公开(公告)号：US20130316155A1

公开(公告)日：2013-11-28

申请号：US13679714

申请日：2012-11-16

Applicant: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD.

Inventor： CHANG-YUAN LI ,  LI-MING CHOU ,  LI-CHIH YU ,  TSE-AN LEE

IPC: C08L63/00 ,  B32B3/10 ,  B32B15/092 ,  C08L37/00 ,  C08L79/02

CPC classification number: C08L63/00 ,  B32B3/10 ,  B32B5/022 ,  B32B5/024 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2457/08 ,  C08G73/0233 ,  C08J5/24 ,  C08J2363/00 ,  C08L37/00 ,  C08L61/00 ,  C08L65/00 ,  C08L79/02 ,  C08L2205/035 ,  H05K1/0353 ,  H05K1/0373 ,  H05K2201/0209 ,  Y10T428/24917 ,  Y10T428/31529 ,  C08L25/18 ,  C08L61/06 ,  C08L79/04

Abstract: A halogen-free resin composition includes 100 parts by weight of epoxy resin; 10 to 100 parts by weight of benzoxazine resin; 10 to 100 parts by weight of styrene-maleic anhydride copolymer; and 10 to 90 parts by weight of dicyclopentadiene phenol novolac resin. The halogen-free resin composition features specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dielectric dissipation factor, high heat resistance and high non-flammability and produce prepregs or resin film, and is thus applicable to copper clad laminates and printed circuit boards.

Abstract translation: 无卤树脂组合物包含100重量份的环氧树脂; 10〜100重量份苯并恶嗪树脂; 10〜100重量份苯乙烯 - 马来酸酐共聚物; 和10〜90重量份的二环戊二烯苯酚酚醛清漆树脂。 无卤素树脂组合物具有特定的成分和比例以获得低介电常数（Dk），低介电损耗因数，高耐热性和高不可燃性，并且制备预浸料或树脂膜，因此可应用于覆铜层压板和 印刷电路板。

公开(公告)号：US20140178656A1

公开(公告)日：2014-06-26

申请号：US13827911

申请日：2013-03-14

Applicant: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO.,LTD

Inventor： CHANG-YUAN LI ,  YI-JEN CHEN ,  HONG-XIA PENG

IPC: C08L63/00 ,  C08L35/00 ,  H05K1/03 ,  C08L79/04

CPC classification number: C08L63/00 ,  C08G59/302 ,  C08G59/4064 ,  C08G59/621 ,  C08L35/00 ,  C09D163/00 ,  H05K1/0353 ,  Y10T428/24917 ,  Y10T428/31529 ,  C08L35/06

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of styrene-maleic anhydride (SMA) copolymer; and (C) 5 to 50 parts by weight of bisphenol S. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a high glass transition temperature, high heat resistance, and attractive appearance, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract translation: 无卤树脂组合物包含（A）100重量份环氧树脂; （B）10〜100重量份苯乙烯 - 马来酸酐（SMA）共聚物; 和（C）5〜50重量份的双酚S.无卤素树脂组合物包含特定成分，其特征在于其特定比例，从而实现高玻璃化转变温度，高耐热性和有吸引力的外观，以及 因此适用于制备预浸料或树脂膜，从而可应用于覆铜层压板和印刷电路板。

公开(公告)号：US20140178697A1

公开(公告)日：2014-06-26

申请号：US13834473

申请日：2013-03-15

Applicant: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD.

Inventor： CHANG-YUAN LI ,  LI-CHIH YU ,  HONG-XIA PENG

IPC: H05K1/03

CPC classification number: H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/31529

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 2 to 15 parts by weight of oxydianiline (ODA); and (C) 2 to 20 parts by weight of amino triazine novolac (ATN) resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract translation: 无卤树脂组合物包含（A）100重量份环氧树脂; （B）2〜15重量份氧化二苯胺（ODA）; 和（C）2〜20重量份氨基三嗪酚醛清漆（ATN）树脂。 无卤树脂组合物包括特定成分，其特征在于其特定比例，从而实现低介电常数，低介电损耗因子，高耐热性和高阻燃性，因此适用于制备预浸料或 树脂膜，从而可应用于铜包覆层压板和印刷电路板。