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1.发明授权公开(公告)号：US08802760B2
公开(公告)日：2014-08-12
申请号：US13835791
申请日：2013-03-15
发明人： Yong Sung Eom , Jong Tae Moon , Sangwon Oh , Keonsoo Jang
CPC分类号： H05K13/0465 , B23K3/0623 , B23K35/24 , B23K35/34 , B23K35/3601 , B23K35/3613 , B23K2101/36 , B82Y10/00 , H01L24/29 , H01L24/30 , H01L24/83 , H01L2224/1141 , H01L2224/1152 , H01L2224/1184 , H01L2224/16238 , H01L2224/27416 , H01L2224/2784 , H01L2224/3003 , H01L2224/73104 , H01L2224/73204 , H01L2224/81355 , H01L2224/83886 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K3/46 , H05K2201/026 , H05K2201/10977 , Y10T29/49117 , Y10T29/49126
摘要： Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
摘要翻译： 提供了用于各向异性导电粘合剂的组合物，形成焊料凸块的方法和使用其形成倒装芯片的方法。 用于各向异性导电粘合剂的组合物包括低熔点焊料颗粒和热固性聚合物树脂。 各向异性导电粘合剂包括通过混合聚合物树脂和固化剂形成混合物，并将变形剂，催化剂或还原剂与混合物混合。
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公开(公告)号：US09462736B2
公开(公告)日：2016-10-04
申请号：US14325482
申请日：2014-07-08
发明人： Yong Sung Eom , Jong Tae Moon , Sangwon Oh , Keonsoo Jang
IPC分类号： H05K13/04 , B23K3/06 , B23K35/34 , B23K35/36 , B82Y10/00 , B23K35/24 , H05K3/46 , H01L23/00 , H05K3/32 , H05K3/34
CPC分类号： H05K13/0465 , B23K3/0623 , B23K35/24 , B23K35/34 , B23K35/3601 , B23K35/3613 , B23K2101/36 , B82Y10/00 , H01L24/29 , H01L24/30 , H01L24/83 , H01L2224/1141 , H01L2224/1152 , H01L2224/1184 , H01L2224/16238 , H01L2224/27416 , H01L2224/2784 , H01L2224/3003 , H01L2224/73104 , H01L2224/73204 , H01L2224/81355 , H01L2224/83886 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K3/46 , H05K2201/026 , H05K2201/10977 , Y10T29/49117 , Y10T29/49126
摘要： Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
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3.发明授权公开(公告)号：US09155236B2
公开(公告)日：2015-10-06
申请号：US14325517
申请日：2014-07-08
发明人： Yong Sung Eom , Jong Tae Moon , Sangwon Oh , Keonsoo Jang
IPC分类号： H05K3/46 , H05K13/04 , B23K3/06 , B23K35/34 , B23K35/36 , B82Y10/00 , B23K35/24 , H05K3/32 , H05K3/34
CPC分类号： H05K13/0465 , B23K3/0623 , B23K35/24 , B23K35/34 , B23K35/3601 , B23K35/3613 , B23K2101/36 , B82Y10/00 , H01L24/29 , H01L24/30 , H01L24/83 , H01L2224/1141 , H01L2224/1152 , H01L2224/1184 , H01L2224/16238 , H01L2224/27416 , H01L2224/2784 , H01L2224/3003 , H01L2224/73104 , H01L2224/73204 , H01L2224/81355 , H01L2224/83886 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K3/46 , H05K2201/026 , H05K2201/10977 , Y10T29/49117 , Y10T29/49126
摘要： Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
摘要翻译： 提供了用于各向异性导电粘合剂的组合物，形成焊料凸块的方法和使用其形成倒装芯片的方法。 用于各向异性导电粘合剂的组合物包括低熔点焊料颗粒和热固性聚合物树脂。 各向异性导电粘合剂包括通过混合聚合物树脂和固化剂形成混合物，并将变形剂，催化剂或还原剂与混合物混合。
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公开(公告)号：US09293689B2
公开(公告)日：2016-03-22
申请号：US14066085
申请日：2013-10-29
发明人： Chi Hoon Jun , Sang Choon Ko , Jong Tae Moon
IPC分类号： H04R17/00 , H01L41/29 , H01L41/31 , H02N2/18 , H01L41/316 , H01L41/317 , H01L41/318 , H01L41/113
CPC分类号： H01L41/29 , H01L41/1136 , H01L41/31 , H01L41/316 , H01L41/317 , H01L41/318 , H02N2/188 , Y10T29/42
摘要： A piezoelectric micro energy harvester and manufacturing method thereof, the method including: forming an insulation film on a substrate; patterning the insulation film and forming an electrode pad pattern, a center electrode pattern, and a side electrode pattern; forming an open cavity at an inside of the substrate for suspension of the center electrode pattern and the side electrode pattern; disposing a conductive film on the electrode pad pattern, the center electrode pattern, and the side electrode pattern and forming electrode pads, a center electrode, and a side electrode; and forming a piezoelectric film so as to cover a space between the center electrode and the side electrode and upper surfaces of the center electrode and the side electrode.
摘要翻译： 一种压电微能量收集器及其制造方法，所述方法包括：在基板上形成绝缘膜; 图案化绝缘膜并形成电极焊盘图案，中心电极图案和侧面电极图案; 在所述基板的内部形成开放空腔，以悬浮所述中心电极图案和所述侧面电极图案; 在电极焊盘图形，中心电极图案和侧面电极图案上设置导电膜，形成电极焊盘，中心电极和侧面电极; 以及形成压电膜以覆盖中心电极和侧电极之间的空间以及中心电极和侧电极的上表面。
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公开(公告)号：US09980393B2
公开(公告)日：2018-05-22
申请号：US14704597
申请日：2015-05-05
CPC分类号： H05K3/1216 , C25D5/02 , H01B1/02 , H01B1/22 , H05K1/09 , H05K1/095 , H05K3/102 , H05K3/188 , H05K3/246 , H05K2201/0245 , H05K2201/0302 , H05K2203/0425
摘要： A pattern-forming method for forming a conductive circuit pattern, the pattern-forming method including the steps of: preparing a pattern-forming composition composed of: Cu powder; solder particles for electrically coupling the Cu powder; a polymer resin; a deforming agent that is selected from among acrylate oligomer, polyglycols, glycerides, polypropylene glycol, dimethyl silicon, simethinecone, tributyl phosphare, and polymethylsiloxane, and that increases bonding force between the Cu powder and the solder particles; a curing agent; and a reductant; forming a circuit pattern by printing the pattern-forming composition on a substrate; heating the circuit pattern at a temperature effective to cure the pattern-forming composition and provide the conductive circuit pattern; and electrolytically plating a metal layer onto the conductive circuit pattern. A circuit pattern having superior conductivity is formed at low cost.
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