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    ASSEMBLY STRUCTURE
    1.
    发明申请
    ASSEMBLY STRUCTURE 有权

    公开(公告)号：US20230059607A1

    公开(公告)日：2023-02-23

    申请号：US18045180

    申请日：2022-10-10

    Applicant: Delta Electronics,Inc.

    Inventor： Haoyi YE ,  Jianhong ZENG ,  Yu ZHANG ,  Peiqing HU ,  Ziying ZHOU

    IPC: H05K7/02 ,  H05K7/10 ,  H05K1/14 ,  H05K1/02 ,  G06F1/20 ,  G06F1/18 ,  H05K1/18 ,  H05K7/20

    Abstract: The present disclosure provides an assembly structure for providing power for a chip. The assembly structure includes a circuit board configured to provide a first electrical energy; a chip provided with at least one electrical energy input terminal; and a first power converting module provided with at least one power output terminal. The first power converting module is electrically connected to the circuit board and the chip, converts the first electrical energy to a second electrical energy, and supplies the second electrical energy to the chip. The circuit board, the chip and the first power converting module are stacked; and a projection of the at least one electrical energy input terminal of the chip on the circuit board and a projection of the at least one the power output terminal of the first power converting module on the circuit board, are at least partially overlapped.

    INTEGRATED INDUCTOR AND INTEGRATED INDUCTOR MAGNETIC CORE OF THE SAME
    2.
    发明申请
    INTEGRATED INDUCTOR AND INTEGRATED INDUCTOR MAGNETIC CORE OF THE SAME 审中-公开
    集成电感器及其集成电感器磁芯

    公开(公告)号：US20160300657A1

    公开(公告)日：2016-10-13

    申请号：US15092629

    申请日：2016-04-07

    Applicant: DELTA ELECTRONICS, INC.

    Inventor： Rui WU ,  Jin-Ping ZHOU ,  Yu ZHANG ,  Jian-Hong ZENG ,  Min ZHOU

    IPC: H01F27/24 ,  H01F27/28

    CPC classification number: H01F3/10 ,  H01F37/00 ,  H01F2003/106

    Abstract: An integrated inductor apparatus integrated to be a plurality of inductors is provided. The integrated inductor apparatus includes inductor windings to form inductors and includes at least two windows each having at least one of the inductor windings disposed therein and magnetic core units, each having a closed geometrical structure to form one of the at least two windows, wherein two of the neighboring magnetic core units have a shared magnetic core part. The magnetic core units comprise at least two kinds of material having different magnetic permeability corresponding to different sections of the magnetic core units, wherein the reluctance of the shared magnetic core part is smaller than the reluctance of a non-shared magnetic core part of the magnetic core units.

    Abstract translation: 提供集成为多个电感器的集成电感器装置。 集成电感器设备包括电感器绕组以形成电感器，并且包括至少两个窗口，每个窗口中至少有一个电感器绕组设置在其中，磁芯单元各自具有闭合的几何结构以形成至少两个窗口之一，其中两个窗口 的相邻磁芯单元具有共享磁芯部分。 磁芯单元包括与磁芯单元的不同部分对应的不同导磁率的至少两种材料，其中共享磁芯部分的磁阻小于磁共享磁芯部分的磁阻的磁阻 核心单位。

    ASSEMBLY STRUCTURE
    3.
    发明申请
    ASSEMBLY STRUCTURE 有权

    公开(公告)号：US20250113454A1

    公开(公告)日：2025-04-03

    申请号：US18978021

    申请日：2024-12-12

    Applicant: Delta Electronics,Inc.

    Inventor： Haoyi YE ,  Jianhong ZENG ,  Yu ZHANG ,  Peiqing HU ,  Ziying ZHOU

    IPC: H05K7/02 ,  G06F1/18 ,  G06F1/20 ,  H01L25/16 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K7/10 ,  H05K7/20

    Abstract: The present disclosure provides an assembly structure for providing power for a chip and the assembly includes: a board; a chip, provided with at least one electrical energy input terminal; and a first power converting module, provided with at least one power output terminal, wherein the first power converting module is electrically connected to the chip, converts a first electrical energy to a second electrical energy, and supplies the second electrical energy through the at least one power output terminal to the at least one electrical energy input terminal of the chip, and a back plate; wherein the back plate and the chip are provided at two opposite sides of the board; wherein the board, the chip and the first power converting module are stacked and the first power converting module is at least partially inserted in the back plate.

    ASSEMBLY STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME
    5.
    发明申请
    ASSEMBLY STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME 审中-公开
    具有该装置的组装结构和电子装置

    公开(公告)号：US20160381823A1

    公开(公告)日：2016-12-29

    申请号：US15164214

    申请日：2016-05-25

    Applicant: DELTA ELECTRONICS,INC.

    Inventor： Haoyi YE ,  Jianhong ZENG ,  Yu ZHANG ,  Peiqing HU ,  Ziying ZHOU

    IPC: H05K7/02 ,  H05K1/02 ,  H05K7/20 ,  H05K1/18 ,  H05K7/10

    CPC classification number: H05K7/02 ,  G06F1/188 ,  G06F1/20 ,  H01L25/165 ,  H05K1/0218 ,  H05K1/0262 ,  H05K1/141 ,  H05K1/181 ,  H05K1/182 ,  H05K3/368 ,  H05K7/10 ,  H05K7/2039 ,  H05K2201/10189 ,  H05K2201/10325 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10545

    Abstract: The present disclosure provides an assembly structure for providing power for a chip and an electronic device using the same. The assembly structure includes: a circuit board, configured to provide a first electrical energy; a chip; and a first power converting module, configured to electrically connect the circuit board and the chip, convert the first electrical energy to a second electrical energy, and supply the second electrical energy to the chip, wherein the circuit board, the chip and the first power converting module are stacked to form the assembly structure. The present disclosure assembles a power converting module with a circuit board and a chip in a stacking manner, which may shorten a current path between the power converting module and the chip, reduce current transmission losses, improve efficiency of a system, reduce space occupancy and save system resource.

    Abstract translation: 本公开提供了一种用于为芯片提供电力的组装结构和使用其的电子设备。 组装结构包括：电路板，被配置为提供第一电能; 一个芯片 以及第一电力转换模块，被配置为电连接所述电路板和所述芯片，将所述第一电能转换为第二电能，并将所述第二电能提供给所述芯片，其中所述电路板，所述芯片和所述第一电力 转换模块堆叠形成组装结构。 本公开以堆叠方式组装具有电路板和芯片的功率转换模块，这可以缩短功率转换模块和芯片之间的电流路径，减少电流传输损耗，提高系统的效率，减少占用空间和 保存系统资源。

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