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公开(公告)号：US11655369B2
公开(公告)日：2023-05-23
申请号：US17439855
申请日：2020-10-28
发明人： Dorab Bhagwagar , Peng Wei , Qianqing Ge , Yan Zheng , Zhanjie Li
CPC分类号： C08L83/04 , C08K3/013 , C08K2201/001
摘要： A composition contains an organopolysiloxane having the average chemical structure (I):
[R′R2SiO—(R2SiO)m]3—Si—[OSiR2]n—Y—Si(OR)3 (I)
where: R is independently in each occurrence selected from alkyl, aryl, substituted alkyl and substituted alkyl groups having from one to 8 carbon atoms; R′ is independently in each occurrence selected from R and terminally unsaturated alkylene groups having from 2 to 6 carbon atoms; Y is selected from a group consisting of: X, and X—(R2SiO)pSiR2—X; where p has an average value in a range of one to 3; and X is independently in each occurrence selected from alkylene and substituted alkylene groups having from one to 6 carbon atoms; and the average values for subscripts m and n are each greater than zero and independently selected so that the average value for the sum of all of the average m values and the average n value is in a range of 30-200.-
公开(公告)号：US11059971B2
公开(公告)日：2021-07-13
申请号：US16629162
申请日：2017-09-29
发明人： Zhihua Liu , Peng Wei , Hexiang Yan , Yi Zhao , Qi Chen , Junmin Zhu
摘要： Provided are a composition, a cured polymer material formed from said composition, a method for forming a thermally conductive material on an article and an article having a thermally conductive material. Said thermally conductive material can be formed on an electronic device, and can be peeled off from said electronic device.
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公开(公告)号：US20230257582A1
公开(公告)日：2023-08-17
申请号：US18004077
申请日：2020-09-23
发明人： Jiguang Zhang , Yan Zheng , Chao He , Xuedong Gao , Qianqing Ge , Dorab Bhagwagar , Peng Wei , Chen Chen , Hongyu Chen
IPC分类号： C08L83/04 , C08K5/5419 , C08K3/22
CPC分类号： C08L83/04 , C08K5/5419 , C08K3/22 , C08K2201/001 , C08K2003/2296 , C08K2003/0812
摘要： Provided is a thermal interface material containing a divinyl polydimethylsiloxane, a chain extender, a crosslinker, 80 volume-percent or more thermally conductive filler, treating agent composition, platinum hydrosilylation catalyst, and up to 0.2 weight-percent hydrosilylation inhibitor; where the wherein weight-percent values are relative to thermal interface material composition weight, volume-percent values are relative to thermal interface material composition volume, the molar ratio of silyl hydride groups to vinyl groups in the thermal interface material composition is 0.4 or more and at the same time is 1.0 or less, and the molar ratio of silyl hydride functionality from the chain extender to silyl hydride functionality from the crosslinker is 13 or more and at the same time 70 or less.
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公开(公告)号：US11732175B2
公开(公告)日：2023-08-22
申请号：US18005678
申请日：2020-10-28
发明人： Dorab Bhagwagar , Cassie Hale , Peng Wei , Qianqing Ge , Yan Zheng , Zhanjie Li
CPC分类号： C09K5/14 , C08G77/08 , C08G77/12 , C08G77/22 , C08K3/22 , C08K7/18 , C08K2003/0812 , C08K2003/2227 , C08K2003/2296 , C08K2201/001 , C08K2201/005 , C08K2201/014
摘要： A non-curable thermally conductive material contains: (a) a matrix material containing: (i) 90 to 98 wt % of a non-functional non-crosslinked organosiloxane fluid having a dynamic viscosity of 50 to 350 centiStokes; and (ii) 2 to less than 10 wt % of a crosslinked hydrosilylation reaction product of an alkenyl terminated polydiorganosiloxane having a degree of polymerization greater than 300 and an organohydrogensiloxane crosslinker with 2 or more SiH groups per molecule where the molar ratio of SiH groups to alkenyl groups is 0.5 to 2.0; (b) greater than 80 wt % to less than 95 wt % thermally conductive filler dispersed throughout the matrix material; and (c) treating agents selected from alkyltrialkoxy silanes where the alkyl contains one to 14 carbon atoms and monotrialkoxy terminated diorganopolysiloxanes having a degree of polymerization of 20 to 110 and the alkoxy groups each contain one to 12 carbon atoms dispersed in the matrix material.
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公开(公告)号：US20230090031A1
公开(公告)日：2023-03-23
申请号：US17439855
申请日：2020-10-28
发明人： Dorab Bhagwagar , Peng Wei , Qianqing Ge , Yan Zheng , Zhanjie Li
摘要： A composition contains an organopolysiloxane having the average chemical structure (I): [R′R2SiO—(R2SiO)m]3—Si—[OSiR2]n—Y—Si(OR)3 (I) where: R is independently in each occurrence selected from alkyl, aryl, substituted alkyl and substituted alkyl groups having from one to 8 carbon atoms; R′ is independently in each occurrence selected from R and terminally unsaturated alkylene groups having from 2 to 6 carbon atoms; Y is selected from a group consisting of: X, and X—(R2SiO)pSiR2—X; where p has an average value in a range of one to 3; and X is independently in each occurrence selected from alkylene and substituted alkylene groups having from one to 6 carbon atoms; and the average values for subscripts m and n are each greater than zero and independently selected so that the average value for the sum of all of the average m values and the average n value is in a range of 30-200.
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公开(公告)号：US11485861B2
公开(公告)日：2022-11-01
申请号：US16758662
申请日：2018-01-11
发明人： Peng Wei , Fengyi Su , Yan Zheng , Dorab Bhagwagar , Debo Hong , Danhuan Ma , Junmin Zhu
摘要： A method for forming thermally conductive composition on electronic components comprises three steps, (I) preparing a silicone composition comprising (A) a polyorganosiloxane, (B) a thermally conductive filler and (C) a catalyst, (II) applying the silicone composition on an electronic component of electronic devices, the electronic component generates heat when the electronic devices are working and (III) curing the silicone composition by heat generated by the electronic component.
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公开(公告)号：US20220289936A1
公开(公告)日：2022-09-15
申请号：US17761360
申请日：2019-12-05
发明人： Yan Zheng , Chen Chen , Dorab Bhagwagar , Peng Wei , Qianqing Ge
摘要： A composition contains: (a) a polyorganosiloxane component comprising one or a combination of more than one poly-organosiloxane; (b) a filler treating agent comprising alkyltrialkoxysilane and trialkoxysiloxy-terminated diorganopolysiloxane; (c) 90-98 weight-percent of a combination of thermally conductive fillers comprising: (i) 25-40 weight-percent of thermally conductive filler particles having an average particle size of 70-150 micrometers and selected from one or a combination of aluminum oxide and aluminum nitride particles; (ii) 15-30 weight-percent thermally conductive filler particles having an average particle size in a range of 30-45 micrometers selected from one or a combination of aluminum oxide and aluminum nitride particles; (iii) 25-32 weight-percent aluminum oxide particles having an average particle size in a range of 1-5 micrometers; and (iv) 10-15 weight-percent thermally conductive filler particles having an average particle size in a range of 0.1 to 0.5 micrometers; where weight-percent is relative to composition weight.
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公开(公告)号：US20230313016A1
公开(公告)日：2023-10-05
申请号：US18041749
申请日：2020-11-10
发明人： Yan Zheng , Dorab Bhagwagar , Darren Hansen , Peng Wei , Han Guang Wu
CPC分类号： C09K5/14 , C08L83/04 , C08K13/04 , H05K7/2039 , C08L2205/025 , C08L2203/20 , C08L2312/00 , C08K5/5419
摘要： A composition contains: (a) curable silicone composition including: (i) a vinyldimethylsiloxy-terminated polydimethylpolysiloxane with a viscosity of 30 to 400 mPa*s; (ii) a SiH functional crosslinker; and (iii) a hydrosilylation catalyst; where the molar ratio of crosslinker SiH functionality to vinyl functionality is 0.5:1 to 1:1; (b) alkyl trialkoxysilane and/or a mono-trialkoxysiloxy terminated dimethylpolysiloxane treating agent; (c) filler mix containing: (i) 40 wt % or more of spherical and irregular shaped AlN particles, both having an average size of 30 micrometers or more, the spherical AlN fillers are 40-60 wt % of the weight of the AlN fillers; (ii) 25-35 wt % spherical Al2O3 particles with an average size of 1-5 micrometers; (iii) 10-15 wt % of additional thermally conductive filler with a 0.1-0.5 micrometer average size; and (iv) optionally, BN fillers having an average size greater than 20 micrometers; where filler mix is 90-97 wt % and wt % is relative to composition weight unless otherwise stated.
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公开(公告)号：US20240279525A1
公开(公告)日：2024-08-22
申请号：US18566121
申请日：2021-08-19
发明人： Yan Zheng , Dorab Bhagwagar , Qianqing Ge , Peng Wei , Han Guang Wu
IPC分类号： C09K5/14 , C08G77/12 , C08G77/20 , C08K3/22 , C08K3/28 , C08K7/18 , C08K9/08 , C08K13/06 , H05K7/20
CPC分类号： C09K5/14 , C08G77/12 , C08G77/20 , C08K13/06 , H05K7/2039 , C08K2003/2296 , C08K2003/282 , C08K7/18 , C08K9/08 , C08K2201/001 , C08K2201/005
摘要： A composition contains: (A) a curable silicone composition including: (a1) a vinyldimethylsiloxy-terminated polydimethylpolysiloxane having a viscosity in a range of 30-400 milliPascal*seconds, (a2) a silicon-hydride functional crosslinker, and (a3) a hydrosilylation catalyst, where the molar ratio of silicon-hydride functionality from the crosslinker to vinyl functionality is in a range of 0.5:1 to 1:1; (B) a filler treating agent comprising one or both of an alkyl trialkoxysilane and a mono-trialkoxysiloxy terminated dimethylpolysiloxane; and (C) a thermally conductive filler mixture including (c1) 40-55 wt % of aluminum nitride fillers, containing a blend of: (c1-a) 15-41 wt % of spherical aluminum nitride particles having a D50 particle size of 100 micrometers or more, and (c1-b) spherical or irregular shaped aluminum nitride particles having a D50 particle size of 20-80 micrometers; (c2) spherical aluminum oxide particles having a D50 particle size of 1-5 micrometers; and (c3) 10-20 wt % of irregular zinc oxide particles having a D50 particle size of 0.1-0.5 micrometer; where the total amount of the thermally conductive filler mixture is 94-97 wt %; and where wt % values are relative to the weight of the thermally conductive composition unless otherwise stated.
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公开(公告)号：US20230313014A1
公开(公告)日：2023-10-05
申请号：US18006039
申请日：2021-10-14
发明人： Zhengming Tang , Shreyas Bhide , Hongyu Chen , Peng Wei , Patricia Ansems Bancroft , Zhihua Liu , Son Phan
CPC分类号： C09K5/10 , C08G77/045 , C08G77/38 , H05K7/20236 , H05K7/20263 , H05K7/20772 , H05K7/20272
摘要： A process includes immersing a device in a cooling fluid, the cooling fluid comprising an alkyl modified silicone oil having the following average chemical structure (I) : (CH 3) 3SiO- [ (CH 3) 2) SiO] m- [R (CH 3) SiO] n-Si (CH 3) 3 (I) where: R in each occurrence is an alkyl or substituted alkyl having 6 or more and at the same time 17 or fewer carbon atoms; subscript m has a value of one or higher and at the same time less than 22, subscript n has a value of one or higher, and the sum of m+n is greater than 5 and at the same time less than 50.
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