COMPOSITE ACTIVE MOLDS AND METHODS OF MAKING ARTICLES OF SEMICONDUCTING MATERIAL
    3.
    发明申请
    COMPOSITE ACTIVE MOLDS AND METHODS OF MAKING ARTICLES OF SEMICONDUCTING MATERIAL 审中-公开
    复合材料的主要成分及制备方法

    公开(公告)号:US20120299218A1

    公开(公告)日:2012-11-29

    申请号:US13117440

    申请日:2011-05-27

    IPC分类号: B28B1/38 B28B7/42

    摘要: The disclosure relates to a substrate mold comprising a shell material having an external surface configured to engage with molten semiconducting material, and an internal surface configured as a thermal transfer surface to transfer heat therethrough, and a core defined within the shell material and configured to remove heat from the shell material through the thermal transfer surface of the shell material. The substrate mold is configured to be immersed into the molten semiconducting material, and the external surface of the shell material is configured to have solidified molten semiconducting material formed thereon.

    摘要翻译: 本公开涉及一种基材模具,其包括壳体材料,该外壳材料具有被配置为与熔融半导体材料接合的外表面,以及被配置为热转印表面以传递热量的内表面,以及限定在外壳材料内的构造物, 外壳材料通过外壳材料的热传递表面的热量。 衬底模具被配置为浸入熔融半导体材料中,并且外壳材料的外表面被配置为具有在其上形成的凝固的熔融半导体材料。