METHOD FOR AVOIDING CONTAMINATION AND EUV-LITHOGRAPHY-SYSTEM
    1.
    发明申请
    METHOD FOR AVOIDING CONTAMINATION AND EUV-LITHOGRAPHY-SYSTEM 审中-公开
    避免污染和非线性系统的方法

    公开(公告)号:US20120086925A1

    公开(公告)日:2012-04-12

    申请号:US13267663

    申请日:2011-10-06

    IPC分类号: G03B27/52

    摘要: A method for preventing contaminating gaseous substances (18) from passing through an opening (17b) in a housing (4a) of an EUV lithography apparatus (1), wherein at least one optical element for guiding EUV radiation (6) is arranged in the housing (4a). The method involves: generating at least one gas flow (21a, 21b) which deflects the contaminating substances (18, 18′), and in particular is directed counter to the flow direction (Z) thereof, in the region of the opening (17b). The gas flow (21a, 21b) and the EUV radiation (6) are generated in pulsed fashion and the pulse rate of the gas flow (21a, 21b) is defined in a manner dependent on the pulse rate of the contaminating substances (18, 18′) released under the action of the pulsed EUV radiation (6), wherein both pulse rates are preferably equal in magnitude, and wherein, in the region of the opening (17b), the gas pulses temporally overlap the pulses of the contaminating substances (18, 18′). An associated EUV lithography apparatus at which the method can be carried out is also disclosed.

    摘要翻译: 一种用于防止污染气体物质(18)穿过EUV光刻设备(1)的壳体(4a)中的开口(17b)的方法,其中至少一个用于引导EUV辐射(6)的光学元件布置在 住房(4a)。 该方法包括:产生使污染物质(18,18')偏转的至少一个气流(21a,21b),特别是在开口(17b)的区域中相对于其流动方向(Z)反向 )。 以脉冲方式产生气流(21a,21b)和EUV辐射(6),气流(21a,21b)的脉率以取决于污染物质(18, 18')在脉冲EUV辐射(6)的作用下释放,其中两个脉冲速率优选地相等,并且其中在开口区域(17b)中,气体脉冲在时间上与污染物质的脉冲重叠 (18,18')。 还公开了可以执行该方法的相关EUV光刻设备。

    COMPONENT OF AN EUV OR UV LITHOGRAPHY APPARATUS AND METHOD FOR PRODUCING IT
    2.
    发明申请
    COMPONENT OF AN EUV OR UV LITHOGRAPHY APPARATUS AND METHOD FOR PRODUCING IT 有权
    EUV或UV光刻设备的组件及其生产方法

    公开(公告)号:US20120120378A1

    公开(公告)日:2012-05-17

    申请号:US13360374

    申请日:2012-01-27

    IPC分类号: G03B27/52 B32B38/00

    摘要: To improve the bonding of two parts (401, 403) of a component (400) of an EUV or UV lithography apparatus such that the probability of occurrence of additional stress over time in the bonded parts (401, 403) is lessened, a component (400) of an EUV or UV lithography apparatus comprising two parts (401, 403) bonded to each other by adhesive material (405) is proposed, wherein the adhesive material (405) is coated with a protective layer (407) insulating the adhesive material (405) from the surrounding gas environment.

    摘要翻译: 为了改善EUV或UV光刻设备的部件(400)的两个部分(401,403)的粘合,使得在接合部分(401,403)中发生附加应力随时间的可能性减小,部件 提出了包括通过粘合材料(405)彼此结合的两个部分(401,403)的EUV或UV光刻设备(400),其中粘合材料(405)涂覆有绝缘粘合剂的保护层(407) 材料(405)来自周围的气体环境。

    METHOD FOR BONDING BODIES AND COMPOSITE BODY
    3.
    发明申请
    METHOD FOR BONDING BODIES AND COMPOSITE BODY 有权
    用于接合体和复合体的方法

    公开(公告)号:US20120082823A1

    公开(公告)日:2012-04-05

    申请号:US13248987

    申请日:2011-09-29

    IPC分类号: B32B3/00 B32B37/14 B32B37/12

    摘要: A method for bonding a first body (2) to a second, panel-shaped body (3) at bonding surfaces (2a, 3a) lying opposite each other, the second body (3) projecting in at least one direction (X) beyond an edge (2′) of the first body (2). The method includes: producing a plurality of spacers (4a to 4e, 4a′ to 4e′) on at least one of the bonding surfaces (2a), applying adhesive (5) into intermediate spaces (6a to 6d) between the spacers beyond an outer spacer (4e, 4e′) as far as an adhesive periphery (5a), which is formed at an edge (2′) of the first body (2), and bonding the bodies (2, 3) by bringing the bonding surfaces (2a, 3a) into contact at the spacers (4a′ to 4e′). A prescribed distance (d) between the adhesive periphery (5a) and the outermost spacer (4e) is set to provide a desired state of deformation of the panel-shaped body (3) after a shrinkage of the applied adhesive (5) (e.g. minimized bending of the body.) In an associated composite body (1), the prescribed distance (d) lies between 20 μm and 250 μm, preferably between 30 μm and 200 μm, in particular between 40 μm and 150 μm.

    摘要翻译: 一种在彼此相对的接合表面(2a,3a)处将第一主体(2)接合到第二板状主体(3)的方法,所述第二主体(3)在至少一个方向(X)上突出超过 第一主体(2)的边缘(2')。 该方法包括:在至少一个接合表面(2a)上产生多个间隔物(4a至4e,4a'至4e'),将粘合剂(5)施加到隔离件之间的中间空间(6a至6d)中, 外部间隔件(4e,4e')直到形成在第一主体(2)的边缘(2')处的粘合周边(5a),并且通过使粘合表面 (2a,3a)在间隔件(4a'至4e')处接触。 在粘合剂周边(5a)和最外侧间隔物(4e)之间的规定距离(d)被设定为在所施加的粘合剂(5)收缩之后提供所述面板状体(3)的期望变形状态(例如, 最小化身体的弯曲。)在相关联的复合体(1)中,规定距离(d)在20μm和250μm之间,优选在30μm和200μm之间,特别是在40μm和150μm之间。