-
公开(公告)号：US20170330846A1
公开(公告)日：2017-11-16
申请号：US15667640
申请日：2017-08-03
Applicant: Delta Electronics (Shanghai) Co., Ltd.
Inventor： Zeng LI , Shou-Yu HONG , Jian-Hong ZENG
IPC: H01L23/66 , H01L23/528 , G11B5/48 , H01L23/522 , H01L29/92 , H01L23/64
CPC classification number: H01L23/66 , G11B5/4873 , H01L21/568 , H01L23/49562 , H01L23/49575 , H01L23/49589 , H01L23/5222 , H01L23/528 , H01L23/5389 , H01L23/642 , H01L24/24 , H01L24/73 , H01L24/82 , H01L27/088 , H01L29/92 , H01L2224/04105 , H01L2224/24137 , H01L2224/24245 , H01L2224/32145 , H01L2224/32245 , H01L2224/33181 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2224/82039 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/19041 , H01L2924/19042 , H01L2924/19104 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A switch circuit package module includes a semiconductor switch unit and a capacitor unit. The semiconductor switch unit includes a first semiconductor switch element and a second semiconductor switch element. The first semiconductor switch element includes sub micro-switch elements, each sub micro-switch element configured with a drain electrode and a source electrode. The second semiconductor switch element includes sub micro-switch elements, each sub micro-switch element configured with a drain electrode and a source electrode. The capacitor unit includes a plurality of capacitors. The semiconductor switch unit includes a plurality of common electrodes, each common electrode connects the source electrode of one sub micro-switch element in the first semiconductor switch element with the drain of one sub micro-switch element in the second semiconductor switch element and is disposed adjacent to at least one drain electrode from the first semiconductor switch element or one source electrode from the second semiconductor switch element.
-
公开(公告)号：US20150180351A1
公开(公告)日：2015-06-25
申请号：US14581096
申请日：2014-12-23
Applicant: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
Inventor： Zeng LI , Shou-Yu HONG , Jian-Hong ZENG , Yi-Cong XIE
Abstract: Disclosed herein is a power electronic circuit having a reference ground and a differential mode loop unit. The differential mode loop unit has a capacitance component, a switch and an electronic component, wherein the capacitance component has a first end, the switch has a first end connecting in series with the capacitance component, the electronic component has a first end, the electronic component connects in series with the capacitance component and the switch, the capacitance component and switch are packaged in a power module, the power module has a trace and at least one output pin connected to reference ground, wherein the first end of the switch or the first end of the electronic component is only connected to the first end of the capacitance component through the trace, and the first end of the capacitance component is connected to reference ground through the output pin.
Abstract translation: 这里公开了具有参考地和差模回路单元的电力电子电路。 差分模式环路单元具有电容部件，开关和电子部件，其中电容部件具有第一端，开关具有与电容部件串联连接的第一端，电子部件具有第一端，电子部件 组件与电容部件和开关串联连接，电容部件和开关被封装在电源模块中，电源模块具有一个跟踪和至少一个连接到参考接地的输出引脚，其中开关的第一端或 电子部件的第一端仅通过迹线连接到电容部件的第一端，并且电容部件的第一端通过输出引脚连接到参考接地。
-
公开(公告)号：US20150085454A1
公开(公告)日：2015-03-26
申请号：US14330045
申请日：2014-07-14
Applicant: Delta Electronics (Shanghai) Co., Ltd.
Inventor： Shou-Yu HONG , Gan-Yu ZHOU , Jian-Hong ZENG , Zhen-Qing ZHAO
CPC classification number: H01L23/3735 , H01L23/36 , H01L23/4334 , H01L23/49537 , H01L23/49562 , H01L23/49568 , H01L23/49575 , H01L23/49811 , H01L23/49833 , H01L25/072 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H05K1/0265 , H05K2201/10166 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A power module is disclosed. The power module includes a first substrate, a first metal layer, at least one conductive structure and at least one power device. The first metal layer is disposed on the first substrate. The first metal layer has a first thickness d1. The first thickness d1 satisfies: 5 μm≦d1≦50 μm. The conductive structure is disposed at a position different to the first metal layer on the first substrate. The conductive structure has a second thickness d2. The second thickness d2 satisfies: d2≧100 μm. The power device is disposed on the first substrate, the first metal layer or the conductive structure. The driving electrode of the power device is electrically connected to the first metal layer. The power electrode of the power device is electrically coupled to the conductive structure.
Abstract translation: 公开了电源模块。 功率模块包括第一衬底，第一金属层，至少一个导电结构和至少一个功率器件。 第一金属层设置在第一基板上。 第一金属层具有第一厚度d1。 第一厚度d1满足：5μm＆nlE; d1＆nlE;50μm。 导电结构设置在与第一基板上的第一金属层不同的位置处。 导电结构具有第二厚度d2。 第二厚度d2满足：d2≥100μm。 功率器件设置在第一衬底，第一金属层或导电结构上。 功率器件的驱动电极与第一金属层电连接。 功率器件的功率电极电耦合到导电结构。
-
公开(公告)号：US20200015380A1
公开(公告)日：2020-01-09
申请号：US16574060
申请日：2019-09-17
Applicant: Delta Electronics (Shanghai) Co.,Ltd.
Inventor： Jian-Hong ZENG
IPC: H05K7/14
Abstract: A power module includes a heat-dissipating substrate, a first planar power device and a second planar power device. The first planar power device includes a plurality of electrodes disposed on an upper surface of the first planar power device. The second planar power device includes a plurality of electrodes disposed on an upper surface of the second planar power device. Lower surfaces of the first planar power device and the second planar power device are disposed on the heat-dissipating substrate.
-
公开(公告)号：US20180368276A1
公开(公告)日：2018-12-20
申请号：US16124177
申请日：2018-09-06
Applicant: Delta Electronics (Shanghai) Co.,Ltd.
Inventor： Jian-Hong ZENG
IPC: H05K7/14
CPC classification number: H05K7/1432 , H01L2224/05553 , H01L2224/0603 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19104 , H01L2924/19105 , Y10T29/4913 , H01L2924/00 , H01L2924/00012
Abstract: A power module includes a heat-dissipating substrate, a first planar power device and a second planar power device. The first planar power device includes a plurality of electrodes disposed on an upper surface of the first planar power device. The second planar power device includes a plurality of electrodes disposed on an upper surface of the second planar power device. Lower surfaces of the first planar power device and the second planar power device are disposed on the heat-dissipating substrate.
-
Patent Agency Ranking
6.发明申请公开(公告)号：US20150173248A1
公开(公告)日：2015-06-18
申请号：US14568078
申请日：2014-12-11
Applicant: Delta Electronics (Shanghai) Co., Ltd.
Inventor： Jian-Hong ZENG
CPC classification number: H05K7/1432 , H01L2224/05553 , H01L2224/0603 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/13055 , H01L2924/181 , H01L2924/19105 , Y10T29/4913 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A power module includes a heat-dissipating substrate, a first planar power device and a second planar power device. The first planar power device includes a plurality of electrodes disposed on an upper surface of the first planar power device. The second planar power device includes a plurality of electrodes disposed on an upper surface of the second planar power device. Lower surfaces of the first planar power device and the second planar power device are disposed on the heat-dissipating substrate.
Abstract translation: 功率模块包括散热衬底，第一平面功率器件和第二平面功率器件。 第一平面功率器件包括设置在第一平面功率器件的上表面上的多个电极。 第二平面功率器件包括设置在第二平面功率器件的上表面上的多个电极。 第一平面功率器件和第二平面功率器件的下表面设置在散热衬底上。
-
7.发明申请POWER CIRCUIT, CONTROL METHOD, POWER SYSTEM, AND PACKAGE STRUCTURE OF POWER CIRCUIT 有权电源电路，控制方法，电源系统和电源电路的封装结构公开(公告)号：US20150171750A1
公开(公告)日：2015-06-18
申请号：US14571305
申请日：2014-12-16
Applicant: Delta Electronics (Shanghai) Co., Ltd.
Inventor： Jian-Hong ZENG , Fang LUO
CPC classification number: H01L27/0605 , H01L27/085 , H01L29/808 , H02M1/08 , H02M1/36 , H02M3/156 , H02M3/1588 , H02M7/5387 , H02M2001/0058 , H03K17/102 , H03K17/107 , H03K17/567 , H03K17/74 , H03K2017/6875 , Y02B70/1466 , Y02B70/1491
Abstract: A power circuit, control method, power system, and package structure of power circuit are disclosed. The power circuit includes a quasi-cascade power unit. The quasi-cascade power unit includes a normally-on switch, normally-off switch, control unit, first switch unit and second switch unit. The normally-off switch is electrically connected to the normally-on switch in series. The first end and the third end of the control unit are electrically connected to the control end of the normally-off switch and the control end of the normally-on switch, respectively. The first end and the second end of the first switch unit are electrically connected to the control end of the normally-on switch and the second end of the normally-off switch, respectively. The first end and the control end of the second switch unit are electrically connected to the second end of the control unit and the second end of the normally-on switch, respectively.
Abstract translation: 公开了电源电路的电源电路，控制方法，电源系统和封装结构。 电源电路包括准级联功率单元。 准级联功率单元包括常开开关，常开开关，控制单元，第一开关单元和第二开关单元。 常开开关与常开开关串联电连接。 控制单元的第一端和第三端分别电连接到常开开关的控制端和常开开关的控制端。 第一开关单元的第一端和第二端分别电连接到常开开关的控制端和常开开关的第二端。 第二开关单元的第一端和控制端分别电连接到控制单元的第二端和常开开关的第二端。
-
公开(公告)号：US20140117495A1
公开(公告)日：2014-05-01
申请号：US13760079
申请日：2013-02-06
Applicant: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
Inventor： Zeng LI , Shou-Yu HONG , Jian-Hong ZENG
CPC classification number: H01L25/50 , H01L23/49562 , H01L23/49589 , H01L23/642 , H01L24/73 , H01L2224/32145 , H01L2224/32245 , H01L2224/33181 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/19041 , H01L2924/19042 , H01L2924/19104 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H02M1/44 , H02M3/155 , H05K1/0228 , H05K1/162 , H05K1/165 , H05K1/185 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A switch circuit package module includes a semiconductor switch unit and a capacitor unit. The semiconductor switch unit includes sub micro-switch elements. The capacitor unit is arranged at a periphery of the semiconductor switch unit or stacked on a surface of the semiconductor switch unit, such that impedances of commutation loops between the capacitor unit and the sub micro-switch elements are close to or the same with each other.
Abstract translation: 开关电路封装模块包括半导体开关单元和电容器单元。 半导体开关单元包括副微开关元件。 电容器单元布置在半导体开关单元的周围或层叠在半导体开关单元的表面上，使得电容器单元和子微开关元件之间的换向环的阻抗彼此接近或相同 。
-
公开(公告)号：US20150318242A1
公开(公告)日：2015-11-05
申请号：US14798484
申请日：2015-07-14
Applicant: Delta Electronics (Shanghai) Co., Ltd.
Inventor： Zeng LI , Shou-Yu HONG , Jian-Hong ZENG
IPC: H01L23/522 , H01L27/088
CPC classification number: H01L23/66 , G11B5/4873 , H01L21/568 , H01L23/49562 , H01L23/49575 , H01L23/49589 , H01L23/5222 , H01L23/528 , H01L23/5389 , H01L23/642 , H01L24/24 , H01L24/73 , H01L24/82 , H01L27/088 , H01L29/92 , H01L2224/04105 , H01L2224/24137 , H01L2224/24245 , H01L2224/32145 , H01L2224/32245 , H01L2224/33181 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2224/82039 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/19041 , H01L2924/19042 , H01L2924/19104 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A switch circuit package module includes a semiconductor switch unit and a capacitor unit. The semiconductor switch unit includes a first semiconductor switch element and a second semiconductor switch element. The first semiconductor switch element includes sub micro-switch elements, each sub micro-switch element configured with a drain electrode and a source electrode. The second semiconductor switch element includes sub micro-switch elements, each sub micro-switch element configured with a drain electrode and a source electrode. The capacitor unit includes a plurality of capacitors. The semiconductor switch unit includes a plurality of common electrodes, each common electrode connects the source electrode of one sub micro-switch element in the first semiconductor switch element with the drain of one sub micro-switch element in the second semiconductor switch element and is disposed adjacent to at least one drain electrode from the first semiconductor switch element or one source electrode from the second semiconductor switch element.
Abstract translation: 开关电路封装模块包括半导体开关单元和电容器单元。 半导体开关单元包括第一半导体开关元件和第二半导体开关元件。 第一半导体开关元件包括副微开关元件，每个子微开关元件配置有漏电极和源电极。 第二半导体开关元件包括副微开关元件，每个子微开关元件配置有漏电极和源电极。 电容器单元包括多个电容器。 半导体开关单元包括多个公共电极，每个公共电极将第一半导体开关元件中的一个子微开关元件的源电极与第二半导体开关元件中的一个子微开关元件的漏极连接， 邻近于来自第一半导体开关元件的至少一个漏电极或来自第二半导体开关元件的一个源电极。
-
公开(公告)号：US20150318234A1
公开(公告)日：2015-11-05
申请号：US14798419
申请日：2015-07-13
Applicant: Delta Electronics (Shanghai) Co., Ltd.
Inventor： Zeng LI , Shou-Yu HONG , Jian-Hong ZENG
IPC: H01L23/495 , H01L23/64
CPC classification number: H01L25/50 , H01L23/49562 , H01L23/49589 , H01L23/642 , H01L24/73 , H01L2224/32145 , H01L2224/32245 , H01L2224/33181 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/19041 , H01L2924/19042 , H01L2924/19104 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H02M1/44 , H02M3/155 , H05K1/0228 , H05K1/162 , H05K1/165 , H05K1/185 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A switch circuit package module includes at least a semiconductor switch unit and at least a first capacitor unit. The semiconductor switch unit includes a first semiconductor switch element and a second semiconductor switch element. The first semiconductor switch element and the second semiconductor switch element include a plurality of sub micro-switch elements. The capacitor unit includes a plurality of capacitors configured to cooperate with the sub micro-switch elements. The capacitors are arranged in a symmetrical distribution surrounded the semiconductor switch unit, such that impedances of any two symmetrical commutation loops each of which mainly consists of one capacitor and two sub micro-switch elements from the first semiconductor switch element and second semiconductor switch element respectively are close to or the same with each other.
Abstract translation: 开关电路封装模块至少包括半导体开关单元和至少第一电容器单元。 半导体开关单元包括第一半导体开关元件和第二半导体开关元件。 第一半导体开关元件和第二半导体开关元件包括多个子微开关元件。 电容器单元包括配置成与子微开关元件配合的多个电容器。 电容器被布置成围绕半导体开关单元的对称分布，使得任何两个对称换向回路的阻抗分别主要由来自第一半导体开关元件和第二半导体开关元件的一个电容器和两个子微开关元件组成 彼此接近或相同。
-
-
-
-
-
-
-
-
-
Search Results
12
records
(took 0.022 seconds)
