-
公开(公告)号：US5751585A
公开(公告)日：1998-05-12
申请号：US615049
申请日：1996-03-12
CPC分类号： B23K26/083 , B23K26/082 , B23K26/0876 , G05B19/39 , H05K3/0038 , G05B2219/34047 , G05B2219/34391 , G05B2219/36029 , G05B2219/41331 , G05B2219/41457 , G05B2219/42209 , G05B2219/42219 , G05B2219/45041 , G05B2219/45139 , H05K2203/0165 , H05K2203/108 , H05K3/0008 , H05K3/0017
摘要： A multi-rate positioner system (50) receives unpanelized positioning commands from a database storage subsystem (64), profiles the commands (72) into a half-sine positioning signal, and further processes the signal into a low-frequency positioning signal (LFP) and a high-frequency positioning signal (HFP) for actuating respective slow (56, 58) and fast (54) positioners to target locations on a workpiece (62). The slow and fast positioners move without necessarily stopping in response to a stream of positioning command data while coordinating their individually moving positions to produce temporarily stationary tool positions (140) over target locations defined by the database. The multi-rate positioning system reduces the fast positioner movement range requirement while providing significantly increased tool processing throughput.
摘要翻译： 多速率定位器系统（50）从数据库存储子系统（64）接收未通用的定位命令，将命令（72）分配成半正弦定位信号，并进一步将该信号处理成低频定位信号（LFP ）和用于致动相应的缓慢（56,58）和快速（54）定位器的目标位置的高频定位信号（HFP）。 响应于定位指令数据流而缓慢且快速的定位器移动而不必停止，同时协调其单独移动的位置，以在由数据库定义的目标位置上产生临时固定的工具位置（140）。 多速率定位系统降低了快速定位器移动范围的要求，同时提供了显着增加的刀具处理吞吐量。
-
公开(公告)号：US5847960A
公开(公告)日：1998-12-08
申请号：US728619
申请日：1996-10-10
CPC分类号： B23K26/08 , B23K26/082 , B23K26/083 , B23K26/0853 , G05B19/39 , H05K3/0038 , G05B2219/34047 , G05B2219/34391 , G05B2219/36029 , G05B2219/41331 , G05B2219/42209 , G05B2219/42219 , G05B2219/45041 , G05B2219/45139 , H05K2203/0165 , H05K2203/108 , H05K3/0008 , H05K3/0017
摘要： A multi-rate, multi-head positioner (150) receives and processes unpanelized positioning commands to actuate slow stages (56, 58) and multiple fast stages (154) that are mounted on one of the slow stages to simultaneously position multiple tools (156) relative to target locations (162) on multiple associated workpieces (152). Each of the fast stages is coupled to a fast stage signal processor (172) that provides corrected position data to each fast stage positioner to compensate for fast stage nonlinearities and workpiece placement, offset, rotation, and dimensional variations among the multiple workpieces. When cutting blind via holes in etched circuit boards (ECBs), improved throughput and process yield are achieved by making half of the tools ultraviolet ("UV") lasers, which readily cut conductor and dielectric layers, and making the other half of the tools are infrared ("IR") lasers, which readily cut only dielectric layers. The UV lasers are controlled to cut an upper conductor layer and a portion of an underlying dielectric layer, and the IR lasers are controlled to cut the remaining dielectric layer without cutting through or damaging a second underlying conductor layer. The throughput is increased by cutting conductor layers in unprocessed ECBs while concurrently cutting dielectric layers in ECBs that have already had their conductor layer cut. The process yield is increased by performing a workpiece calibration prior to each cutting step to account for any ECB placement, offset, rotation, and dimensional variations.
摘要翻译： 多速率多头定位器（150）接收和处理未通用的定位命令以致动缓慢级（56,58）和多个快速级（154），所述缓慢级（56,58）和多级快速级（154）安装在所述慢速级中的一级以同时定位多个工具 ）相对于多个相关工件（152）上的目标位置（162）。 每个快速级耦合到快速级信号处理器（172），其向每个快速定位器提供校正的位置数据，以补偿多个工件之间的快速阶段非线性和工件放置，偏移，旋转和尺寸变化。 在蚀刻电路板（ECB）中通过盲孔切割盲孔时，通过制造一半的工具紫外线（“UV”）激光器可以实现提高的吞吐量和工艺产量，这些激光器易于切割导体和介电层，并使另一半的工具 是红外线（“IR”）激光器，其易于切割电介质层。 控制UV激光器以切割上导体层和底层电介质层的一部分，并且IR激光器被控制以切割剩余的电介质层而不切割或损坏第二下面的导体层。 通过在未加工的ECB中切割导体层，同时切割已经具有导体层切割的ECB中的电介质层，从而提高了生产量。 通过在每个切割步骤之前执行工件校准以考虑任何ECB放置，偏移，旋转和尺寸变化来增加工艺屈服。
-
3.发明授权Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories 有权通过以圆形和螺旋形轨迹移动精确定时的激光脉冲来处理孔的方法公开(公告)号：US07259354B2
公开(公告)日：2007-08-21
申请号：US10912525
申请日：2004-08-04
申请人： Robert M. Pailthorp , Weisheng Lei , Hisashi Matsumoto , Glenn Simenson , David A. Watt , Mark A. Unrath , William J. Jordens
发明人： Robert M. Pailthorp , Weisheng Lei , Hisashi Matsumoto , Glenn Simenson , David A. Watt , Mark A. Unrath , William J. Jordens
IPC分类号： B23K26/38
CPC分类号： H05K3/0026 , B23K26/389 , H05K2201/09063
摘要： High speed removal of material from a specimen employs a beam positioner for directing a laser beam axis along various circular and spiral laser tool patterns. A preferred method of material removal entails causing relative movement between the axis of the beam and the specimen, directing the beam axis at an entry segment acceleration and along an entry trajectory to an entry position within the specimen at which laser beam pulse emissions are initiated, moving the beam axis at a circular perimeter acceleration within the specimen to remove material along a circular segment of the specimen, and setting the entry segment acceleration to less than twice the circular perimeter acceleration.
摘要翻译： 从样品高速去除材料采用光束定位器，用于沿着各种圆形和螺旋形激光工具图案引导激光束轴线。 优选的材料去除方法需要引起梁的轴线和样品之间的相对运动，将束轴线以入口段加速度并沿着入口轨迹引导到在激光束脉冲发射开始的样本内的入口位置， 沿着试样中的圆周边加速度移动光束轴，以沿着试样的圆形段移除材料，并将进入段加速度设置为小于圆周边加速度的两倍。
-
公开(公告)号：US06706999B1
公开(公告)日：2004-03-16
申请号：US10373232
申请日：2003-02-24
IPC分类号： B23K2606
CPC分类号： B23K26/0876 , B23K26/02 , B23K26/042 , B23K26/08 , B23K26/082 , B23K26/083 , B23K26/351 , B23K26/389 , B23K2101/40
摘要： A tertiary positioner system (80) of this invention employs X- and Y-axis translation stages (86, 88), galvanometer-driven mirrors (64, 66), and a fast steering mirror (“FSM”) (120) to direct a laser beam (90) to target locations (121) on a workpiece (92). A positioning signal is received by a low-pass filter (103) that produces filtered position data for driving the X- and Y-axis translation stages. The actual positions of the X- and Y-axis translation stages are subtracted from the unfiltered positioning data to produce an X-Y position error signal for driving the galvanometer-driven X- and Y-axis mirrors. The actual mirror positions are subtracted from the actual positions of the X- and Y-axis translation stages to generate a positional error signal representing the difference between the commanded and actual positions of the laser beam. The positional error signal drives the FSM to rapidly correct any positional errors.
摘要翻译： 本发明的三次定位器系统（80）采用X轴和Y轴平移台（86,88），电流计驱动反射镜（64,66）和快速转向镜（“FSM”）（120） 激光束（90）到工件（92）上的目标位置（121）。 定位信号由低通滤波器（103）接收，该低通滤波器产生用于驱动X轴和Y轴平移级的滤波位置数据。 从未滤波的定位数据中减去X轴和Y轴平移级的实际位置，以产生用于驱动电流计驱动的X轴和Y轴镜的X-Y位置误差信号。 从X轴和Y轴平移级的实际位置中减去实际的反射镜位置，以产生表示激光束的指令位置和实际位置之间的差异的位置误差信号。 位置误差信号驱动FSM快速校正任何位置误差。
-
5.发明授权Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features 有权控制激光束定位系统的动态和热负荷，实现工件特征的高通量激光加工公开(公告)号：US08680430B2
公开(公告)日：2014-03-25
申请号：US12330418
申请日：2008-12-08
申请人： Mark A. Unrath
发明人： Mark A. Unrath
CPC分类号： B23K26/40 , B23K26/082 , B23K26/0823 , B23K26/0853 , B23K26/382 , B23K2101/40 , B23K2103/50
摘要： A method of accomplishing high-throughput laser processing of workpiece features arranged in a densely spaced pattern minimizes workpiece feature processing inaccuracy and quality degradation that result from dynamic and thermal loads on laser beam positioning and optical components directing the laser beam during workpiece feature processing. A preferred embodiment is implemented with a laser beam positioning system composed of a zero-inertia optical deflector of an acousto-optic beam deflector (AOD) or an electro-optical deflector (EOD) type, a galvanometer head, and a linear stage cooperating to position the laser beam among the workpiece features.
摘要翻译： 实现以密集间隔的图案布置的工件特征的高通量激光加工的方法使得在工件特征处理期间激光束定位上的动态和热负载以及引导激光束的光学部件导致的工件特征处理不准确性和质量劣化最小化。 一个优选实施例是用由声光束偏转器（AOD）或电光偏转器（EOD）类型的零惯性光偏转器，电流计头部和线性平台组成的激光束定位系统来实现的， 将激光束定位在工件特征之间。
-
6.发明申请LASER DIRECT ABLATION WITH PICOSECOND LASER PULSES AT HIGH PULSE REPETITION FREQUENCIES 有权激光直接与高脉冲重复频率下的PICOSECOND激光脉冲相关公开(公告)号：US20120248075A1
公开(公告)日：2012-10-04
申请号：US13076754
申请日：2011-03-31
申请人： Mehmet E. Alpay , Hisashi Matsumoto , Mark A. Unrath , Guangyu Li
发明人： Mehmet E. Alpay , Hisashi Matsumoto , Mark A. Unrath , Guangyu Li
CPC分类号： B23K26/0648 , B23K26/0622 , B23K26/0652 , B23K26/082 , B23K26/0861 , B23K26/364 , B23K2101/42 , B23K2103/42 , B23K2103/50
摘要： Laser direct ablation (LDA) produces patterns cut into a dielectric layer for the formation of electrically conductive traces with controlled signal propagation characteristics. LDA processing includes selecting a dose fluence for removing a desired depth of material along a scribe line on a surface of a workpiece, selecting a temporal pulsewidth for each laser pulse in a series of laser pulses, and selecting a pulse repetition frequency for the series of laser pulse. The pulse repetition frequency is based at least in part on the selected temporal pulsewidth to maintain the selected dose fluence along the scribe line. The selected pulse repetition frequency provides a predetermined minimum overlap of laser spots along the scribe line. The LDA process further includes generating a laser beam including the series of laser pulses according to the selected dose fluence, temporal pulsewidth, and pulse repetition frequency.
摘要翻译： 激光直接消融（LDA）产生切割成电介质层的图案，以形成具有受控信号传播特性的导电迹线。 LDA处理包括选择剂量注量以沿着工件表面上的划线去除期望的材料深度，在一系列激光脉冲中选择每个激光脉冲的时间脉冲宽度，以及选择一系列激光脉冲的脉冲重复频率 激光脉冲。 脉冲重复频率至少部分地基于所选择的时间脉冲宽度，以维持沿着划线的所选择的剂量注量。 所选择的脉冲重复频率提供沿着划线的激光点的预定的最小重叠。 LDA工艺还包括根据所选择的剂量注量，时间脉冲宽度和脉冲重复频率产生包括一系列激光脉冲的激光束。
-
7.发明申请LASER PROCESSING SYSTEMS USING THROUGH-THE-LENS ALIGNMENT OF A LASER BEAM WITH A TARGET FEATURE 有权使用具有目标特征的激光束的透镜对准的激光加工系统公开(公告)号：US20100301024A1
公开(公告)日：2010-12-02
申请号：US12790093
申请日：2010-05-28
申请人： Mark A. Unrath
发明人： Mark A. Unrath
CPC分类号： B23K26/032 , B23K26/046 , B23K26/0648 , B23K26/0665 , B23K26/08 , B23K26/082 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A laser processing system for micromachining a workpiece includes a laser source to generate laser pulses for processing a feature in a workpiece, a galvanometer-driven (galvo) subsystem to impart a first relative movement of a laser beam spot position along a processing trajectory with respect to the surface of the workpiece, and an acousto-optic deflector (AOD) subsystem. The AOD subsystem may include a combination of AODs and electro-optic deflectors. The AOD subsystem may vary an intensity profile of laser pulses as a function of deflection position along a dither direction. The AOD subsystem may be used for aligning a processing laser beam to workpiece features.
摘要翻译： 用于微加工工件的激光处理系统包括激光源以产生用于处理工件中的特征的激光脉冲，电流计驱动（电流）子系统，以相对于处理轨迹赋予激光束光斑位置的第一相对运动 到工件的表面，以及声光偏转器（AOD）子系统。 AOD子系统可以包括AOD和电光偏转器的组合。 AOD子系统可以根据抖动方向改变作为偏转位置的函数的激光脉冲的强度分布。 AOD子系统可用于将处理的激光束对准工件特征。
-
8.发明申请CONTROLLING DYNAMIC AND THERMAL LOADS ON LASER BEAM POSITIONING SYSTEM TO ACHIEVE HIGH-THROUGHPUT LASER PROCESSING OF WORKPIECE FEATURES 有权控制激光光束定位系统的动态和热负载，实现工作特征的高激光激光加工公开(公告)号：US20100140237A1
公开(公告)日：2010-06-10
申请号：US12330418
申请日：2008-12-08
申请人： Mark A. Unrath
发明人： Mark A. Unrath
CPC分类号： B23K26/40 , B23K26/082 , B23K26/0823 , B23K26/0853 , B23K26/382 , B23K2101/40 , B23K2103/50
摘要： A method of accomplishing high-throughput laser processing of workpiece features arranged in a densely spaced pattern minimizes workpiece feature processing inaccuracy and quality degradation that result from dynamic and thermal loads on laser beam positioning and optical components directing the laser beam during workpiece feature processing. A preferred embodiment is implemented with a laser beam positioning system composed of a zero-inertia optical deflector of an acousto-optic beam deflector (AOD) or an electro-optical deflector (EOD) type, a galvanometer head, and a linear stage cooperating to position the laser beam among the workpiece features.
摘要翻译： 实现以密集间隔图案布置的工件特征的高通量激光加工的方法使得在工件特征处理期间激光束定位上的动态和热负载以及引导激光束的光学部件导致的工件特征处理不准确性和质量劣化最小化。 一个优选实施例是用由声光束偏转器（AOD）或电光偏转器（EOD）类型的零惯性光偏转器，电流计头部和线性平台组成的激光束定位系统来实现的， 将激光束定位在工件特征之间。
-
9.发明授权Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies 有权激光直接消融，皮秒激光脉冲以高脉冲重复频率公开(公告)号：US08648277B2
公开(公告)日：2014-02-11
申请号：US13076754
申请日：2011-03-31
申请人： Mehmet E. Alpay , Hisashi Matsumoto , Mark A. Unrath , Guangyu Li
发明人： Mehmet E. Alpay , Hisashi Matsumoto , Mark A. Unrath , Guangyu Li
CPC分类号： B23K26/0648 , B23K26/0622 , B23K26/0652 , B23K26/082 , B23K26/0861 , B23K26/364 , B23K2101/42 , B23K2103/42 , B23K2103/50
摘要： Laser direct ablation (LDA) produces patterns cut into a dielectric layer for the formation of electrically conductive traces with controlled signal propagation characteristics. LDA processing includes selecting a dose fluence for removing a desired depth of material along a scribe line on a surface of a workpiece, selecting a temporal pulsewidth for each laser pulse in a series of laser pulses, and selecting a pulse repetition frequency for the series of laser pulse. The pulse repetition frequency is based at least in part on the selected temporal pulsewidth to maintain the selected dose fluence along the scribe line. The selected pulse repetition frequency provides a predetermined minimum overlap of laser spots along the scribe line. The LDA process further includes generating a laser beam including the series of laser pulses according to the selected dose fluence, temporal pulsewidth, and pulse repetition frequency.
摘要翻译： 激光直接消融（LDA）产生切割成电介质层的图案，以形成具有受控信号传播特性的导电迹线。 LDA处理包括选择剂量注量以沿着工件表面上的划线去除期望的材料深度，在一系列激光脉冲中选择每个激光脉冲的时间脉冲宽度，以及选择一系列激光脉冲的脉冲重复频率 激光脉冲。 脉冲重复频率至少部分地基于所选择的时间脉冲宽度，以维持沿着划线的所选择的剂量注量。 所选择的脉冲重复频率提供沿着划线的激光点的预定的最小重叠。 LDA工艺还包括根据所选择的剂量注量，时间脉冲宽度和脉冲重复频率产生包括一系列激光脉冲的激光束。
-
10.发明授权Acousto-optic deflector applications in laser processing of dielectric or other materials 有权声光偏转器应用于电介质或其他材料的激光加工公开(公告)号：US08404998B2
公开(公告)日：2013-03-26
申请号：US12790082
申请日：2010-05-28
CPC分类号： B23K26/032 , B23K26/046 , B23K26/0648 , B23K26/0665 , B23K26/08 , B23K26/082 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A laser processing system for micromachining a workpiece includes a laser source to generate laser pulses for processing a feature in a workpiece, a galvanometer-driven (galvo) subsystem to impart a first relative movement of a laser beam spot position along a processing trajectory with respect to the surface of the workpiece, and an acousto-optic deflector (AOD) subsystem to effectively widen a laser beam spot along a direction perpendicular to the processing trajectory. The AOD subsystem may include a combination of AODs and electro-optic deflectors. The AOD subsystem may vary an intensity profile of laser pulses as a function of deflection position along a dither direction to selectively shape the feature in the dither direction. The shaping may be used to intersect features on the workpiece. The AOD subsystem may also provide rastering, galvo error position correction, power modulation, and/or through-the-lens viewing of and alignment to the workpiece.
摘要翻译： 用于微加工工件的激光处理系统包括激光源以产生用于处理工件中的特征的激光脉冲，电流计驱动（电流）子系统，以相对于处理轨迹赋予激光束光斑位置的第一相对运动 到达工件的表面，以及声光偏转器（AOD）子系统，以沿垂直于处理轨迹的方向有效地加宽激光束点。 AOD子系统可以包括AOD和电光偏转器的组合。 AOD子系统可以根据抖动方向改变作为偏转位置的函数的激光脉冲的强度分布，以选择性地在抖动方向上成形特征。 成形可以用于与工件上的特征相交。 AOD子系统还可以提供对工件的扫描，Galvo错误位置校正，功率调制和/或透镜观察并对准工件。
-
-
-
-
-
-
-
-
-
搜索结果
25 条记录 (耗时 0.023 秒)
