摘要:
A method of power electronic packaging includes a practicable and reliable method of fabricating power circuit modules and associated connections that are compatible with the standard top layer metalization of commercially available power devices. A planar single- or multi-layer membrane structure is attached to a carrier frame, and a via pattern is formed in the membrane. Power devices are aligned and attached to the planar membrane structure; a top layer interconnect structure is formed by metalizing the vias and the film; and a circuit is formed by patterning a deposited metal layer. The carrier frame is removed, and upper and lower thermal base plate sub-assemblies are attached to the power device-on-membrane structure. The planar device-on-membrane structure accommodates different types of power devices having variations in thickness. The thermal base plate sub-assemblies may include integral, high-performance heat exchangers for providing a low thermal resistance path to the ambient.
摘要:
A high-density control circuit for an auxiliary resonant commutation pole (ARCP) circuit is internal to the ARCP package and includes a state machine sequencer for providing control and timing signals to achieve high-efficiency, zero-voltage, and fault-tolerant switching converter operation. The phase leg controller receives as inputs a phase enable signal and a pulse width modulation (PWM) signal from a system controller and gate drive feedback signals from main and auxiliary gate drivers. There are four paths the state machine sequencer can take when making a transition from one dc rail to the other, depending on whether the main diode or main switch is conducting and the magnitude and polarity of the inverter pole output current.
摘要:
A method of power electronic packaging includes a practicable and reliable method of fabricating power circuit modules and associated connections that are compatible with the standard top layer metalization of commercially available power devices. A planar single- or multi-layer membrane structure is attached to a carrier frame, and a via pattern is formed in the membrane. Power devices are aligned and attached to the planar membrane structure; a top layer interconnect structure is formed by metalizing the vias and the film; and a circuit is formed by patterning a deposited metal layer. The carrier frame is removed, and upper and lower thermal base plate sub-assemblies are attached to the power device-on-membrane structure. The planar device-on-membrane structure accommodates different types of power devices having variations in thickness. The thermal base plate sub-assemblies may include integral, high-performance heat exchangers for providing a low thermal resistance path to the ambient.
摘要:
A gate drive latching circuit for an auxiliary resonant commutation circuit for a power switching inverter includes a current monitor circuit providing a current signal to a pair of analog comparators to implement latching of one of a pair of auxiliary switching devices which are used to provide commutation current for commutating switching inverters in the circuit. Each of the pair of comparators feeds a latching circuit which responds to an active one of the comparators for latching the associated gate drive circuit for one of the pair of auxiliary commutating switches. An initial firing signal is applied to each of the commutating switches to gate each into conduction and the resulting current is monitored to determine current direction and therefore the one of the switches which is carrying current. The comparator provides a latching signal to the one of the auxiliary power switches which is actually conducting current and latches that particular power switch into an on state for the duration of current through the device. The latching circuit is so designed that the only time one of the auxiliary switching devices can be latched on is during the duration of an initial firing command signal.
摘要:
A flexible power connector is presented. An embodiment of a flexible power connector includes a stacked structure having one or more insulating strips alternatingly arranged with a plurality of conducting strips, wherein the one or more insulating strips are interposed between the plurality of conducting strips to insulate each conducting strip from the other conducting strip in the stacked structure, and wherein the plurality of conducting strips is disposed parallel and proximate to each other to reduce electrical losses in the stacked structure
摘要:
A power module includes at least one semiconductor die holding structure. Each die holding structure has a substantially cylindrical outer profile and a central axis. Each die holding structure is disposed within a common cylindrical EMI shield. A plurality of semiconductor devices are mounted to each die holding structure to form a substantially symmetric die mounting pattern respect to the central axis of the die holding structure.
摘要:
A power semiconductor module includes: an interconnect layer including an electrical conductor patterned on a dielectric layer, the electrical conductor including a power coupling portion having a thickness sufficient to carry power currents and a control coupling portion having a thickness thinner than that of the power coupling portion; and a semiconductor power device physically coupled to the interconnect layer and electrically coupled to the power coupling portion of the electrical conductor.
摘要:
A power electronic module includes: a switch module including a desaturation detection diode and a power semiconductor switch, and wherein the desaturation detection diode is coupled to a switching connection of the power semiconductor switch; and a driver module coupled to the switch module, wherein the driver module is configured for obtaining a voltage signal across the desaturation detection diode and the power semiconductor switch and configured for turning off the power semiconductor switch upon the voltage signal exceeding a threshold. In one example, the driver module is discrete from the switch module. In another example, the switch module and driver modules are configured to respectively provide and receive a voltage signal of less than or equal to seventy volts.
摘要:
A balun is included in a magnetic resonance imaging system. The balun conditions electromagnetic signals received from at least one RF receiver coil. The balun includes a balun shield having an integrated capacitor therein. The balun blocks unwanted feedback from effecting performance of any components contained within the balun shield.
摘要:
Photovoltaic power converter system including a controller configured to reduce load harmonics is provided. The system comprises a photovoltaic array and an inverter electrically coupled to the array to generate an output current for energizing a load connected to the inverter and to a mains grid supply voltage. The system further comprises a controller including a first circuit coupled to receive a load current to measure a harmonic current in the load current. The controller includes a second circuit to generate a fundamental reference drawn by the load. The controller further includes a third circuit for combining the measured harmonic current and the fundamental reference to generate a command output signal for generating the output current for energizing the load connected to the inverter. The photovoltaic system may be configured to compensate harmonic currents that may be drawn by the load.