公开(公告)号：US20140346620A1

公开(公告)日：2014-11-27

申请号：US13261875

申请日：2011-11-14

Applicant: EPCOS AG

Inventor： Leif Steen Johansen ,  Jan Tue Ravnkilde ,  Pirmin Hermann Otto Rombach ,  Kurt Rasmussen

IPC: B81B3/00 ,  B81C1/00 ,  H04R31/00

CPC classification number: B81B3/0086 ,  B81C1/00158 ,  B81C1/00698 ,  H04R1/222 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R31/006 ,  H04R2201/003

Abstract: A MEMS microphone has reduced parasitic capacitance. The microphone includes a trench electrically separating an acoustically active section of the backplate from an acoustically inactive section of the backplate.

Abstract translation: MEMS麦克风降低了寄生电容。 麦克风包括将背板的声学活动部分与背板的声学不起作用的部分电隔离的沟槽。

公开(公告)号：US20170156008A1

公开(公告)日：2017-06-01

申请号：US15320216

申请日：2014-07-17

Applicant: Epcos AG

Inventor： Kurt Rasmussen

IPC: H04R19/04 ,  B81C1/00 ,  B81B7/00 ,  H04R19/00 ,  H04R31/00

CPC classification number: H04R19/04 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C1/00158 ,  B81C2201/0104 ,  B81C2201/0176 ,  H04R19/005 ,  H04R31/006 ,  H04R2201/003

Abstract: The present invention concerns a transducer element (1) which comprises a substrate (5) which comprises a cavity (23) extending through the substrate (5), a backplate (3) which is arranged in the cavity (23) of the substrate (5) and a membrane (2) which is movable relative to the backplate (3). Further, the present invention concerns a method of manufacturing a transducer element (1).

公开(公告)号：US20170150276A1

公开(公告)日：2017-05-25

申请号：US15318752

申请日：2014-06-23

Applicant: EPCOS AG

Inventor： Kurt Rasmussen

IPC: H04R19/04 ,  B81C1/00 ,  B81B7/00 ,  H04R31/00 ,  H04R19/00

CPC classification number: H04R19/04 ,  B81B7/0061 ,  B81B2201/0257 ,  B81C1/00269 ,  B81C2203/0109 ,  H04R19/005 ,  H04R31/00 ,  H04R2201/003

Abstract: A microphone and a method for manufacturing a microphone are disclosed. In an embodiment the microphone includes a substrate, a transducer element defining a front volume and a lid arranged such that the transducer element is arranged between the substrate and the lid, wherein the lid comprises an opening which is arranged non-overlapping to the front volume of the transducer element. The microphone further includes an insert arranged between the lid and the transducer element, wherein the insert includes a path which connects the front volume of the transducer element to the opening of the lid.

公开(公告)号：US20150076627A1

公开(公告)日：2015-03-19

申请号：US13261881

申请日：2011-11-14

Applicant: EPCOS AG

Inventor： Leif Steen Johansen ,  Jan Tue Ravnkilde ,  Pirmin Hermann Otto Rombach ,  Kurt Rasmussen

IPC: H04R19/04 ,  H04R31/00

CPC classification number: H04R19/04 ,  B81B7/0025 ,  B81B2201/0257 ,  B81C2201/053 ,  H04R19/005 ,  H04R31/003 ,  H04R2201/003 ,  H04R2410/03

Abstract: A MEMS microphone with reduced parasitic capacitance is provided. A microphone includes a protection film covering a rim-sided area of the backplate.

Abstract translation: 提供具有降低的寄生电容的MEMS麦克风。 麦克风包括覆盖背板的边缘区域的保护膜。

公开(公告)号：US10136226B2

公开(公告)日：2018-11-20

申请号：US14653820

申请日：2012-12-18

Applicant: EPCOS AG

Inventor： Jan Tue Ravnkilde ,  Marcel Giesen ,  Kurt Rasmussen ,  Morten Ginnerup ,  Pirmin Hermann Otto Rombach ,  Wolfgang Pahl ,  Anton Leidl ,  Armin Schober ,  Jürgen Portmann

IPC: H04R19/00 ,  H04R1/04 ,  H04R31/00 ,  H04R19/04 ,  B81B7/00

Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.

公开(公告)号：US20150326979A1

公开(公告)日：2015-11-12

申请号：US14653820

申请日：2012-12-18

Applicant: EPCOS AG

Inventor： Jan Tue Ravnkilde ,  Marcel Giesen ,  Kurt Rasmussen ,  Morten Ginnerup ,  Pirmin Hermann Otto Rombach ,  Wolfgang Pahl ,  Anton Leidl ,  Armin Schober ,  Jürgen Portmann

IPC: H04R19/04 ,  H04R1/04 ,  H04R31/00 ,  H04R19/00

CPC classification number: H04R19/005 ,  B81B7/0016 ,  B81B2207/115 ,  H04R1/04 ,  H04R19/04 ,  H04R31/00 ,  H04R31/006 ,  H04R2201/003

Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.

Abstract translation: 顶端MEMS麦克风具有上侧和底侧。 麦克风包括在上侧具有单片连接的保护元件的MEMS芯片，背板和膜。 麦克风还包括在上侧的声音入口和在底侧的机械或电气连接。

公开(公告)号：US20140346621A1

公开(公告)日：2014-11-27

申请号：US13261882

申请日：2011-11-14

Applicant: EPCOS AG

Inventor： Leif Steen Johansen ,  Jan Tue Ravnkilde ,  Pirmin Hermann Otto Rombach ,  Kurt Rasmussen ,  Dennis Mortensen

IPC: B81B3/00 ,  B81C1/00 ,  H04R31/00

CPC classification number: B81B3/0086 ,  B81C1/00158 ,  B81C1/00698 ,  H04R19/005 ,  H04R31/006 ,  H04R2201/003 ,  Y10T428/24273

Abstract: A MEMS backplate enables MEMS microphones with reduced parasitic capacitance. A MEMS backplate includes a central area and a perforation in the central area. A suspension area surrounds the central area at least partially. An aperture is disposed in the suspension area.

Abstract translation: MEMS背板使MEMS麦克风具有减小的寄生电容。 MEMS背板包括在中心区域的中心区域和穿孔。 悬挂区域至少部分地围绕中心区域。 在悬挂区域设置有孔。