High voltage field effect device and method
    1.
    发明申请
    High voltage field effect device and method 有权
    高电压场效应装置及方法

    公开(公告)号:US20060249751A1

    公开(公告)日:2006-11-09

    申请号:US11124469

    申请日:2005-05-06

    IPC分类号: H01L31/00

    摘要: Methods and apparatus are provided for a MOSFET (50, 99, 199) exhibiting increased source-drain breakdown voltage (BVdss). Source (S) (70) and drain (D) (76) are spaced apart by a channel (90) underlying a gate (84) and one or more carrier drift spaces (92, 92′) serially located between the channel (90) and the source (70, 70′) or drain (76, 76′). A buried region (96, 96′) of the same conductivity type as the drift space (92, 92′) and the source (70, 70′) or drain (76, 76′) is provided below the drift space (92, 92′), separated therefrom in depth by a narrow gap (94, 94′) and ohmically coupled to the source (70, 70′) or drain (76, 76′). Current flow (110) through the drift space produces a potential difference (Vt) across this gap (94, 94′). As the S-D voltage (Vo) and current (109, Io) increase, this difference (Vt) induces high field conduction between the drift space (92, 92′) and the buried region (96, 96′) and diverts part (112, It) of the S-D current (109, Io) through the buried region (96, 96′) and away from the near surface portions of the drift space (92, 92′) where breakdown generally occurs. Thus, BVdss is increased.

    摘要翻译: 为具有增加的源 - 漏击穿电压(BVdss)的MOSFET(50,99,199)提供了方法和装置。 源极(S)(70)和漏极(D)(76)通过栅极(84)下面的沟道(90)和串联地位于沟道(90)之间的一个或多个载流子漂移空间(92,92')间隔开 )和源极(70,70')或漏极(76,76')。 与漂移空间(92,92')和源极(70,70')或漏极(76,76')相同的导电类型的掩埋区域(96,96')设置在漂移空间(92,92')的下方, 92'),通过狭窄的间隙(94,94')深度地分离,并且与欧姆耦合到源极(70,70')或漏极(76,76')。 穿过漂移空间的电流(110)在该间隙(94,94')上产生电位差(Vt)。 随着SD电压(Vo)和电流(109,Io)的增加,该差值(Vt)引起漂移空间(92,92')和掩埋区域(96,96')之间的高场导通,并且转移部分 ,It)通过掩埋区域(96,96')并远离漂移空间(92,92')的通常发生击穿的漂移空间(92,92')的近表面部分的SD电流(109,Io)。 因此,BVdss增加。

    HIGH VOLTAGE FIELD EFFECT DEVICE AND METHOD
    2.
    发明申请
    HIGH VOLTAGE FIELD EFFECT DEVICE AND METHOD 有权
    高电压场效应器件及方法

    公开(公告)号:US20070158777A1

    公开(公告)日:2007-07-12

    申请号:US11689313

    申请日:2007-03-21

    IPC分类号: H01L23/58 H01L21/336

    摘要: Methods and apparatus are provided for a MOSFET (50, 99, 199) exhibiting increased source-drain breakdown voltage (BVdss). Source (S) (70) and drain (D) (76) are spaced apart by a channel (90) underlying a gate (84) and one or more carrier drift spaces (92, 92′) serially located between the channel (90) and the source (70, 70′) or drain (76, 76′). A buried region (96, 96′) of the same conductivity type as the drift space (92, 92′) and the source (70, 70′) or drain (76, 76′) is provided below the drift space (92, 92′), separated therefrom in depth by a narrow gap (94, 94′) and ohmically coupled to the source (70, 70′) or drain (76, 76′). Current flow (110) through the drift space produces a potential difference (Vt) across this gap (94, 94′). As the S-D voltage (Vo) and current (109, Io) increase, this difference (Vt) induces high field conduction between the drift space (92, 92′) and the buried region (96, 96′) and diverts part (112, It) of the S-D current (109, Io) through the buried region (96, 96′) and away from the near surface portions of the drift space (92, 92′) where breakdown generally occurs. Thus, BVdss is increased.

    摘要翻译: 为具有增加的源 - 漏击穿电压(BVdss)的MOSFET(50,99,199)提供了方法和装置。 源极(S)(70)和漏极(D)(76)通过栅极(84)下面的沟道(90)和串联地位于沟道(90)之间的一个或多个载流子漂移空间(92,92')间隔开 )和源极(70,70')或漏极(76,76')。 与漂移空间(92,92')和源极(70,70')或漏极(76,76')相同的导电类型的掩埋区域(96,96')设置在漂移空间(92,92')的下方, 92'),通过狭窄的间隙(94,94')深度地分离,并且与欧姆耦合到源极(70,70')或漏极(76,76')。 穿过漂移空间的电流(110)在该间隙(94,94')上产生电位差(Vt)。 随着SD电压(Vo)和电流(109,Io)的增加,该差值(Vt)引起漂移空间(92,92')和掩埋区域(96,96')之间的高场导通,并且转移部分 ,It)通过掩埋区域(96,96')并远离漂移空间(92,92')的通常发生击穿的漂移空间(92,92')的近表面部分的SD电流(109,Io)。 因此,BVdss增加。

    Carrier injection protection structure
    3.
    发明授权
    Carrier injection protection structure 有权
    载体注入保护结构

    公开(公告)号:US06787858B2

    公开(公告)日:2004-09-07

    申请号:US10272336

    申请日:2002-10-16

    IPC分类号: H01L2994

    摘要: A structure protects CMOS logic from substrate minority carrier injection caused by the inductive switching of a power device. A single Integrated Circuit (IC) supports one or more power MOSFETs and one or more arrays of CMOS logic. A highly doped ring is formed between the drain of the power MOSFET and the CMOS logic array to provide a low resistance path to ground for the injected minority carriers. Under the CMOS logic is a highly doped buried layer to form a region of high recombination for the injected minority carriers. One or more CMOS devices are formed above the buried layer. The substrate is a resistive and the injected current is attenuated. The well in which the CMOS devices rest forms a low resistance ground plane for the injected minority carriers.

    摘要翻译: 结构保护CMOS逻辑免受由功率器件的感应开关引起的衬底少数载流子注入。 单个集成电路(IC)支持一个或多个功率MOSFET和一个或多个CMOS逻辑阵列。 在功率MOSFET的漏极和CMOS逻辑阵列之间形成高度掺杂的环,以为注入的少数载流子提供低电阻的接地路径。 在CMOS逻辑下是高掺杂掩埋层,以形成注入的少数载流子的高复合区域。 一个或多个CMOS器件形成在掩埋层上方。 衬底是电阻的,并且注入的电流被衰减。 CMOS器件休息的阱为注入的少数载流子形成低电阻接地层。

    Bipolar junction transistor structure with improved current gain characteristics
    4.
    发明授权
    Bipolar junction transistor structure with improved current gain characteristics 有权
    具有改善的电流增益特性的双极结晶体管结构

    公开(公告)号:US06828650B2

    公开(公告)日:2004-12-07

    申请号:US10160940

    申请日:2002-05-31

    IPC分类号: H01L2900

    摘要: A Bipolar Junction Transistor (BJT) that reduces the variation in the current gain through the use of a trench pullback structure. The trench pullback structure is comprised of a trench and an active region. The trench reduces recombination in the emitter-base region through increasing the distance charge carriers must travel between the emitter and the base. The trench also reduces recombination by reducing the amount of interfacial traps that the electrons injected from the emitter are exposed to. Further, the trench is pulled back from the emitter allowing an active region where electrons injected from a sidewall of the emitter can contribute to the overall injected emitter current. This structure offers the same current capability and current gain as a device without the trench between the emitter and the base while reducing the current gain variation.

    摘要翻译: 双极结晶体管(BJT),通过使用沟槽回拉结构减少电流增益的变化。 沟槽回拉结构由沟槽和有源区组成。 沟槽通过增加载流子必须在发射极和基极之间行进的距离来减小发射极 - 基极区域中的复合。 沟槽还通过减少从发射体注入的电子暴露的界面陷阱的量来减少重组。 此外,从发射极拉回沟槽,允许从发射极的侧壁注入的电子能够有助于整个注入的发射极电流的有源区。 该结构提供与发射极和基极之间没有沟槽的器件相同的电流能力和电流增益,同时减小电流增益变化。

    High voltage field effect device and method
    5.
    发明授权
    High voltage field effect device and method 有权
    高电压场效应装置及方法

    公开(公告)号:US07301187B2

    公开(公告)日:2007-11-27

    申请号:US11689313

    申请日:2007-03-21

    摘要: Methods and apparatus are provided for a MOSFET (50, 99, 199) exhibiting increased source-drain breakdown voltage (BVdss). Source (S) (70) and drain (D) (76) are spaced apart by a channel (90) underlying a gate (84) and one or more carrier drift spaces (92, 92′) serially located between the channel (90) and the source (70, 70′) or drain (76, 76′). A buried region (96, 96′) of the same conductivity type as the drift space (92, 92′) and the source (70, 70′) or drain (76, 76′) is provided below the drift space (92, 92′), separated therefrom in depth by a narrow gap (94, 94′) and ohmically coupled to the source (70, 70′) or drain (76, 76′). Current flow (110) through the drift space produces a potential difference (Vt) across this gap (94, 94′). As the S-D voltage (Vo) and current (109, Io) increase, this difference (Vt) induces high field conduction between the drift space (92, 92′) and the buried region (96, 96′) and diverts part (112, It) of the S-D current (109, Io) through the buried region (96, 96′) and away from the near surface portions of the drift space (92, 92′) where breakdown generally occurs. Thus, BVdss is increased.

    摘要翻译: 为具有增加的源 - 漏击穿电压(BVdss)的MOSFET(50,99,199)提供了方法和装置。 源极(S)(70)和漏极(D)(76)通过栅极(84)下面的沟道(90)和串联地位于沟道(90)之间的一个或多个载流子漂移空间(92,92')间隔开 )和源极(70,70')或漏极(76,76')。 与漂移空间(92,92')和源极(70,70')或漏极(76,76')相同的导电类型的掩埋区域(96,96')设置在漂移空间(92,92')的下方, 92'),通过狭窄的间隙(94,94')深度地分离,并且与欧姆耦合到源极(70,70')或漏极(76,76')。 穿过漂移空间的电流(110)在该间隙(94,94')上产生电位差(Vt)。 随着SD电压(Vo)和电流(109,Io)的增加,该差值(Vt)引起漂移空间(92,92')和掩埋区域(96,96')之间的高场导通,并且转移部分 ,It)通过掩埋区域(96,96')并远离漂移空间(92,92')的通常发生击穿的漂移空间(92,92')的近表面部分的SD电流(109,Io)。 因此,BVdss增加。

    BIPOLAR TRANSISTOR DEVICE FABRICATION METHODS
    10.
    发明申请
    BIPOLAR TRANSISTOR DEVICE FABRICATION METHODS 有权
    双极晶体管器件制造方法

    公开(公告)号:US20150380513A1

    公开(公告)日:2015-12-31

    申请号:US14844608

    申请日:2015-09-03

    摘要: A method of fabricating a bipolar transistor device includes performing a first plurality of implantation procedures to implant dopant of a first conductivity type to form emitter and collector regions laterally spaced from one another in a semiconductor substrate, and performing a second plurality of implantation procedures to implant dopant of a second conductivity type in the semiconductor substrate to form a composite base region. The composite base region includes a base contact region, a buried region through which a buried conduction path between the emitter and collector regions is formed during operation, and a base link region electrically connecting the base contact region and the buried region. The base link region has a dopant concentration level higher than the buried region and is disposed laterally between the emitter and collector regions.

    摘要翻译: 一种制造双极晶体管器件的方法包括:执行第一多个注入步骤以注入第一导电类型的掺杂剂,以形成在半导体衬底中彼此横向隔开的发射极和集电极区,以及执行第二多个植入步骤以植入 半导体衬底中的第二导电类型的掺杂剂以形成复合基极区域。 复合基极区域包括基极接触区域,在工作期间形成发射极和集电极区域之间的掩埋传导路径的掩埋区域和电连接基极接触区域和掩埋区域的基极连接区域。 基极区域的掺杂剂浓度水平高于掩埋区域,并且横向设置在发射极和集电极区域之间。