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    Expression of protein C
    1.
    发明授权
    Expression of protein C 失效
    蛋白C的表达

    公开(公告)号：US4959318A

    公开(公告)日：1990-09-25

    申请号：US924462

    申请日：1986-10-29

    申请人： Donald C. Foster ,  Mark J. Murray ,  Kathleen L. Berkner

    发明人： Donald C. Foster ,  Mark J. Murray ,  Kathleen L. Berkner

    IPC分类号： C12N5/10 ,  C12N9/64 ,  C12N9/74 ,  C12N15/09 ,  C12N15/12 ,  C12N15/85 ,  C12P21/02 ,  C12R1/91

    CPC分类号： C12N15/85 ,  C12N9/6429 ,  C12N9/6464 ,  C12N9/647 ,  C12Y304/21005 ,  C12Y304/21069 ,  C07K2319/02 ,  Y10S435/849

    摘要： Genomic and cDNA sequences coding for a protein having substantially the same biological activity as human protein C and recombinant transfer vectors comprising these sequences are disclosed.Methods are disclosed for producing a protein which has substantially the same biological activity as human protein C. The protein, which may be in the form of activated protein C, is produced by mammalian host cells transfected with a plasmid capable of integration in mammalian host cell DNA. The plasmid includes a promoter followed downstream by a nucleotide sequence which encodes a protein having substantially the same structure and/or activity as human protein C, the nucleotide sequence being followed downstream by a polyadenylation signal.

    摘要翻译： 公开了编码具有与人蛋白C基本上相同的生物活性的蛋白质的基因组和cDNA序列以及包含这些序列的重组转移载体。 公开了用于生产具有与人蛋白C基本上相同的生物学活性的蛋白质的方法。可以是活化蛋白C形式的蛋白质由用能够整合在哺乳动物宿主细胞中的质粒转染的哺乳动物宿主细胞产生 脱氧核糖核酸。 该质粒包含下游的启动子，后者是编码具有与人蛋白C基本上相同的结构和/或活性的蛋白质的核苷酸序列，该核苷酸序列在多聚腺苷酸化信号的下游。

    Making leadframe semiconductor packages with stacked dies and interconnecting interposer
    10.
    发明授权
    Making leadframe semiconductor packages with stacked dies and interconnecting interposer 有权
    制造具有堆叠管芯和互连插件的引线框半导体封装

    公开(公告)号：US06603072B1

    公开(公告)日：2003-08-05

    申请号：US09828046

    申请日：2001-04-06

    申请人： Donald C. Foster ,  David A. Zoba

    发明人： Donald C. Foster ,  David A. Zoba

    IPC分类号： H05K702

    CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

    摘要： In a leadframe type of semiconductor package, the internal electrical interconnectability of and signal routing between multiple dies laminated in a stack with the die paddle of the leadframe is substantially enhanced by laminating an “interposer” in the stack. The interposer comprises a dielectric layer and a metallic layer patterned to include wire bonding pads arrayed around the periphery of a surface thereof, and circuit traces interconnecting selected ones of the wire bonding pads in a single plane across the horizontal span of the interposer. In packages having multiple dies and relatively few leads, the bonding pads and circuit traces can be flexibly arranged on the interposer by the package designer to substantially increase the number and routings of internal electrical interconnections otherwise possible between the dies and between the dies and the leads of the package.

    摘要翻译： 在引线框类型的半导体封装中，通过在堆叠中层叠“插入件”，基本上增强了与引线框的管芯焊盘层叠在堆叠中的多个管芯之间的内部电互连性和信号路由。 插入器包括电介质层和金属层，其被图案化以包括围绕其表面的周边排列的引线接合焊盘，以及在穿过插入器的水平跨度的单个平面中将选定引线接合焊盘互连的电路迹线。 在具有多个管芯和相对较少的引线的封装中，接合焊盘和电路迹线可以通过封装设计者灵活地布置在插入器上，以显着地增加在管芯之间和管芯与引线之间可能的内部电互连的数量和布线 的包装。