S5/022 ,  H01S5/02208 ,  H01S5/02216 ,  H01S5/0222 ,  H01S5/02252 ,  H01S5/02272 ,  H01S5/02284 ,  H01S5/02288 ,  H01S5/02415 ,  H01S5/02469 ,  H01S5/0683 ,  H01L2924/00012 ,  H01L2924/00

摘要： Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.

公开(公告)号：US20050111797A1

公开(公告)日：2005-05-26

申请号：US10941668

申请日：2004-09-15

申请人： David Sherrer ,  Larry Rasnake ,  John Fisher

发明人： David Sherrer ,  Larry Rasnake ,  John Fisher

IPC分类号： H01L23/02 ,  G01R31/26 ,  G02B6/36 ,  G02B6/42 ,  H01L21/28 ,  H01L21/66 ,  H01L23/48 ,  H01L29/22 ,  H01S5/00 ,  H01S5/022 ,  H01S5/024

CPC分类号： G02B6/4248 ,  G01B11/16 ,  G01B11/26 ,  G02B6/3692 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/421 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4239 ,  G02B6/4243 ,  G02B6/4244 ,  G02B6/4257 ,  G02B6/4271 ,  G02B6/4292 ,  H01L23/481 ,  H01L2924/0002 ,  H01S5/0014 ,  H01S5/022 ,  H01S5/02208 ,  H01S5/02216 ,  H01S5/0222 ,  H01S5/02252 ,  H01S5/02272 ,  H01S5/02284 ,  H01S5/02288 ,  H01S5/02415 ,  H01S5/02469 ,  H01S5/0683 ,  H01L2924/00012 ,  H01L2924/00

摘要： Provided are optoelectronic device packages. The packages include a base substrate having an optoelectronic device mounting region on a surface of the base substrate and a lid mounting region. An optoelectronic device is mounted on the optoelectronic device mounting region. A lid is mounted on the lid mounting region to form an enclosed volume between the base substrate and the lid. The optoelectronic device is in the enclosed volume. The lid has an optically transmissive region suitable for transmitting light of a given wavelength along an optical path to or from the optoelectronic device, wherein at least a portion of the lid mounting region is disposed along the optical path below the surface of the base substrate to a depth below the optical path. Also provided are wafer or grid level optoelectronic device packages, wafer- or grid-level optoelectronic device package lid and their methods of formation, and connectorized optoelectronic devices.

摘要翻译： 提供的是光电器件封装。 封装包括在基底基板的表面上具有光电子器件安装区域的基底基板和盖安装区域。 光电子器件安装在光电器件安装区域上。 盖安装在盖安装区域上以在基底基板和盖之间形成封闭的容积。 光电子器件处于封闭容积。 盖具有适于将光给定波长的光沿着光路传送到光电子器件或从光电子器件传输的光学透射区域，其中盖安装区域的至少一部分沿着基底衬底表面下方的光路设置， 光路下方的深度。 还提供了晶片或栅格级光电子器件封装，晶片或栅格级光电子器件封装盖及其形成方法和连接的光电子器件。

公开(公告)号：US20050285216A1

公开(公告)日：2005-12-29

申请号：US11152671

申请日：2005-06-14

申请人： Dan Steinberg ,  Larry Rasnake

发明人： Dan Steinberg ,  Larry Rasnake

IPC分类号： B81C1/00 ,  G02B6/00 ,  G02B6/12 ,  G02B6/136 ,  G02B6/36 ,  G02B6/42 ,  H01L21/76 ,  H01L31/00

CPC分类号： G02B6/3636 ,  G02B6/136 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/4206 ,  G02B6/423 ,  G02B6/4234 ,  G02B2006/12176

摘要： The present invention provides an optical microbench having intersecting structures etched into a substrate. In particular, microbenches in accordance with the present invention include structures having a planar surfaces formed along selected crystallographic planes of a single crystal substrate. Two of the structures provided are an etch-stop pit and an anisotropically etched feature disposed adjacent the etch-stop pit. At the point of intersection between the etch-stop pit and the anisotropically etched feature the orientation of the crystallographic planes is maintained. The present invention also provides a method for micromachining a substrate to form an optical microbench. The method comprises the steps of forming an etch-stop pit and forming an anisotropically etched feature adjacent the etch-stop pit. The method may also comprise coating the surfaces of the etch-stop pit with an etch-stop layer.

摘要翻译： 本发明提供一种具有蚀刻到衬底中的相交结构的光学微型台。 特别地，根据本发明的微型薄片包括具有沿着单晶衬底的选定结晶面形成的平面的结构。 提供的两个结构是蚀刻停止凹坑和邻近蚀刻停止凹坑设置的各向异性蚀刻特征。 在蚀刻停止凹坑和各向异性蚀刻特征之间的交点处，维持结晶平面的取向。 本发明还提供了一种用于微加工基板以形成光学微型台的方法。 该方法包括以下步骤：形成蚀刻停止凹坑并在蚀刻停止凹坑附近形成各向异性蚀刻的特征。 该方法还可以包括用蚀刻停止层涂覆蚀刻停止凹坑的表面。