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公开(公告)号：US09627582B2
公开(公告)日：2017-04-18
申请号：US13536276
申请日：2012-06-28
申请人： Donald L. McDaniel, Jr. , Michael Lim , Michael Gregory Brown , Scott W. Duncan , Andrei Kazmierski , Paul Panaccione
发明人： Donald L. McDaniel, Jr. , Michael Lim , Michael Gregory Brown , Scott W. Duncan , Andrei Kazmierski , Paul Panaccione
IPC分类号： H01L29/22 , H01L33/38 , H01L25/075 , H01L33/14 , H01L33/58 , G02B5/00 , G02B21/06 , G03B21/20 , H01L33/20 , H01L33/24 , H01L33/54 , G02B21/36
CPC分类号： H01L33/38 , G02B5/005 , G02B21/06 , G02B21/361 , G03B21/2033 , G03B21/208 , H01L25/0753 , H01L33/145 , H01L33/20 , H01L33/24 , H01L33/54 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to light-emitting diodes (LEDs), and related components, processes, systems, and methods. In certain embodiments, an LED that provides improved optical and thermal efficiency when used in optical systems with a non-rectangular input aperture (e.g., a circular aperture) is described. In some embodiments, the emission surface of the LED and/or an emitter output aperture can be shaped (e.g., in a non-rectangular shape) such that enhanced optical and thermal efficiencies are achieved. In addition, in some embodiments, chip designs and processes that may be employed in order to produce such devices are described.
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公开(公告)号：US20130146932A1
公开(公告)日：2013-06-13
申请号：US13536276
申请日：2012-06-28
申请人： Donald L. McDaniel, JR. , Michael Lim , Michael Gregory Brown , Scott W. Duncan , Andrei Kazmierski
发明人： Donald L. McDaniel, JR. , Michael Lim , Michael Gregory Brown , Scott W. Duncan , Andrei Kazmierski
IPC分类号： H01L33/38
CPC分类号： H01L33/38 , G02B5/005 , G02B21/06 , G02B21/361 , G03B21/2033 , G03B21/208 , H01L25/0753 , H01L33/145 , H01L33/20 , H01L33/24 , H01L33/54 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to light-emitting diodes (LEDs), and related components, processes, systems, and methods. In certain embodiments, an LED that provides improved optical and thermal efficiency when used in optical systems with a non-rectangular input aperture (e.g., a circular aperture) is described. In some embodiments, the emission surface of the LED and/or an emitter output aperture can be shaped (e.g., in a non-rectangular shape) such that enhanced optical and thermal efficiencies are achieved. In addition, in some embodiments, chip designs and processes that may be employed in order to produce such devices are described.
摘要翻译： 本发明涉及发光二极管（LED）及相关组件，工艺，系统和方法。 在某些实施例中，描述了当在具有非矩形输入孔径（例如圆形孔径）的光学系统中使用时提供改进的光学和热效率的LED。 在一些实施例中，LED和/或发射器输出孔的发射表面可以被成形（例如，以非矩形形状），使得实现增强的光学和热效率。 此外，在一些实施例中，描述了可以用于产生这种装置的芯片设计和工艺。
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公开(公告)号：US08872217B2
公开(公告)日：2014-10-28
申请号：US13447731
申请日：2012-04-16
申请人： Michael Gregory Brown , Yves Bertic , Scott W. Duncan , Hong Lu , Ravi Rajan , John Woodhouse , Feng Yun , Hao Zhu
发明人： Michael Gregory Brown , Yves Bertic , Scott W. Duncan , Hong Lu , Ravi Rajan , John Woodhouse , Feng Yun , Hao Zhu
摘要： Electronic devices involving contact structures, and related components, systems and methods associated therewith are described. The contact structures are particularly suitable for use in a variety of light-emitting devices, including LEDs.
摘要翻译： 描述了涉及接触结构的电子设备以及与之相关的组件，系统和方法。 接触结构特别适用于各种发光器件，包括LED。
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公开(公告)号：US07799585B2
公开(公告)日：2010-09-21
申请号：US12272120
申请日：2008-11-17
IPC分类号： H01L21/58
CPC分类号： H01L33/20 , H01L33/0079 , H01L2933/0083
摘要： Light-emitting device methods are disclosed.
摘要翻译： 公开了发光器件的方法。
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公开(公告)号：US07521273B2
公开(公告)日：2009-04-21
申请号：US11317584
申请日：2005-12-23
IPC分类号： H01L21/00
CPC分类号： H01L33/20 , H01L33/0079 , H01L2933/0083
摘要： Light-emitting device methods are disclosed.
摘要翻译： 公开了发光器件的方法。
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公开(公告)号：US20120261711A1
公开(公告)日：2012-10-18
申请号：US13447731
申请日：2012-04-16
申请人： Michael Gregory Brown , Yves Bertic , Scott W. Duncan , Hong Lu , Ravi Rajan , John Woodhouse , Feng Yun , Hao Zhu
发明人： Michael Gregory Brown , Yves Bertic , Scott W. Duncan , Hong Lu , Ravi Rajan , John Woodhouse , Feng Yun , Hao Zhu
IPC分类号： H01L33/62
摘要： Electronic devices involving contact structures, and related components, systems and methods associated therewith are described. The contact structures are particularly suitable for use in a variety of light-emitting devices, including LEDs.
摘要翻译： 描述了涉及接触结构的电子设备以及与之相关的组件，系统和方法。 接触结构特别适用于各种发光器件，包括LED。
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公开(公告)号：US07074631B2
公开(公告)日：2006-07-11
申请号：US10794452
申请日：2004-03-05
IPC分类号： H01L21/00
CPC分类号： H01L33/20 , H01L33/0079 , H01L2933/0083 , Y10S438/95 , Y10S438/956
摘要： A method includes disposing a planarization layer on a surface of a layer of semiconductor material and disposing a lithography layer on a surface of the planarization layer. The method also includes performing nanolithography to remove at least a portion of the planarization layer, at least a portion of the lithography layer and at least a portion of the layer of semiconductor material, thereby forming a dielectric function in the surface of the layer of semiconductor material that varies spatially according to a pattern.
摘要翻译： 一种方法包括在半导体材料层的表面上设置平坦化层并在平坦化层的表面上设置光刻层。 该方法还包括进行纳米光刻以去除平坦化层的至少一部分，光刻层的至少一部分和半导体材料层的至少一部分，从而在半导体层的表面形成介电功能 根据图案在空间上变化的材料。
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公开(公告)号：US20090137072A1
公开(公告)日：2009-05-28
申请号：US12272120
申请日：2008-11-17
IPC分类号： H01L21/62
CPC分类号： H01L33/20 , H01L33/0079 , H01L2933/0083
摘要： Light-emitting device methods are disclosed.
摘要翻译： 公开了发光器件的方法。
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公开(公告)号：US07083993B2
公开(公告)日：2006-08-01
申请号：US10724005
申请日：2003-11-26
IPC分类号： H01L21/00
CPC分类号： H01L33/20 , H01L33/0079 , H01L2933/0083
摘要： Methods of making multi-layer light-emitting devices and related components and systems are disclosed. The light-emitting devices can include a layer of reflective material bonded with a layer of p-doped material. The reflective material can be capable of reflecting at least about 50% of light generated by a light-generating region that impinges on the layer of reflective material.
摘要翻译： 公开了制造多层发光装置及相关组件和系统的方法。 发光器件可以包括与p掺杂材料层结合的反射材料层。 反射材料能够反射至少约50％的光照射在反射材料层上的光产生区域产生的光。
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公开(公告)号：US20090023239A1
公开(公告)日：2009-01-22
申请号：US12236779
申请日：2008-09-24
申请人： Alexei A. Erchak , Michael Lim , Scott W. Duncan , John W. Graff , Milan Singh Minsky , Matthew Weig
发明人： Alexei A. Erchak , Michael Lim , Scott W. Duncan , John W. Graff , Milan Singh Minsky , Matthew Weig
IPC分类号： H01L21/00
CPC分类号： H01L33/0079 , G03B21/204 , H01L27/153 , H01L2224/48091 , H04N9/315 , H01L2924/00014
摘要： Light-emitting devices, and related components, processes, systems and methods are disclosed.
摘要翻译： 公开了发光器件及相关部件，工艺，系统和方法。
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