公开(公告)号：US20220186089A1

公开(公告)日：2022-06-16

申请号：US17602545

申请日：2020-04-07

Applicant: Denka Company Limited

Inventor： Ippei TAKASAKI ,  Kazuyuki IGARASHI ,  Tomoyuki KANAI ,  Yukihiko YAMASHITA

IPC: C09J11/08 ,  C08F220/18 ,  C08F283/12 ,  C08F283/06 ,  C08J3/22 ,  C09J133/10 ,  C09J11/04 ,  C09J9/02 ,  C09K5/14 ,  H05K7/20

Abstract: Disclosed is the copolymer having a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B having a cationic group, and a (meth)acrylic monomer unit C other than the (meth)acrylic monomer unit A and the (meth)acrylic monomer unit B.

公开(公告)号：US20230374363A1

公开(公告)日：2023-11-23

申请号：US18030210

申请日：2021-10-05

Applicant: Denka Company Limited

Inventor： Kazuyuki IGARASHI ,  Masao ONOZUKA

IPC: C09K5/14 ,  C08L83/04 ,  C08L83/10 ,  C08K3/22 ,  C08K3/38 ,  C08K3/28 ,  H05K7/20

CPC classification number: C09K5/14 ,  C08L83/04 ,  C08L83/10 ,  C08K3/22 ,  C08K3/38 ,  C08K3/28 ,  H05K7/2039 ,  C08L2207/32 ,  C08L2205/025 ,  C08L2205/03 ,  C08K2201/001 ,  C08K2201/014 ,  C08K2003/2227 ,  C08K2003/385 ,  C08K2003/282 ,  C08K2003/222

Abstract: The thermally conductive resin composition containing: 5 to 95 parts by weight of a copolymer (a) having a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B having a cationic group, and a silicone (meth)acrylic monomer unit C; 95 to 5 parts by weight of a silicone resin (b); and 500 to 3000 parts by weight of a thermally conductive filler (c) having a thermal conductivity of 10 W/mK or more, wherein a total content of the copolymer (a) and the silicone resin (b) is 100 parts by weight.

公开(公告)号：US20230374189A1

公开(公告)日：2023-11-23

申请号：US18030253

申请日：2021-10-05

Applicant: Denka Company Limited

Inventor： Kazuyuki IGARASHI ,  Masao ONOZUKA

IPC: C08F290/06 ,  H05K7/20 ,  C08L83/04 ,  C08K9/06

CPC classification number: C08F290/068 ,  H05K7/20463 ,  C08L83/04 ,  C08K9/06 ,  C08K2201/001 ,  C08L2312/00 ,  C08K2201/005

Abstract: The thermally conductive resin composition containing: 5 to 95 parts by weight of a copolymer (a) having a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B having a cationic group, and a silicone (meth)acrylic monomer unit C; 95 to 5 parts by weight of a silicone resin (b); and 500 to 3000 parts by weight of a thermally conductive filler (c) having a thermal conductivity of 10 W/mK or more, wherein a total content of the copolymer (a) and the silicone resin (b) is 100 parts by weight, and the silicone resin (b) includes a crosslinked silicone resin (b-1), wherein a content of the crosslinked silicone resin (b-1) is 5 to 100 mass % based on the total amount of the silicone resin (b).