摘要:
A tunable antifuse element (102, 202, 204, 504, 952) and method of fabricating the tunable antifuse element, including a substrate material (101) having an active area (106) formed in a surface, a gate electrode (104) having at least a portion positioned above the active area (106), and a dielectric layer (110) disposed between the gate electrode (104) and the active area (106). The dielectric layer (110) including the fabrication of one of a tunable stepped structure (127). During operation, a voltage applied between the gate electrode (104) and the active area (106) creates a current path through the dielectric layer (110) and a rupture of the dielectric layer (110) in a plurality of rupture regions (130). The dielectric layer (110) is tunable by varying the stepped layer thicknesses and the geometry of the layer.
摘要:
An embodiment of an Ion Sensitive Field Effect Transistor (ISFET) structure includes a substrate, source and drain regions formed within the substrate and spatially separated by a channel region, a gate dielectric and a gate formed over the channel region, multiple conductive structures overlying the surface of the substrate, and one or more protection diode circuits coupled between one or more of the multiple conductive structures and the substrate. The multiple conductive structures include a floating gate structure and a sense plate structure. The floating gate structure is formed over the gate dielectric and includes the gate. The sense plate structure is electrically coupled to the floating gate structure and is configured to sense a concentration of a target ion or molecule in a fluid adjacent to a portion of the sense plate structure.
摘要:
Apparatus and related fabrication methods are provided for capacitor structures. One embodiment of a capacitor structure comprises a plurality of consecutive metal layers and another metal layer. Each via layer of a plurality of via layers is interposed between metal layers of the plurality of metal layers. The plurality of metal layers and the plurality of via layers are cooperatively configured to provide a first plurality of vertical conductive structures corresponding to a first electrode and a second plurality of vertical conductive structures corresponding to a second electrode. The plurality of consecutive metal layers form a plurality of vertically-aligned regions and provide intralayer electrical interconnections among the first plurality of vertical conductive structures. The first metal layer provides an intralayer electrical interconnection among the second plurality of vertical conductive structures, wherein each vertically-aligned region has a vertical conductive structure of the second plurality of vertical conductive structures disposed therein.
摘要:
A tunable antifuse element (102, 202, 204, 504, 952) includes a substrate material (101) having an active area (106) formed in a surface, a gate electrode (104) having at least a portion positioned above the active area (106), and a dielectric layer (110) disposed between the gate electrode (104) and the active area (106). The dielectric layer (110) includes a tunable stepped structure (127). During operation, a voltage applied between the gate electrode (104) and the active area (106) creates a current path through the dielectric layer (110) and a rupture of the dielectric layer (110) in a rupture region (130). The dielectric layer (110) is tunable by varying the stepped layer thicknesses and the geometry of the layer.
摘要:
A tunable antifuse element (102, 202, 204, 504, 952) includes a substrate material (101) having an active area (106) formed in a surface, a gate electrode (104) having at least a portion positioned above the active area (106), and a dielectric layer (110) disposed between the gate electrode (104) and the active area (106). The dielectric layer (110) includes a tunable stepped structure (127). During operation, a voltage applied between the gate electrode (104) and the active area (106) creates a current path through the dielectric layer (110) and a rupture of the dielectric layer (110) in a rupture region (130). The dielectric layer (110) is tunable by varying the stepped layer thicknesses and the geometry of the layer.
摘要:
A tunable antifuse element (102, 202, 204, 504, 952) and method of fabricating the tunable antifuse element, including a substrate material (101) having an active area (106) formed in a surface, a gate electrode (104) having at least a portion positioned above the active area (106), and a dielectric layer (110) disposed between the gate electrode (104) and the active area (106). The dielectric layer (110) including the fabrication of one of a tunable stepped structure (127). During operation, a voltage applied between the gate electrode (104) and the active area (106) creates a current path through the dielectric layer (110) and a rupture of the dielectric layer (110) in a plurality of rupture regions (130). The dielectric layer (110) is tunable by varying the stepped layer thicknesses and the geometry of the layer.
摘要:
An electronic apparatus includes a semiconductor substrate and first and second transistors disposed in the semiconductor substrate. The first transistor includes a channel region and a drain region adjacent the channel region. The second transistor includes a channel region, a false drain region adjacent the channel region, and a drain region electrically coupled to the channel region by a drift region such that the second transistor is configured for operation at a higher voltage level than the first transistor. The respective channel regions of the first and second transistors have a common configuration characteristic.
摘要:
A semiconductor device includes a substrate having a surface, a composite body region disposed in the substrate, having a first conductivity type, and comprising a body contact region at the surface of the substrate and a well in which a channel is formed during operation, a source region disposed in the semiconductor substrate adjacent the composite body region and having a second conductivity type, and an isolation region disposed between the body contact region and the source region. The composite body region further includes a body conduction path region contiguous with and under the source region, and the body conduction path region has a higher dopant concentration level than the well.
摘要:
A Schottky diode includes a device structure having a central portion and a plurality of fingers. Distal portions of the fingers overlie leakage current control (LCC) regions. An LCC region is relatively narrow and deep, terminating in proximity to a buried layer of like polarity. Under reverse bias, depletion regions forming in an active region lying between the buried layer and the LCC regions occupy the entire extent of the active region and thereby provide a carrier depleted wall. An analogous depletion region occurs in the active region residing between any pair of adjacent fingers. If the fingers include latitudinal oriented fingers and longitudinal oriented fingers, depletion region blockades in three different orthogonal orientations may occur. The formation of the LCC regions may include the use of a high dose, low energy phosphorous implant using an LCC implant mask and the isolation structures as an additional hard mask.
摘要:
A differential pair sensing circuit (300) includes control gates (306, 316) for separately programming a reference transistor (350) and a chemically-sensitive transistor (351) to a desired threshold voltage Vt to eliminate the mismatch between the transistors in order to increase the sensitivity and/or accuracy of the sensing circuit without increasing the circuit size.