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公开(公告)号：US20240032191A1
公开(公告)日：2024-01-25
申请号：US18375800
申请日：2023-10-02
Applicant: Denka Company Limited
Inventor： Yusuke MASUDA , Naoki OGAWA
IPC: H05K1/03
CPC classification number: H05K1/0366 , H05K2201/0141 , H05K2201/0125 , H05K2201/0129
Abstract: The present invention provides an LCP extruded film comprising a thermoplastic liquid crystal polymer and having a thickness of 15 μm or more and 300 μm or less, wherein coefficients of linear thermal expansion in a MD direction and a TD direction at 23 to 200° C. as measured by a TMA method according to JIS K7197 are each within a range of −30 to 55 ppm/K, and the following conditions (A) and/or (B) are satisfied, and a method for manufacturing the same, an LCP extruded film for stretch treatment, an LCP stretched film, a heat-shrinkable LCP stretched film, an insulating material for a circuit substrate, and a metal foil-clad laminate:
(A) a degree of orientation α1(%) of a film surface S1 exposed and a degree of orientation α2(%) of a film surface S2 located at a depth of 5 μm from the film surface S1 satisfy a relationship of −4.0≤[(α2−α1)/α1]×100≤0.0;
(B) a hardness H1 at a point of a depth of 1 μm located at a position of 1 μm from a film surface in a thickness direction and a hardness H2 at a thickness center point, as measured by subjecting a film cross section in parallel with a MD direction to a nanoindentation method, satisfy −10.0≤100×(H2−H1)/H1≤0.0.-
公开(公告)号：US20240043635A1
公开(公告)日：2024-02-08
申请号：US18266228
申请日：2021-12-07
Applicant: Denka Company Limited
Inventor： Yusuke MASUDA , Naoki OGAWA
CPC classification number: C08J5/18 , B32B5/024 , B32B15/14 , B32B15/08 , B32B27/12 , H05K1/0366 , B29L2031/3425
Abstract: The present invention provides an LCP extruded film comprising a thermoplastic liquid crystal polymer and having a thickness of 15 μm or more and 300 μm or less, wherein coefficients of linear thermal expansion in a MD direction and a TD direction at 23 to 200° C. as measured by a TMA method according to JIS K7197 are each within a range of −30 to 55 ppm/K, and the following conditions
(A) and/or (B) are satisfied, and a method for manufacturing the same, an LCP extruded film for stretch treatment, an LCP stretched film, a heat-shrinkable LCP stretched film, an insulating material for a circuit substrate, and a metal foil-clad laminate:
(A) a degree of orientation α1(%) of a film surface S1 exposed and a degree of orientation α2(%) of a film surface S2 located at a depth of 5 μm from the film surface S1 satisfy a relationship of −4.0≤[(α2−α1)/α1]×100≤0.0;
(B) a hardness H1 at a point of a depth of 1 μm located at a position of 1 μm from a film surface in a thickness direction and a hardness H2 at a thickness center point, as measured by subjecting a film cross section in parallel with a MD direction to a nanoindentation method, satisfy −10.0≤100×(H2−H1)/H1≤0.0.-
3.发明公开公开(公告)号：US20230371188A1
公开(公告)日：2023-11-16
申请号：US18027885
申请日：2021-09-21
Applicant: Denka Company Limited
Inventor： Shun UCHIYAMA , Yusuke MASUDA
CPC classification number: H05K3/4632 , H05K1/03 , H05K2201/0129 , H05K2201/029 , H05K2201/0209 , H05K2203/06
Abstract: Provided are an insulating material for a circuit substrate, which has excellent dielectric characteristics in a high frequency area, has low coefficients of linear thermal expansion all in a MD direction, a TD direction, and a ZD direction, is easily manufactured and has excellent productivity, and a method for manufacturing the same and a metal foil-clad laminate. An insulating material for a circuit substrate, comprising a laminate having a thermoplastic liquid crystal polymer film and a woven fabric of an inorganic fiber, wherein the thermoplastic liquid crystal polymer film contains an inorganic filler, and the laminate is a dry laminate in which the thermoplastic liquid crystal polymer film and the woven fabric are thermocompression bonded.
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公开(公告)号：US20220250371A1
公开(公告)日：2022-08-11
申请号：US17622516
申请日：2020-06-19
Applicant: Denka Company Limited
Inventor： Naoki OGAWA , Yusuke MASUDA
IPC: B32B27/36 , B32B37/06 , B32B15/08 , B32B15/20 , B32B15/18 , C08G63/06 , C08G63/60 , C08G63/78 , C08J5/18 , C08J5/12
Abstract: Provided is an LCP extruded film that can increase process tolerance in manufacture of a flexible laminate, without excessively impairing the basic performance of the liquid crystal polymer. Provided are an LCP extruded film and the like that allow a flexible laminate having high peel strength to a metal foil to be easily obtained under mild manufacturing conditions as compared with the prior art. An LCP extruded film 11 comprising: an aromatic polyester-based liquid crystal polymer at least having at least one selected from the group consisting of para-hydroxybenzoic acid, terephthalic acid, isophthalic acid, 6-naphthalenedicarboxylic acid, 4,4′-biphenol, bisphenol A, hydroquinone, 4,4-dihydroxybiphenol, ethylene terephthalate and derivatives thereof, and 6-hydroxy-2-naphthoic acid and derivatives thereof, as monomer components, the LCP extruded film having a dissolution rate in pentafluorophenol at 60° C. of 25% or more.
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公开(公告)号：US20230368948A1
公开(公告)日：2023-11-16
申请号：US18027887
申请日：2021-09-21
Applicant: Denka Company Limited
Inventor： Shun UCHIYAMA , Yusuke MASUDA
Abstract: Provided are a novel insulating material for a circuit substrate and a novel metal foil-clad laminate, and the like, in which the anisotropy of coefficients of linear thermal expansion in a MD direction, a TD direction, and a ZD direction is reduced. An insulating material for a circuit substrate, comprising a thermoplastic liquid crystal polymer film, wherein ratios of average coefficients of linear thermal expansion in a MD direction, a TD direction, and a thickness direction (CTEMD, CTETD, CTEZ) at 23 to 200° C., as measured by a TMA method according to JIS K7197, satisfy the following expressions (I) to (III):
0.5≤CTEMD/CTETD≤1.5 (I)
0.10≤CTEMD/CTEZ≤1.00 (II)
0.10≤CTETD/CTEZ≤1.00 (III).-
Patent Agency Ranking
公开(公告)号：US20220418111A1
公开(公告)日：2022-12-29
申请号：US17780754
申请日：2020-11-20
Applicant: Denka Company Limited
Inventor： Naoki OGAWA , Yusuke MASUDA
Abstract: Provided is a method for manufacturing an LCP film for a circuit substrate capable of achieving an LCP film for a circuit substrate having a low coefficient of linear thermal expansion and excellent dimensional stability, without excessively impairing excellent basic performance possessed by the liquid crystal polyester, such as mechanical characteristics, electrical characteristics, and heat resistance. The method for manufacturing an LCP film for a circuit substrate at least comprising: a composition provision step of providing an LCP resin composition at least containing 100 parts by mass of a liquid crystal polyester and 1 to 20 parts by mass of a polyarylate; a film forming step of T-die melt-extruding the LCP resin composition to form a T-die melt-extruded LCP film having a coefficient of linear thermal expansion (α2) in a TD direction of 50 ppm/K or more; and a pressurizing and heating step of subjecting the T-die melt-extruded LCP film to pressure and heat treatment to obtain an LCP film for a circuit substrate having a coefficient of linear thermal expansion (α2) in the TD direction of 16.8±12 ppm/K.
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公开(公告)号：US20250001733A1
公开(公告)日：2025-01-02
申请号：US18687084
申请日：2022-09-01
Applicant: Denka Company Limited
Inventor： Ryota ISHIZUKA , Yusuke MASUDA , Naoki OGAWA
IPC: B32B15/08 , B29C48/21 , B29C48/30 , B29K67/00 , B29K69/00 , B29K105/00 , B32B5/02 , B32B37/24 , B32B38/10
Abstract: To provide, for example, a novel LCP extruded film having high metal foil peel strength, and an insulating material for a circuit substrate and a metal foil-clad laminate each using the LCP extruded film, as well as a novel method for manufacturing an LCP extruded film having high metal foil peel strength. An LCP extruded film having a film surface S1 and comprising a thermoplastic liquid crystal polymer, wherein a contact angle σ1 of the film surface S1 of the LCP extruded film with water after one day from constant temperature and humidity treatment at 23° C. and 50% RH is 60° or more and 80° or less, a contact angle σ7 of the film surface S1 of the LCP extruded film with water after 7 days from constant temperature and humidity treatment at 23° C. and 50% RH is 60° or more and 80° or less, and a rate of decrease ((σ7−σ1)/σ1) of the contact angle σ7 relative to the contact angle σ1 is 10.0% or less.
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公开(公告)号：US20240025102A1
公开(公告)日：2024-01-25
申请号：US18375798
申请日：2023-10-02
Applicant: Denka Company Limited
Inventor： Yusuke MASUDA , Naoki OGAWA
CPC classification number: B29C48/23 , B29C48/022 , B29C48/08 , B29C48/146 , B29C48/78 , C09K19/3809 , C09K2219/03
Abstract: The present invention provides an LCP extruded film comprising a thermoplastic liquid crystal polymer and having a thickness of 15 μm or more and 300 μm or less, wherein coefficients of linear thermal expansion in a MD direction and a TD direction at 23 to 200° C. as measured by a TMA method according to JIS K7197 are each within a range of −30 to 55 ppm/K, and the following conditions (A) and/or (B) are satisfied, and a method for manufacturing the same, an LCP extruded film for stretch treatment, an LCP stretched film, a heat-shrinkable LCP stretched film, an insulating material for a circuit substrate, and a metal foil-clad laminate:
(A) a degree of orientation α1 (%) of a film surface S1 exposed and a degree of orientation α2 (%) of a film surface S2 located at a depth of 5 μm from the film surface S1 satisfy a relationship of −4.0≤[(α2−α1)/α1]×100≤0.0;
(B) a hardness H1 at a point of a depth of 1 μm located at a position of 1 μm from a film surface in a thickness direction and a hardness H2 at a thickness center point, as measured by subjecting a film cross section in parallel with a MD direction to a nanoindentation method, satisfy −10.0≤100×(H2−H1)/H1≤0.0.-
公开(公告)号：US20220105707A1
公开(公告)日：2022-04-07
申请号：US17425680
申请日：2020-01-22
Applicant: Denka Company Limited
Inventor： Ikuka INODA , Yusuke MASUDA , Shun UCHIYAMA , Takako EBISUZAKI
Abstract: A method of producing a double-sided metal-clad laminate comprises a supplying step of supplying an insulating film interposed between two metal foils continuously to between a pair of endless belts, a heat and pressure applying step of forming a laminate of the insulating film and the metal foils by heating and applying a pressure to the insulating film and the metal foils under predetermined condition while the insulating film is interposed by the two metal foils in between the endless belts, and a cooling step of cooling the laminate, wherein the insulating film has a thickness of 10 to 500 μm, a degree of planar orientation of 30% or more, an average coefficient of linear expansion in an MD direction of −40 to 0 ppm/K and an average coefficient of linear expansion in a TD direction of 0 to 120 ppm/K.
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公开(公告)号：US20210162721A1
公开(公告)日：2021-06-03
申请号：US16954340
申请日：2019-01-23
Applicant: DENKA COMPANY LIMITED
Inventor： Ryosuke YANAKA , Yusuke MASUDA
IPC: B32B25/04 , C08F220/14 , C08F212/08 , C08F236/06 , B32B25/16 , B65D65/40
Abstract: A laminated sheet with a cover material, an adhesive cover tape, and an electronic component packaging container molded. A laminated sheet having a surface layer on both sides of a substrate layer, and the substrate layer includes 30 to 70 mass % of a component mentioned below, 70 to 30 mass % of a component mentioned below, and 0 to 30 mass % of a recycled material of the laminated sheet to the total mass of the substrate layer. The component is a rubber modified (meth)acrylic acid ester-vinyl aromatic hydrocarbon copolymer having a conjugated diene rubber component content of 5 to 15 mass %. The component is a vinyl aromatic hydrocarbon-conjugated diene block copolymer containing 15 to 30 mass % of monomeric units derived from conjugated dienes. The component is at least one polymer selected from the group consisting of a vinyl aromatic hydrocarbon polymer and a rubber modified vinyl aromatic hydrocarbon polymer.
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