公开(公告)号：US10026882B2

公开(公告)日：2018-07-17

申请号：US14507862

申请日：2014-10-07

申请人： Epistar Corporation ,  IMEC Taiwan Co.

发明人： Guan Ru He ,  Jui-Hung Yeh ,  Kevin T. Y. Huang ,  Chih Chung Chen

IPC分类号： H01L33/62 ,  H01L25/075 ,  H01L21/683 ,  H01L33/48 ,  H01L33/36 ,  H01L27/15 ,  H01L23/00

摘要： LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.

公开(公告)号：US10403804B2

公开(公告)日：2019-09-03

申请号：US16006857

申请日：2018-06-13

申请人： Epistar Corporation ,  IMEC Taiwan Co.

发明人： Guan Ru He ,  Jui-Hung Yeh ,  Kevin T. Y. Huang ,  Chih Chung Chen

IPC分类号： H01L33/62 ,  H01L25/075 ,  H01L21/683 ,  H01L23/00 ,  H01L33/48 ,  H01L33/36 ,  H01L27/15

摘要： LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.

公开(公告)号：US20160099393A1

公开(公告)日：2016-04-07

申请号：US14507862

申请日：2014-10-07

申请人： Epistar Corporation ,  IMEC Taiwan Co.

发明人： Guan Ru He ,  Jui-Hung Yeh ,  Kevin T. Y. Huang ,  Chih Chung Chen

IPC分类号： H01L33/62 ,  H01L33/36 ,  H01L25/075 ,  H01L33/48

CPC分类号： H01L33/62 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/40 ,  H01L24/48 ,  H01L24/64 ,  H01L24/66 ,  H01L24/69 ,  H01L24/73 ,  H01L24/80 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/89 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/36 ,  H01L33/486 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/29194 ,  H01L2224/40245 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/64 ,  H01L2224/73251 ,  H01L2224/80006 ,  H01L2224/8085 ,  H01L2224/80862 ,  H01L2224/80874 ,  H01L2224/84439 ,  H01L2224/84444 ,  H01L2224/84447 ,  H01L2224/84455 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/89 ,  H01L2224/9222 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2933/0016 ,  H01L2933/0066 ,  H01L2221/68304 ,  H01L2224/45099 ,  H01L2224/32 ,  H01L2224/69 ,  H01L2224/83 ,  H01L2224/08 ,  H01L2224/80 ,  H01L2224/85 ,  H01L2224/84 ,  H01L2924/00012 ,  H01L2224/37099

摘要： LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.

摘要翻译： 提供了一种便于集成的LED芯片封装组件，用于通过可延伸金属布线的图案将预先布线的LED芯片安装成彼此电连接。 通过可延伸的金属布线电连接的LED芯片分别代替LED芯片的拾取和放置安装以及引线接合工艺。 晶圆级MEMS技术用于形成并联布线，并联连接到各种接触焊盘。 连接LED芯片的接合线被制成水平布置的可延伸的金属布线，其可以是弹簧形状，并且允许连接的LED芯片之间的距离的扩展和收缩。 进一步提供胶带以将其粘合到LED芯片，并且尺寸延伸以扩大LED芯片之间的距离，以超过一个或多个预定距离。

公开(公告)号：US20180301609A1

公开(公告)日：2018-10-18

申请号：US16006857

申请日：2018-06-13

申请人： Epistar Corporation ,  IMEC Taiwan Co.

发明人： Guan Ru He ,  Jui-Hung Yeh ,  Kevin T. Y. Huang ,  Chih Chung Chen

IPC分类号： H01L33/62 ,  H01L21/683 ,  H01L25/075 ,  H01L23/00 ,  H01L33/48 ,  H01L33/36 ,  H01L27/15

CPC分类号： H01L33/62 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/40 ,  H01L24/48 ,  H01L24/64 ,  H01L24/66 ,  H01L24/69 ,  H01L24/73 ,  H01L24/80 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/89 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/36 ,  H01L33/486 ,  H01L2221/68304 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/29194 ,  H01L2224/32 ,  H01L2224/40245 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/64 ,  H01L2224/73251 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/8085 ,  H01L2224/80862 ,  H01L2224/80874 ,  H01L2224/84439 ,  H01L2224/84444 ,  H01L2224/84447 ,  H01L2224/84455 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/89 ,  H01L2224/9222 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2933/0016 ,  H01L2933/0066 ,  H01L2224/45099 ,  H01L2224/69 ,  H01L2224/83 ,  H01L2224/08 ,  H01L2224/85 ,  H01L2224/84 ,  H01L2924/00012 ,  H01L2224/37099

摘要： LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.