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公开(公告)号:US20060249751A1
公开(公告)日:2006-11-09
申请号:US11124469
申请日:2005-05-06
申请人: Edouard de Fresart , Richard De Souza , Xin Lin , Jennifer Morrison , Patrice Parris , Moaniss Zitouni
发明人: Edouard de Fresart , Richard De Souza , Xin Lin , Jennifer Morrison , Patrice Parris , Moaniss Zitouni
IPC分类号: H01L31/00
CPC分类号: H01L29/0847 , H01L29/7833 , H01L29/7835 , H01L2924/0002 , H01L2924/00
摘要: Methods and apparatus are provided for a MOSFET (50, 99, 199) exhibiting increased source-drain breakdown voltage (BVdss). Source (S) (70) and drain (D) (76) are spaced apart by a channel (90) underlying a gate (84) and one or more carrier drift spaces (92, 92′) serially located between the channel (90) and the source (70, 70′) or drain (76, 76′). A buried region (96, 96′) of the same conductivity type as the drift space (92, 92′) and the source (70, 70′) or drain (76, 76′) is provided below the drift space (92, 92′), separated therefrom in depth by a narrow gap (94, 94′) and ohmically coupled to the source (70, 70′) or drain (76, 76′). Current flow (110) through the drift space produces a potential difference (Vt) across this gap (94, 94′). As the S-D voltage (Vo) and current (109, Io) increase, this difference (Vt) induces high field conduction between the drift space (92, 92′) and the buried region (96, 96′) and diverts part (112, It) of the S-D current (109, Io) through the buried region (96, 96′) and away from the near surface portions of the drift space (92, 92′) where breakdown generally occurs. Thus, BVdss is increased.
摘要翻译: 为具有增加的源 - 漏击穿电压(BVdss)的MOSFET(50,99,199)提供了方法和装置。 源极(S)(70)和漏极(D)(76)通过栅极(84)下面的沟道(90)和串联地位于沟道(90)之间的一个或多个载流子漂移空间(92,92')间隔开 )和源极(70,70')或漏极(76,76')。 与漂移空间(92,92')和源极(70,70')或漏极(76,76')相同的导电类型的掩埋区域(96,96')设置在漂移空间(92,92')的下方, 92'),通过狭窄的间隙(94,94')深度地分离,并且与欧姆耦合到源极(70,70')或漏极(76,76')。 穿过漂移空间的电流(110)在该间隙(94,94')上产生电位差(Vt)。 随着SD电压(Vo)和电流(109,Io)的增加,该差值(Vt)引起漂移空间(92,92')和掩埋区域(96,96')之间的高场导通,并且转移部分 ,It)通过掩埋区域(96,96')并远离漂移空间(92,92')的通常发生击穿的漂移空间(92,92')的近表面部分的SD电流(109,Io)。 因此,BVdss增加。
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公开(公告)号:US20070158777A1
公开(公告)日:2007-07-12
申请号:US11689313
申请日:2007-03-21
申请人: Edouard de Fresart , Richard De Souza , Xin Lin , Jennifer Morrison , Patrice Parris , Moaniss Zitouni
发明人: Edouard de Fresart , Richard De Souza , Xin Lin , Jennifer Morrison , Patrice Parris , Moaniss Zitouni
IPC分类号: H01L23/58 , H01L21/336
CPC分类号: H01L29/0847 , H01L29/7833 , H01L29/7835 , H01L2924/0002 , H01L2924/00
摘要: Methods and apparatus are provided for a MOSFET (50, 99, 199) exhibiting increased source-drain breakdown voltage (BVdss). Source (S) (70) and drain (D) (76) are spaced apart by a channel (90) underlying a gate (84) and one or more carrier drift spaces (92, 92′) serially located between the channel (90) and the source (70, 70′) or drain (76, 76′). A buried region (96, 96′) of the same conductivity type as the drift space (92, 92′) and the source (70, 70′) or drain (76, 76′) is provided below the drift space (92, 92′), separated therefrom in depth by a narrow gap (94, 94′) and ohmically coupled to the source (70, 70′) or drain (76, 76′). Current flow (110) through the drift space produces a potential difference (Vt) across this gap (94, 94′). As the S-D voltage (Vo) and current (109, Io) increase, this difference (Vt) induces high field conduction between the drift space (92, 92′) and the buried region (96, 96′) and diverts part (112, It) of the S-D current (109, Io) through the buried region (96, 96′) and away from the near surface portions of the drift space (92, 92′) where breakdown generally occurs. Thus, BVdss is increased.
摘要翻译: 为具有增加的源 - 漏击穿电压(BVdss)的MOSFET(50,99,199)提供了方法和装置。 源极(S)(70)和漏极(D)(76)通过栅极(84)下面的沟道(90)和串联地位于沟道(90)之间的一个或多个载流子漂移空间(92,92')间隔开 )和源极(70,70')或漏极(76,76')。 与漂移空间(92,92')和源极(70,70')或漏极(76,76')相同的导电类型的掩埋区域(96,96')设置在漂移空间(92,92')的下方, 92'),通过狭窄的间隙(94,94')深度地分离,并且与欧姆耦合到源极(70,70')或漏极(76,76')。 穿过漂移空间的电流(110)在该间隙(94,94')上产生电位差(Vt)。 随着SD电压(Vo)和电流(109,Io)的增加,该差值(Vt)引起漂移空间(92,92')和掩埋区域(96,96')之间的高场导通,并且转移部分 ,It)通过掩埋区域(96,96')并远离漂移空间(92,92')的通常发生击穿的漂移空间(92,92')的近表面部分的SD电流(109,Io)。 因此,BVdss增加。
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公开(公告)号:US20060134862A1
公开(公告)日:2006-06-22
申请号:US11015110
申请日:2004-12-17
IPC分类号: H01L21/336
CPC分类号: H01L27/101 , G11C16/02 , G11C16/0416 , H01L27/115 , H01L27/11517 , H01L27/11521
摘要: A non-volatile memory bitcell structure is disclosed that includes a dual capacitor structure. A first metal-insulator-metal (MIM) capacitor having a first capacitance value includes a first top plate, a first bottom plate, and a first dielectric disposed in-between the first top plate and the first bottom plate. A second metal-insulator-metal (MIM) capacitor having a second capacitance value includes a second top plate, a second bottom plate, and a second dielectric disposed in-between the second top plate and the second bottom plate. An element of the first MIM capacitor is electrically coupled in common with an element of the second MIM capacitor. In addition, the first capacitance value is greater than the second capacitance value.
摘要翻译: 公开了一种包括双电容器结构的非易失性存储器位单元结构。 具有第一电容值的第一金属绝缘体金属(MIM)电容器包括第一顶板,第一底板和设置在第一顶板和第一底板之间的第一电介质。 具有第二电容值的第二金属 - 绝缘体金属(MIM)电容器包括设置在第二顶板和第二底板之间的第二顶板,第二底板和第二电介质。 第一MIM电容器的元件与第二MIM电容器的元件共同地电耦合。 此外,第一电容值大于第二电容值。
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公开(公告)号:US20060292755A1
公开(公告)日:2006-12-28
申请号:US11169962
申请日:2005-06-28
申请人: Patrice Parris , Weize Chen , John McKenna , Jennifer Morrison , Moaniss Zitouni , Richard De Souza
发明人: Patrice Parris , Weize Chen , John McKenna , Jennifer Morrison , Moaniss Zitouni , Richard De Souza
CPC分类号: H01L27/112 , H01L23/5252 , H01L27/11206 , H01L2924/0002 , Y10S438/981 , H01L2924/00
摘要: A tunable antifuse element (102, 202, 204, 504, 952) and method of fabricating the tunable antifuse element, including a substrate material (101) having an active area (106) formed in a surface, a gate electrode (104) having at least a portion positioned above the active area (106), and a dielectric layer (110) disposed between the gate electrode (104) and the active area (106). The dielectric layer (110) including the fabrication of one of a tunable stepped structure (127). During operation, a voltage applied between the gate electrode (104) and the active area (106) creates a current path through the dielectric layer (110) and a rupture of the dielectric layer (110) in a plurality of rupture regions (130). The dielectric layer (110) is tunable by varying the stepped layer thicknesses and the geometry of the layer.
摘要翻译: 一种可调谐反熔断元件(102,202,204,504,952)和制造可调谐反熔丝元件的方法,包括在表面上形成有源区(106)的基片材料(101),具有 位于有源区域(106)上方的至少一部分,和设置在栅电极(104)和有源区域(106)之间的电介质层(110)。 介电层(110)包括制造可调阶梯结构(127)之一。 在操作期间,施加在栅极电极(104)和有源区域(106)之间的电压产生穿过介电层(110)的电流路径,并且多个断裂区域(130)中的电介质层(110)的破裂, 。 电介质层(110)可以通过改变阶梯层厚度和层的几何形状来调节。
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公开(公告)号:US20050062130A1
公开(公告)日:2005-03-24
申请号:US10668694
申请日:2003-09-23
IPC分类号: H01L20060101 , H01L21/02 , H01L21/8242 , H01L29/76 , H01L31/119
CPC分类号: H01L28/75 , H01L21/31645 , H01L23/5223 , H01L28/65 , H01L2924/0002 , H01L2924/00
摘要: By forming a conductive smoothing layer over the bottom electrode and/or a capacitor dielectric, a MIM capacitor with improved reliability due to reduction of geometrically enhanced electric fields and electrode smoothing is formed. In one embodiment, layer including a refractory metal or a refractory metal-rich nitride, is formed over a first capping layer formed of a refractory nitride. In addition, a second refractory metal or a refractory metal-rich nitride layer may be formed on the capacitor dielectric. The smoothing layer could also be used in other semiconductor devices, such as transistors between a gate electrode and a gate dielectric.
摘要翻译: 通过在底部电极和/或电容器电介质上形成导电平滑层,形成由于减小了几何增强的电场和电极平滑而具有可靠性提高的MIM电容器。 在一个实施方案中,在由耐火氮化物形成的第一覆盖层上形成包括难熔金属或难熔金属富氮化物的层。 此外,可以在电容器电介质上形成第二难熔金属或难熔金属富氮的氮化物层。 平滑层也可以用于其它半导体器件,例如栅极电极和栅极电介质之间的晶体管。
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