公开(公告)号：US08509462B2

公开(公告)日：2013-08-13

申请号：US12704029

申请日：2010-02-11

申请人： Byung-gil Jeong ,  Dong-kyun Kim ,  Seok-whan Chung ,  Jun-sik Hwang

发明人： Byung-gil Jeong ,  Dong-kyun Kim ,  Seok-whan Chung ,  Jun-sik Hwang

IPC分类号： H04R25/00

CPC分类号： H04R17/00 ,  Y10T29/42 ,  Y10T29/49005

摘要： A piezoelectric micro speaker and a method of manufacturing the same are provided. The piezoelectric micro speaker includes a substrate having a cavity formed therein and a diaphragm that is disposed on the substrate that overlaps the cavity. A plurality of first vibrating membranes having concentric annular ring shapes are disposed in a first region of the diaphragm corresponding to a center of the cavity. A second vibrating membrane including a different material from that of the first vibrating membranes is formed in the second region of the diaphragm corresponding to an edge of the cavity. A piezoelectric actuator for vibrating the first vibrating membranes is formed on and between the concentric annular rings of the first vibrating membranes.

摘要翻译： 提供一种压电微型扬声器及其制造方法。 压电微型扬声器包括其中形成有空腔的基板和设置在与空腔重叠的基板上的隔膜。 具有同心圆环形状的多个第一振动膜设置在对应于腔的中心的隔膜的第一区域中。 在与隔膜的边缘对应的隔膜的第二区域中形成有与第一振动膜不同的材料的第二振动膜。 用于振动第一振动膜的压电致动器形成在第一振动膜的同心圆环之间和之间。

公开(公告)号：US08401220B2

公开(公告)日：2013-03-19

申请号：US12751686

申请日：2010-03-31

申请人： Dong-kyun Kim ,  Byung-gil Jeong ,  Seok-whan Chung ,  Jun-sik Hwang

发明人： Dong-kyun Kim ,  Byung-gil Jeong ,  Seok-whan Chung ,  Jun-sik Hwang

IPC分类号： H04R1/02

CPC分类号： H04R17/00 ,  H04R2201/003 ,  H04R2307/025 ,  H04R2499/11 ,  Y10T29/42 ,  Y10T29/49005

摘要： A micro speaker includes a substrate having a cavity formed therein, a diaphragm formed on the substrate overlapping the cavity. The diaphragm includes a first vibration membrane formed in a first area corresponding to a center portion of the cavity and a second vibration membrane formed in a second area corresponding to an edge portion of the cavity and formed of material different from that used for the first vibration membrane. A piezoelectric actuator is formed including a first electrode layer formed on the first vibration membrane, a piezoelectric layer formed on the first electrode layer, and a second electrode layer formed on the piezoelectric layer, and first and second curved lead wires, respectively connected to the first and second electrode layers across the second area, which are symmetrical to the center of the piezoelectric actuator.

摘要翻译： 微型扬声器包括其中形成有空腔的基板，形成在基板上的与该空腔重叠的隔膜。 隔膜包括形成在与空腔的中心部分相对应的第一区域中的第一振动膜和形成在与空腔的边缘部分相对应的第二区域中并由与用于第一振动的材料不同的材料形成的第二区域的第二振动膜 膜。 一种压电致动器，包括形成在第一振动膜上的第一电极层，形成在第一电极层上的压电层和形成在压电层上的第二电极层，以及分别连接到第一电极层上的第一和第二弯曲引线 跨越第二区域的第一和第二电极层，其与压电致动器的中心对称。

公开(公告)号：US08958595B2

公开(公告)日：2015-02-17

申请号：US12696935

申请日：2010-01-29

申请人： Jun-sik Hwang ,  Dong-kyun Kim ,  Seok-whan Chung ,  Byung-gil Jeong

发明人： Jun-sik Hwang ,  Dong-kyun Kim ,  Seok-whan Chung ,  Byung-gil Jeong

IPC分类号： H04R1/00 ,  H04R17/00 ,  H04R31/00

CPC分类号： H04R17/00 ,  H04R31/003 ,  H04R2201/003 ,  H04R2440/07

摘要： Provided are a piezoelectric micro speaker having a piston diaphragm and a method of manufacturing the piezoelectric micro speaker. The piezoelectric micro speaker includes: a substrate having a cavity formed therein; a vibrating membrane that is disposed on the substrate and covers at least a center part of the cavity; a piezoelectric actuator disposed on the vibrating membrane so as to vibrate the vibrating membrane; and a piston diaphragm that is disposed in the cavity and performs piston motion by vibration of the vibrating membrane. When the vibrating membrane vibrates by the piezoelectric actuator, the piston diaphragm, which is connected to the vibrating membrane through a piston bar, performs a piston motion in the cavity.

摘要翻译： 提供一种具有活塞隔膜的压电微型扬声器和制造压电微型扬声器的方法。 压电微型扬声器包括：其中形成有空腔的基板; 振动膜，其设置在所述基板上并且覆盖所述空腔的至少中心部分; 设置在所述振动膜上以使所述振动膜振动的压电致动器; 以及活塞隔膜，其设置在所述空腔中并通过所述振动膜的振动来进行活塞运动。 当振动膜由压电致动器振动时，通过活塞杆连接到振动膜的活塞隔膜在空腔中进行活塞运动。

公开(公告)号：US08526642B2

公开(公告)日：2013-09-03

申请号：US12693481

申请日：2010-01-26

申请人： Seok-whan Chung ,  Dong-kyun Kim ,  Byung-gil Jeong ,  Jun-sik Hwang

发明人： Seok-whan Chung ,  Dong-kyun Kim ,  Byung-gil Jeong ,  Jun-sik Hwang

IPC分类号： H04R25/00

CPC分类号： H04R31/00 ,  H04R17/00 ,  H04R2400/00

摘要： Provided are a piezoelectric micro speaker and a method of manufacturing the same. The piezoelectric micro speaker includes: a substrate having a cavity therein; a diaphragm that is disposed on the substrate, the diaphragm including a vibrating membrane that overlaps the cavity; a piezoelectric actuator that is disposed on the vibrating membrane; and a weight that is disposed in the cavity and attached to a center portion of the vibrating membrane.

摘要翻译： 提供一种压电微型扬声器及其制造方法。 压电微型扬声器包括：其中具有空腔的基板; 隔膜，其设置在所述基板上，所述隔膜包括与所述空腔重叠的振动膜; 设置在振动膜上的压电致动器; 以及设置在所述空腔中并附接到所述振动膜的中心部分的重物。

公开(公告)号：US08275158B2

公开(公告)日：2012-09-25

申请号：US12850301

申请日：2010-08-04

申请人： Dong-kyun Kim ,  Jun-sik Hwang ,  Seok-whan Chung ,  Byung-gil Jeong

发明人： Dong-kyun Kim ,  Jun-sik Hwang ,  Seok-whan Chung ,  Byung-gil Jeong

IPC分类号： H04R25/00

CPC分类号： H04R17/00

摘要： Provided is a piezoelectric micro speaker. The piezoelectric micro speaker includes a device plate having a front cavity, a front plate having a radiation hole which communicates with the front cavity in front of the device plate, and a rear plate having a rear cavity and a vent portion. A rear portion of the device plate forms a wall of the vent portion. The device plate includes at least one first vent hole which communicates with the vent portion, and the front plate includes at least one second vent hole which communicates with the first vent hole.

摘要翻译： 提供一种压电微型扬声器。 该压电微型扬声器包括具有前腔的装置板，具有与装置板前面的前腔连通的放射孔的前板和具有后腔和排气部的后板。 装置板的后部形成通气部分的壁。 装置板包括与排气部分连通的至少一个第一通气孔，并且前板包括与第一通气孔连通的至少一个第二通气孔。

公开(公告)号：US09041999B2

公开(公告)日：2015-05-26

申请号：US13597986

申请日：2012-08-29

申请人： Ki-deok Bae ,  Jun-sik Hwang ,  Chang-youl Moon ,  Yoon-sun Choi ,  Jung-mok Bae ,  Chang-seung Lee ,  Eok-su Kim

发明人： Ki-deok Bae ,  Jun-sik Hwang ,  Chang-youl Moon ,  Yoon-sun Choi ,  Jung-mok Bae ,  Chang-seung Lee ,  Eok-su Kim

IPC分类号： G02B26/00

CPC分类号： G02B26/005

摘要： In one embodiment, the electrowetting device includes a first medium; a second medium that is not mixed with the first medium and has a refractive index different from a refractive index of the first medium; an upper electrode that adjusts an angle of a boundary surface between the first medium and the second medium; and a barrier wall that has a side surface surrounding the first and second mediums, allows the upper electrode to be disposed on a portion of the side surface, and has irregular widths.

摘要翻译： 在一个实施例中，电润湿装置包括第一介质; 第二介质，其不与第一介质混合并且具有与第一介质的折射率不同的折射率; 上部电极，其调整所述第一介质和所述第二介质之间的边界面的角度; 并且具有围绕第一和第二介质的侧表面的阻挡壁允许上电极设置在侧表面的一部分上，并且具有不规则的宽度。

公开(公告)号：US08418331B2

公开(公告)日：2013-04-16

申请号：US13006052

申请日：2011-01-13

申请人： Jun-sik Hwang ,  Yun-kwon Park ,  Il-jong Song ,  Byeoung-ju Ha

发明人： Jun-sik Hwang ,  Yun-kwon Park ,  Il-jong Song ,  Byeoung-ju Ha

IPC分类号： H04R17/10 ,  H05K3/30

CPC分类号： H03H9/706 ,  H01L2224/16235 ,  H01L2224/81192 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01P1/213 ,  H03H9/0571 ,  H05K1/0243 ,  H05K1/162 ,  H05K1/165 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0959 ,  H05K2201/1006 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49165

摘要： Provided is a method for fabricating a duplexer. The method includes fabricating an embedded PCB having an isolation part built therein and forming pads on certain areas of an upper side of the embedded PCB to connect with an external terminal. Further, a first filter and a second filter are separately fabricated, each having at least one film bulk acoustic resonator which is fabricated by depositing a lower electrode, a piezoelectric layer, and an upper electrode in this respective order. Thereafter, the first and second filters are bonded onto the pads formed on the embedded PCB. The entire surface of the embedded PCD is packaged at a predetermined distance from the first and second filters.

摘要翻译： 提供了一种制造双工器的方法。 该方法包括制造其中内置隔离部分的嵌入式PCB，并在嵌入式PCB的上侧某些区域上形成焊盘，以与外部端子连接。 此外，分别制造第一滤波器和第二滤波器，每个滤波器和第二滤波器具有至少一个薄膜体声波谐振器，其通过以各自的顺序沉积下电极，压电层和上电极而制造。 此后，将第一和第二滤光器结合到形成在嵌入式PCB上的焊盘上。 嵌入式PCD的整个表面被封装在与第一和第二滤光器相距预定距离处。

公开(公告)号：US07755151B2

公开(公告)日：2010-07-13

申请号：US11415099

申请日：2006-05-02

申请人： Ji-hyuk Lim ,  Jun-sik Hwang ,  Woon-bae Kim ,  Suk-jin Ham ,  Jong-oh Kwon ,  Moon-chul Lee ,  Chang-youl Moon

发明人： Ji-hyuk Lim ,  Jun-sik Hwang ,  Woon-bae Kim ,  Suk-jin Ham ,  Jong-oh Kwon ,  Moon-chul Lee ,  Chang-youl Moon

IPC分类号： H01L29/82 ,  H01L23/04 ,  H01L21/00

CPC分类号： H03H9/1092

摘要： A wafer level package for a surface acoustic wave device and a fabrication method thereof include a SAW device formed with a SAW element on an upper surface of a device wafer; a cap wafer joined on an upper part of the SAW element; a cavity part housing the SAW element between the cap wafer and the SAW device; a cap pad formed on an upper surface of the cap wafer; and a metal line formed to penetrate through the cap wafer to electrically connect the cap pad and the SAW element, the device wafer and the cap wafer being made of the same materials.

摘要翻译： 用于声表面波器件的晶片级封装及其制造方法包括在器件晶片的上表面上形成有SAW元件的SAW器件; 接合在所述SAW元件的上部的盖晶片; 在所述盖晶片和所述SAW器件之间容纳所述SAW元件的空腔部; 帽盖，形成在盖晶片的上表面上; 以及金属线，其形成为穿透盖晶片以电连接帽垫和SAW元件，器件晶片和盖晶片由相同的材料制成。

公开(公告)号：US07579685B2

公开(公告)日：2009-08-25

申请号：US11339500

申请日：2006-01-26

申请人： Moon-chul Lee ,  Woon-bae Kim ,  Kae-dong Back ,  Qian Wang ,  Jun-sik Hwang ,  Kyu-dong Jung

发明人： Moon-chul Lee ,  Woon-bae Kim ,  Kae-dong Back ,  Qian Wang ,  Jun-sik Hwang ,  Kyu-dong Jung

IPC分类号： H01L23/12 ,  H01L23/043

CPC分类号： B81C1/00301 ,  B81B2207/095 ,  H01L21/76898 ,  H01L23/04 ,  H01L23/10 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00

摘要： A wafer level packaging cap and method thereof for a wafer level packaging are provided. The wafer level packaging cap covering a device wafer with a device thereon, includes a cap wafer having on a bottom surface a cavity providing a space for receiving the device, and integrally combined with the device wafer, a plurality of metal lines formed on the bottom surface of the cap wafer to correspond to a plurality of device pads formed on the device wafer to be electrically connected to the device, a plurality of buffer portions connected to the plurality of metal lines and comprising a buffer wafer with a plurality of grooves and a metal filled in the plurality of grooves, a plurality of connection rods electrically connected to the plurality of buffer portions and penetrating the cap wafer from a top portion of the buffer portion, and a plurality of cap pads formed on a top surface of the cap wafer and electrically connected to a plurality of connection rods.

摘要翻译： 提供了一种用于晶片级封装的晶片级封装盖及其方法。 覆盖其上具有器件的器件晶片的晶片级封装盖包括盖晶片，其在底表面上具有提供用于接收器件的空间并与器件晶片整体结合的空腔，形成在底部的多个金属线 盖片晶片的表面对应于形成在器件晶片上以电连接到器件的多个器件焊盘，多个缓冲部分连接到多个金属线并且包括具有多个沟槽的缓冲晶片和 填充在所述多个槽中的金属，多个连接杆，电连接到所述多个缓冲部分，并且从所述缓冲部分的顶部穿透所述盖片;以及形成在所述盖片的顶表面上的多个帽垫 并且电连接到多个连接杆。

公开(公告)号：US07408257B2

公开(公告)日：2008-08-05

申请号：US11390220

申请日：2006-03-28

申请人： Kyu-dong Jung ,  Woon-bae Kim ,  In-sang Song ,  Moon-chul Lee ,  Jun-sik Hwang ,  Suk-jin Ham

发明人： Kyu-dong Jung ,  Woon-bae Kim ,  In-sang Song ,  Moon-chul Lee ,  Jun-sik Hwang ,  Suk-jin Ham

IPC分类号： H01L23/04

CPC分类号： H01L23/055 ,  H01L23/04 ,  H01L27/14618 ,  H01L2224/16

摘要： A packaging chip in which a circuit module is packaged and a method of packaging a circuit module are provided. The packaging chip includes a base wafer; a circuit module on the base wafer; a packaging wafer having a cavity and combined with the base wafer so that the circuit module fits inside the cavity; a connecting electrode connecting upper and lower surfaces of the cavity; and a seed layer between the connecting electrode and the packaging wafer. The method includes etching a lower surface of the packaging wafer to form a cavity, stacking a metal layer in an area of the lower surface, combining the base wafer with the packaging wafer, polishing the packaging wafer, forming a viahole through the packaging wafer, stacking a seed layer on the packaging wafer, plating the inside of the viahole, removing the seed layer and forming an electrode.

摘要翻译： 提供电路模块封装的封装芯片和封装电路模块的方法。 包装芯片包括基底晶片; 基底晶片上的电路模块; 封装晶片，其具有空腔并与所述基底晶片组合，使得所述电路模块装配在所述腔内; 连接所述空腔的上表面和下表面的连接电极; 以及连接电极和封装晶片之间的晶种层。 该方法包括蚀刻封装晶片的下表面以形成空腔，在下表面的区域中堆叠金属层，将基底晶片与封装晶片组合，抛光封装晶片，通过封装晶片形成通孔， 将种子层堆叠在包装晶片上，电镀通孔内部，去除种子层并形成电极。