Monolithically integrated resistive structure with power IGBT (insulated gate bipolar transistor) devices
    1.
    发明申请
    Monolithically integrated resistive structure with power IGBT (insulated gate bipolar transistor) devices 有权
    具有功率IGBT(绝缘栅双极晶体管)器件的单片集成电阻结构

    公开(公告)号:US20050051813A1

    公开(公告)日:2005-03-10

    申请号:US10888789

    申请日:2004-07-09

    CPC分类号: H01L29/7395

    摘要: A device integrated in a semiconductor substrate of a first type of conductivity being crowned by a semiconductor layer of a second type of conductivity comprising a voltage controlled resistive structure and an IGBT device, wherein the resistive structure comprises at least one substantially annular region of the first type of conductivity which surrounds a portion of the semiconductor layer.

    摘要翻译: 一种集成在由第一导电类型的半导体衬底中的第一导电类型的半导体层的器件,其包括电压控制电阻结构和IGBT器件的第二导电类型的半导体层,其中所述电阻结构包括至少一个第一 围绕半导体层的一部分的导电性的类型。

    Monolithically integrated resistive structure with power IGBT (insulated gate bipolar transistor) devices
    2.
    发明授权
    Monolithically integrated resistive structure with power IGBT (insulated gate bipolar transistor) devices 有权
    具有功率IGBT(绝缘栅双极晶体管)器件的单片集成电阻结构

    公开(公告)号:US07126167B2

    公开(公告)日:2006-10-24

    申请号:US10888789

    申请日:2004-07-09

    IPC分类号: H01L29/43

    CPC分类号: H01L29/7395

    摘要: A device integrated in a semiconductor substrate of a first type of conductivity being crowned by a semiconductor layer of a second type of conductivity comprising a voltage controlled resistive structure and an IGBT device, wherein the resistive structure comprises at least one substantially annular region of the first type of conductivity which surrounds a portion of the semiconductor layer.

    摘要翻译: 一种集成在由第一导电类型的半导体衬底中的第一导电类型的半导体层的器件,其包括电压控制电阻结构和IGBT器件的第二导电类型的半导体层,其中所述电阻结构包括至少一个第一 围绕半导体层的一部分的导电性的类型。

    Monolithically integrated power IGBT device
    3.
    发明申请
    Monolithically integrated power IGBT device 审中-公开
    整体功率IGBT器件

    公开(公告)号:US20070024118A1

    公开(公告)日:2007-02-01

    申请号:US11438680

    申请日:2006-05-22

    IPC分类号: B60L1/00

    摘要: A power IGBT device is monolithically integrated to include an input terminal suitable to receive an input voltage and an output terminal suitable to supply a current having a limited and predetermined highest value. Such IGBT device includes an IGBT power element inserted between said output terminal and a supply reference. The power element has a control terminal connected to the input terminal through a control circuit that includes at least a transistor inserted between the control terminal and the supply reference voltage and a resistive element inserted between the input terminal and the control terminal.

    摘要翻译: 功率IGBT器件被单片集成以包括适于接收输入电压的输入端子和适于提供具有有限和预定最高值的电流的输出端子。 这种IGBT器件包括插入在所述输出端子和电源基准之间的IGBT功率元件。 功率元件具有通过控制电路连接到输入端子的控制端子,该控制电路至少包括插入在控制端子和电源参考电压之间的晶体管,以及插入在输入端子和控制端子之间的电阻元件。

    Circuit for dynamic control of a power transistor in applications for high voltage
    4.
    发明申请
    Circuit for dynamic control of a power transistor in applications for high voltage 审中-公开
    用于高压应用中功率晶体管的动态控制电路

    公开(公告)号:US20050184793A1

    公开(公告)日:2005-08-25

    申请号:US11042469

    申请日:2005-01-24

    IPC分类号: F02P3/04 H03K17/082 H03L5/00

    摘要: A circuit for dynamic control of a power transistor in applications for high voltage and of the type wherein a power transistor has a conduction terminal connected to a load and a control terminal receiving a driving signal from a driver block activated by a trigger signal received on a circuit input terminal. Advantageously, the circuit comprises a JFET component inserted between the conduction and control terminal of the power transistor and equal to a resistance with a non-linear feature. Moreover, the JFET component may be monolithically integrated in the structure of said power transistor.

    摘要翻译: 一种用于高电压应用中的功率晶体管的动态控制的电路,其中功率晶体管具有连接到负载的导通端子和控制端子,其接收来自由接收到的触发信号激活的驱动器块的驱动信号 电路输入端子。 有利地,电路包括插入在功率晶体管的导通和控制端之间并等于具有非线性特征的电阻的JFET元件。 此外,JFET部件可以单片集成在所述功率晶体管的结构中。

    Vertical bipolar semiconductor power transistor with an interdigitzed geometry, with optimization of the base-to-emitter potential difference
    6.
    发明授权
    Vertical bipolar semiconductor power transistor with an interdigitzed geometry, with optimization of the base-to-emitter potential difference 有权
    垂直双极半导体功率晶体管具有交叉的几何形状,优化了基极 - 发射极电位差

    公开(公告)号:US06297118B1

    公开(公告)日:2001-10-02

    申请号:US09548784

    申请日:2000-04-13

    申请人: Davide Patti

    发明人: Davide Patti

    IPC分类号: H01L21331

    摘要: A transistor including an epitaxial layer with a first conductivity type, a base buried region with a second conductivity type, and a sinker base region with the second conductivity type which extends from a main surface of the transistor to the base buried region, and delimits, together with the base buried region, emitter fingers in the epitaxial layer. The transistor further includes an emitter buried region with the first conductivity type and a doping level which is higher than that of the epitaxial layer. The emitter buried region is embedded in the epitaxial layer in a position adjacent to the base buried region. A sinker emitter region having the first conductivity type and a doping level which is higher than that of the epitaxial layer and extends from the main surface to the emitter buried region inside the emitter fingers. The emitter buried region and the sinker emitter region delimit in each emitter finger pairs of sections which are mutually spaced and delimit between one another a central region of the epitaxial layer. The sinker emitter region of each pair of sections of an emitter finger extend in the vicinity of mutually facing edges of the emitter buried region of the pair of sections.

    摘要翻译: 一种晶体管,包括具有第一导电类型的外延层,具有第二导电类型的基极掩埋区域和具有第二导电类型的沉降片基极区域,从晶体管的主表面延伸到基底掩埋区域, 与基极掩埋区一起,发射极指在外延层中。 晶体管还包括具有第一导电类型的发射极掩埋区和高于外延层的掺杂水平的掺杂水平。 发射极掩埋区域在与基底掩埋区域相邻的位置嵌入在外延层中。 具有第一导电类型和掺杂水平的沉降弧发射极区域,其高于外延层的掺杂水平并且从发射极指状物内部的主表面延伸到发射极掩埋区域。 发射极掩埋区域和沉陷弧发射极区域在每个发射极指状物中限定,这些区域彼此间隔开并且在彼此之间限定外延层的中心区域。 发射极指的每对部分的沉降弧发射极区域在该对部分的发射极掩埋区域的相互面对的边缘附近延伸。

    Bipolar power transistor with buried base and interdigitated geometry
    7.
    发明授权
    Bipolar power transistor with buried base and interdigitated geometry 失效
    双极功率晶体管,具有埋地和交叉几何形状

    公开(公告)号:US05998855A

    公开(公告)日:1999-12-07

    申请号:US951686

    申请日:1997-10-16

    申请人: Davide Patti

    发明人: Davide Patti

    CPC分类号: H01L29/66303 H01L29/7304

    摘要: A bipolar power transistor of interdigitated geometry having a buried P type base region, a buried N type emitter region, a P type base-contact region, an N type emitter-contact region, connected to an emitter electrode and an N type connection region disposed around the emitter-contact region. The emitter region is buried within the base region in such a way that the buried emitter region and the connection region delimit a P type screen region. The transistor further includes a biasing P type region in contact with the emitter electrode, which extends up to the screen region.

    摘要翻译: 具有掩埋P型基极区域的埋入式几何形状的双极型功率晶体管,与发射电极连接的N型发射极区域,P型基极接触区域,N型发射极 - 接触区域和配置在N型连接区域中的N型发射极 - 围绕发射极 - 接触区域。 发射极区域以埋地发射极区域和连接区域限定P型屏幕区域的方式埋在基极区域内。 晶体管还包括与发射电极接触的偏置P型区域,其延伸到屏幕区域。

    Method for generating a signal representative of the current delivered to a load by a power device and relative power device
    8.
    发明授权
    Method for generating a signal representative of the current delivered to a load by a power device and relative power device 有权
    用于产生表示由功率器件和相关功率器件传送到负载的电流的信号的方法

    公开(公告)号:US08299579B2

    公开(公告)日:2012-10-30

    申请号:US13013513

    申请日:2011-01-25

    IPC分类号: H01L29/66

    CPC分类号: H03K17/0828 H03K17/567

    摘要: An integrated power transistor includes emitter or source regions, and a comb-like patterned metal electrode structure interconnecting the emitter or source regions and defining at least one connection pad. The comb-like patterned metal electrode structure includes a plurality of fingers. A current sensing resistor produces a voltage drop representative of a current delivered to a load by the integrated power transistor. The current sensing resistor includes a portion of a current carrying metal track having a known resistance value and extending between one of the fingers and a connectable point along the current carrying metal track.

    摘要翻译: 集成功率晶体管包括发射极或源极区域以及将发射极或源极区域互连并限定至少一个连接焊盘的梳状图案化金属电极结构。 梳状图案化的金属电极结构包括多个手指。 电流感测电阻器产生代表由集成功率晶体管传送到负载的电流的电压降。 电流感测电阻器包括具有已知电阻值的电流携带金属轨道的一部分,并且在手指之一和沿着载流金属轨道的可连接点之间延伸。

    Integrated vertical resistor structure with reduced dimensions, for high voltage, and manufacturing process thereof
    9.
    发明授权
    Integrated vertical resistor structure with reduced dimensions, for high voltage, and manufacturing process thereof 有权
    集成的垂直电阻器结构,具有减小的尺寸,用于高电压及其制造工艺

    公开(公告)号:US06696916B2

    公开(公告)日:2004-02-24

    申请号:US09746373

    申请日:2000-12-22

    IPC分类号: H01C1012

    摘要: The high-voltage resistor is of the vertical type, and is formed in a chip which includes a high-voltage region and a low-voltage region superimposed on the high-voltage region, both having a first conductivity type. An isolation region, at least partially buried, extends between the high-voltage region and the low-voltage region, and delimits a vertical resistive region connecting the high-voltage region to the low-voltage region.

    摘要翻译: 高压电阻器是垂直型的,并且形成在包括叠加在高电压区域上的高电压区域和低电压区域的芯片中,两者都具有第一导电类型。 至少部分埋置的隔离区域在高电压区域和低压区域之间延伸,并且限定将高电压区域连接到低电压区域的垂直电阻区域。