公开(公告)号：US10395843B2

公开(公告)日：2019-08-27

申请号：US15550672

申请日：2016-02-25

Applicant: Epcos AG

Inventor： Markus Koini ,  Christoph Auer ,  Jürgen Konrad ,  Franz Rinner ,  Markus Puff ,  Monika Stadlober ,  Thomas Wippel

IPC: H01G4/228 ,  H01G4/232 ,  H01G2/06 ,  H01G4/38 ,  H05K3/34 ,  H01G4/30 ,  H05K1/18 ,  H01G4/248 ,  H01R43/26

Abstract: An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.

公开(公告)号：US20180247768A1

公开(公告)日：2018-08-30

申请号：US15553430

申请日：2015-12-21

Applicant: Epcos AG

Inventor： Markus Koini ,  Jürgen Konrad ,  Franz Rinner ,  Markus Puff ,  Monika Stadlober ,  Georg Kügerl ,  Thomas Wippel

IPC: H01G4/38 ,  H01G4/248 ,  H01G4/232 ,  H05K1/18

CPC classification number: H01G4/38 ,  H01G2/06 ,  H01G4/228 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H01R43/26 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10909 ,  Y02P70/613

Abstract: The invention specifies an electrical component (1) which has a plurality of partial bodies (2), a base (3) on which the partial bodies (2) are arranged, and at least one connection contact (4, 5) for electrically connecting the partial bodies (2) to a carrier (13). The invention further specifies a method for producing an electrical component (1) having one or more partial bodies (2).

公开(公告)号：US20180047507A1

公开(公告)日：2018-02-15

申请号：US15550672

申请日：2016-02-25

Applicant: Epcos AG

Inventor： Markus Koini ,  Christoph Auer ,  Jürgen Konrad ,  Franz Rinner ,  Markus Puff ,  Monika Stadlober ,  Thomas Wippel

IPC: H01G4/228 ,  H05K1/18 ,  H01G4/30

CPC classification number: H01G4/38 ,  H01G2/06 ,  H01G4/228 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H01R43/26 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10909 ,  Y02P70/613

Abstract: An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.

公开(公告)号：US11342126B2

公开(公告)日：2022-05-24

申请号：US15553430

申请日：2015-12-21

Applicant: Epcos AG

Inventor： Markus Koini ,  Jürgen Konrad ,  Franz Rinner ,  Markus Puff ,  Monika Stadlober ,  Georg Kügerl ,  Thomas Wippel

IPC: H01G4/38 ,  H01G2/06 ,  H01G4/232 ,  H01G4/228 ,  H01G4/30 ,  H05K1/18 ,  H01G4/248 ,  H01R43/26

Abstract: An electrical component having partial bodies, a base on which the partial bodies are arranged, and at least one connection contact for electrically connecting the partial bodies to a carrier. A method for producing an electrical component having one or more partial bodies is also disclosed.

公开(公告)号：US10943740B2

公开(公告)日：2021-03-09

申请号：US16447639

申请日：2019-06-20

Applicant: Epcos AG

Inventor： Markus Koini ,  Christoph Auer ,  Jürgen Konrad ,  Franz Rinner ,  Markus Puff ,  Monika Stadlober ,  Thomas Wippel

IPC: H01G4/38 ,  H01G2/06 ,  H01G4/232 ,  H01G4/228 ,  H01G4/30 ,  H05K1/18 ,  H01G4/248 ,  H01R43/26

Abstract: An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.

公开(公告)号：US20190304702A1

公开(公告)日：2019-10-03

申请号：US16447639

申请日：2019-06-20

Applicant: Epcos AG

Inventor： Markus Koini ,  Christoph Auer ,  Jürgen Konrad ,  Franz Rinner ,  Markus Puff ,  Monika Stadlober ,  Thomas Wippel

IPC: H01G4/38 ,  H01R43/26 ,  H01G4/248 ,  H05K1/18 ,  H01G4/232 ,  H05K3/34 ,  H01G4/228 ,  H01G2/06 ,  H01G4/30

Abstract: An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.