公开(公告)号：US20130200532A1

公开(公告)日：2013-08-08

申请号：US13369059

申请日：2012-02-08

申请人： Ralf Otremba ,  Fong Lim ,  Abdul Rahman Mohamed ,  Chooi Mei Chong ,  Ida Fischbach ,  Xaver Schloegel ,  Juergen Schredl ,  Josef Hoeglauer

发明人： Ralf Otremba ,  Fong Lim ,  Abdul Rahman Mohamed ,  Chooi Mei Chong ,  Ida Fischbach ,  Xaver Schloegel ,  Juergen Schredl ,  Josef Hoeglauer

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L23/49562 ,  H01L23/49524 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/84 ,  H01L24/95 ,  H01L2224/04026 ,  H01L2224/05553 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/0603 ,  H01L2224/2732 ,  H01L2224/2745 ,  H01L2224/27462 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/32058 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/33181 ,  H01L2224/3512 ,  H01L2224/352 ,  H01L2224/37099 ,  H01L2224/37111 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/37164 ,  H01L2224/37169 ,  H01L2224/37572 ,  H01L2224/376 ,  H01L2224/37639 ,  H01L2224/37644 ,  H01L2224/37647 ,  H01L2224/37655 ,  H01L2224/37664 ,  H01L2224/37669 ,  H01L2224/40095 ,  H01L2224/40101 ,  H01L2224/40175 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/40491 ,  H01L2224/73253 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83464 ,  H01L2224/83469 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2224/84439 ,  H01L2224/84444 ,  H01L2224/84447 ,  H01L2224/84455 ,  H01L2224/84464 ,  H01L2224/84469 ,  H01L2224/84801 ,  H01L2224/84825 ,  H01L2224/9221 ,  H01L2224/92246 ,  H01L2224/95 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2924/00012 ,  H01L2224/37599

摘要： A method includes providing a semiconductor chip having a first main surface and a second main surface. A semiconductor chip is placed on a carrier with the first main surface of the semiconductor chip facing the carrier. A first layer of solder material is provided between the first main surface and the carrier. A contact clip including a first contact area is placed on the semiconductor chip with the first contact area facing the second main surface of the semiconductor chip. A second layer of solder material is provided between the first contact area and the second main surface. Thereafter, heat is applied to the first and second layers of solder material to form diffusion solder bonds between the carrier, the semiconductor chip and the contact clip.

摘要翻译： 一种方法包括提供具有第一主表面和第二主表面的半导体芯片。 将半导体芯片放置在载体上，其中半导体芯片的第一主表面面向载体。 第一层焊料材料设置在第一主表面和载体之间。 包括第一接触区域的接触夹子被放置在半导体芯片上，其中第一接触区域面对半导体芯片的第二主表面。 第二层焊料材料设置在第一接触区域和第二主表面之间。 此后，将热量施加到第一和第二层焊料材料，以在载体，半导体芯片和接触夹之间形成扩散焊料接合​​。

公开(公告)号：US20160099393A1

公开(公告)日：2016-04-07

申请号：US14507862

申请日：2014-10-07

申请人： Epistar Corporation ,  IMEC Taiwan Co.

发明人： Guan Ru He ,  Jui-Hung Yeh ,  Kevin T. Y. Huang ,  Chih Chung Chen

IPC分类号： H01L33/62 ,  H01L33/36 ,  H01L25/075 ,  H01L33/48

CPC分类号： H01L33/62 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/40 ,  H01L24/48 ,  H01L24/64 ,  H01L24/66 ,  H01L24/69 ,  H01L24/73 ,  H01L24/80 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/89 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/36 ,  H01L33/486 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/29194 ,  H01L2224/40245 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/64 ,  H01L2224/73251 ,  H01L2224/80006 ,  H01L2224/8085 ,  H01L2224/80862 ,  H01L2224/80874 ,  H01L2224/84439 ,  H01L2224/84444 ,  H01L2224/84447 ,  H01L2224/84455 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/89 ,  H01L2224/9222 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2933/0016 ,  H01L2933/0066 ,  H01L2221/68304 ,  H01L2224/45099 ,  H01L2224/32 ,  H01L2224/69 ,  H01L2224/83 ,  H01L2224/08 ,  H01L2224/80 ,  H01L2224/85 ,  H01L2224/84 ,  H01L2924/00012 ,  H01L2224/37099

摘要： LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.

摘要翻译： 提供了一种便于集成的LED芯片封装组件，用于通过可延伸金属布线的图案将预先布线的LED芯片安装成彼此电连接。 通过可延伸的金属布线电连接的LED芯片分别代替LED芯片的拾取和放置安装以及引线接合工艺。 晶圆级MEMS技术用于形成并联布线，并联连接到各种接触焊盘。 连接LED芯片的接合线被制成水平布置的可延伸的金属布线，其可以是弹簧形状，并且允许连接的LED芯片之间的距离的扩展和收缩。 进一步提供胶带以将其粘合到LED芯片，并且尺寸延伸以扩大LED芯片之间的距离，以超过一个或多个预定距离。

公开(公告)号：US08975117B2

公开(公告)日：2015-03-10

申请号：US13369059

申请日：2012-02-08

申请人： Ralf Otremba ,  Fong Lim ,  Abdul Rahman Mohamed ,  Chooi Mei Chong ,  Ida Fischbach ,  Xaver Schloegel ,  Juergen Schredl ,  Josef Hoeglauer

发明人： Ralf Otremba ,  Fong Lim ,  Abdul Rahman Mohamed ,  Chooi Mei Chong ,  Ida Fischbach ,  Xaver Schloegel ,  Juergen Schredl ,  Josef Hoeglauer

IPC分类号： H01L21/00 ,  H01L21/44

CPC分类号： H01L23/49562 ,  H01L23/49524 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/84 ,  H01L24/95 ,  H01L2224/04026 ,  H01L2224/05553 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/0603 ,  H01L2224/2732 ,  H01L2224/2745 ,  H01L2224/27462 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/32058 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/33181 ,  H01L2224/3512 ,  H01L2224/352 ,  H01L2224/37099 ,  H01L2224/37111 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/37164 ,  H01L2224/37169 ,  H01L2224/37572 ,  H01L2224/376 ,  H01L2224/37639 ,  H01L2224/37644 ,  H01L2224/37647 ,  H01L2224/37655 ,  H01L2224/37664 ,  H01L2224/37669 ,  H01L2224/40095 ,  H01L2224/40101 ,  H01L2224/40175 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/40491 ,  H01L2224/73253 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83464 ,  H01L2224/83469 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2224/84439 ,  H01L2224/84444 ,  H01L2224/84447 ,  H01L2224/84455 ,  H01L2224/84464 ,  H01L2224/84469 ,  H01L2224/84801 ,  H01L2224/84825 ,  H01L2224/9221 ,  H01L2224/92246 ,  H01L2224/95 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2924/00012 ,  H01L2224/37599

摘要： A method includes providing a semiconductor chip having a first main surface and a second main surface. A semiconductor chip is placed on a carrier with the first main surface of the semiconductor chip facing the carrier. A first layer of solder material is provided between the first main surface and the carrier. A contact clip including a first contact area is placed on the semiconductor chip with the first contact area facing the second main surface of the semiconductor chip. A second layer of solder material is provided between the first contact area and the second main surface. Thereafter, heat is applied to the first and second layers of solder material to form diffusion solder bonds between the carrier, the semiconductor chip and the contact clip.

摘要翻译： 一种方法包括提供具有第一主表面和第二主表面的半导体芯片。 将半导体芯片放置在载体上，其中半导体芯片的第一主表面面向载体。 第一层焊料材料设置在第一主表面和载体之间。 包括第一接触区域的接触夹子被放置在半导体芯片上，其中第一接触区域面对半导体芯片的第二主表面。 第二层焊料材料设置在第一接触区域和第二主表面之间。 此后，将热量施加到第一和第二层焊料材料，以在载体，半导体芯片和接触夹之间形成扩散焊料接合​​。

公开(公告)号：US09425132B2

公开(公告)日：2016-08-23

申请号：US14878408

申请日：2015-10-08

申请人： Texas Instruments Incorporated

发明人： Osvaldo Jorge Lopez ,  Jonathan A. Noquil

IPC分类号： H01L23/495 ,  H01L25/16 ,  H01L23/00 ,  H01L25/00 ,  H01L23/31 ,  H01L21/56 ,  H01L25/065

CPC分类号： H01L23/49575 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/165 ,  H01L25/50 ,  H01L2224/27312 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/32147 ,  H01L2224/32148 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/41051 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48111 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/73271 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2224/83464 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/8391 ,  H01L2224/84439 ,  H01L2224/84444 ,  H01L2224/84447 ,  H01L2224/84455 ,  H01L2224/84464 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/8491 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/92147 ,  H01L2224/92157 ,  H01L2224/9221 ,  H01L2224/92242 ,  H01L2224/92247 ,  H01L2224/92252 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/1425 ,  H01L2924/14252 ,  H01L2924/1426 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/20752 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/07812 ,  H01L2224/83447 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/85 ,  H01L2224/27

摘要： A system has a leadframe with leads and a pad. The pad surface having a portion recessed with a depth and an outline suitable for attaching a semiconductor chip. A first chip is vertically stacked to the opposite pad surface. A clip is vertically stacked on the first chip and tied to a lead. A second chip has a terminal attached to the recessed portion and terminals co-planar with the un-recessed portion. A second chip is attached to the clip.

摘要翻译： 系统具有带引线和焊盘的引线框架。 焊盘表面具有凹陷的部分，其具有适于附接半导体芯片的深度和轮廓。 第一芯片垂直堆叠到相对的焊盘表面。 一个夹子垂直堆放在第一个芯片上并绑在一个引线上。 第二芯片具有附接到凹部的端子和与未凹部共同的端子。 第二个芯片连接到夹子上。

公开(公告)号：US09184121B2

公开(公告)日：2015-11-10

申请号：US14173147

申请日：2014-02-05

申请人： Texas Instruments Incorporated

发明人： Osvaldo Jorge Lopez ,  Johathan A. Noquil

IPC分类号： H01L23/495 ,  H01L25/16 ,  H01L23/00 ,  H01L25/00 ,  H01L23/31 ,  H01L21/56 ,  H01L25/065

CPC分类号： H01L23/49575 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/165 ,  H01L25/50 ,  H01L2224/27312 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/32147 ,  H01L2224/32148 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/41051 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48111 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/73271 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2224/83464 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/8391 ,  H01L2224/84439 ,  H01L2224/84444 ,  H01L2224/84447 ,  H01L2224/84455 ,  H01L2224/84464 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/8491 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/92147 ,  H01L2224/92157 ,  H01L2224/9221 ,  H01L2224/92242 ,  H01L2224/92247 ,  H01L2224/92252 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/1425 ,  H01L2924/14252 ,  H01L2924/1426 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/20752 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/07812 ,  H01L2224/83447 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/85 ,  H01L2224/27

摘要： A power supply system (200) has a QFN leadframe with leads and a pad (201, switch node terminal); a pad surface having a portion recessed with a depth (270) and an outline suitable for attaching a semiconductor chip. A first FET chip (220) is vertically stacked to the opposite pad surface. A clip (240) is vertically stacked on the first FET chip and tied to a lead (202, grounded output terminal). A second FET chip (210) has its source terminal attached to the recessed portion and its drain (210a, input terminal) and gate (210b) terminals co-planar with the un-recessed portion. A driver-and-controller chip (230) is attached to the clip. Packaging compound (290) encapsulates the parts but leaves a pad surface and the drain and gate terminals of the second FET chip un-encapsulated.

摘要翻译： 电源系统（200）具有带导线和焊盘（201，开关节点端子）的QFN引线框架; 垫表面，其具有凹入深度（270）的部分和适合于附接半导体芯片的轮廓。 第一FET芯片（220）垂直地堆叠到相对的焊盘表面。 夹子（240）垂直堆叠在第一FET芯片上并连接到引线（202，接地输出端子）。 第二FET芯片（210）的源极端子连接到凹部，其漏极（210a，输入端子）和栅极（210b）端子与未凹入部分共面。 驱动器和控制器芯片（230）附接到夹子。 包装化合物（290）封装部件但留下焊盘表面，并且第二FET芯片的漏极和栅极端子未封装。

公开(公告)号：US20130009296A1

公开(公告)日：2013-01-10

申请号：US13348308

申请日：2012-01-11

申请人： Anthony C. Tsui ,  Hongbo Yang ,  Ming Zhou ,  Weibing Chu ,  Anthony Chia

发明人： Anthony C. Tsui ,  Hongbo Yang ,  Ming Zhou ,  Weibing Chu ,  Anthony Chia

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49575 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49582 ,  H01L23/49586 ,  H01L24/27 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/40249 ,  H01L2224/45014 ,  H01L2224/45033 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83439 ,  H01L2224/83801 ,  H01L2224/84439 ,  H01L2224/84444 ,  H01L2224/84447 ,  H01L2224/84455 ,  H01L2224/84464 ,  H01L2224/84801 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/84 ,  H01L2224/83 ,  H01L2924/206

摘要： Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. The lead frame can include a plurality of terminals with stamped features at edges of the terminals. The stamped features can include flattened portions that are thinner than other portions of the terminals and extend laterally beyond the edges of the terminals. Such stamped features can help mechanically interlock the terminals with the plastic molding of the package body. The stamped features can include patterns and/or other features that may further increase interlocking between the terminals and the package body.

摘要翻译： 本发明的实施例涉及使用冲压来形成半导体器件封装的引线框架上的特征。 引线框架可以包括在端子的边缘处具有冲压特征的多个端子。 冲压的特征可以包括比端子的其它部分薄的扁平部分，并且横向延伸超过端子的边缘。 这种冲压的特征可以帮助机械地将端子与包装体的塑料成型机械地互锁。 冲压的特征可以包括可以进一步增加端子和封装主体之间的互锁的图案和/或其他特征。

公开(公告)号：US12046540B2

公开(公告)日：2024-07-23

申请号：US17117283

申请日：2020-12-10

申请人： Infineon Technologies AG

发明人： Christian Feuerbaum ,  Thomas Stoek

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49524 ,  H01L23/49503 ,  H01L23/49562 ,  H01L23/49579 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L23/49551 ,  H01L2224/3701 ,  H01L2224/37012 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/40499 ,  H01L2224/73263 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84455 ,  H01L2224/8446 ,  H01L2224/84801 ,  H01L2924/181

摘要： An integrated circuit package includes a leadframe with a die pad and a lead. A semiconductor die is attached to a top surface of the die pad. A clip has a lead contact area with a surface pattern on a bottom surface of the clip that is proximate to a first end of the clip. A portion of the surface pattern is attached to a top surface of a terminal pad of the lead. The clip includes a die contact area on the bottom surface of the clip that is proximate to a second end of the clip. The die contact area of the clip is attached to a top contact on the semiconductor die. The surface pattern has a length in a longitudinal direction of the clip in a direction parallel with a plane of the bottom surface of the die pad that is greater than a length of the top surface of the terminal pad of the lead.

公开(公告)号：US20180301609A1

公开(公告)日：2018-10-18

申请号：US16006857

申请日：2018-06-13

申请人： Epistar Corporation ,  IMEC Taiwan Co.

发明人： Guan Ru He ,  Jui-Hung Yeh ,  Kevin T. Y. Huang ,  Chih Chung Chen

IPC分类号： H01L33/62 ,  H01L21/683 ,  H01L25/075 ,  H01L23/00 ,  H01L33/48 ,  H01L33/36 ,  H01L27/15

CPC分类号： H01L33/62 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/40 ,  H01L24/48 ,  H01L24/64 ,  H01L24/66 ,  H01L24/69 ,  H01L24/73 ,  H01L24/80 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/89 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/36 ,  H01L33/486 ,  H01L2221/68304 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/29194 ,  H01L2224/32 ,  H01L2224/40245 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/64 ,  H01L2224/73251 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/8085 ,  H01L2224/80862 ,  H01L2224/80874 ,  H01L2224/84439 ,  H01L2224/84444 ,  H01L2224/84447 ,  H01L2224/84455 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/89 ,  H01L2224/9222 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2933/0016 ,  H01L2933/0066 ,  H01L2224/45099 ,  H01L2224/69 ,  H01L2224/83 ,  H01L2224/08 ,  H01L2224/85 ,  H01L2224/84 ,  H01L2924/00012 ,  H01L2224/37099

摘要： LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.

公开(公告)号：US20180047697A1

公开(公告)日：2018-02-15

申请号：US15557591

申请日：2016-02-15

申请人： PAC TECH - PACKAGING TECHNOLOGIES GMBH

发明人： Heinrich Lüdeke ,  Ricardo Geelhaar

IPC分类号： H01L23/00

CPC分类号： H01L24/48 ,  B23K26/20 ,  H01L24/03 ,  H01L24/05 ,  H01L24/16 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/77 ,  H01L24/81 ,  H01L24/84 ,  H01L24/85 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/16225 ,  H01L2224/37026 ,  H01L2224/37147 ,  H01L2224/40091 ,  H01L2224/40225 ,  H01L2224/40491 ,  H01L2224/40992 ,  H01L2224/40997 ,  H01L2224/4112 ,  H01L2224/45005 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48839 ,  H01L2224/48847 ,  H01L2224/73255 ,  H01L2224/77263 ,  H01L2224/77281 ,  H01L2224/77601 ,  H01L2224/77611 ,  H01L2224/77704 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2224/84214 ,  H01L2224/84424 ,  H01L2224/84439 ,  H01L2224/84444 ,  H01L2224/84447 ,  H01L2224/84455 ,  H01L2224/84464 ,  H01L2224/8484 ,  H01L2224/8485 ,  H01L2224/84986 ,  H01L2224/85051 ,  H01L2224/85203 ,  H01L2224/85214 ,  H01L2224/85379 ,  H01L2224/8584 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2224/13099

摘要： The invention relates to a chip arrangement (10) and to a method for forming a contact connection (11) between a chip (18), in particular a power transistor or the like, and a conductor material track (14), the conductor material track being formed on a non-conductive substrate (12), the chip being arranged on the substrate or on a conductor material track (15), a silver paste (29) or a copper paste being applied to each of a chip contact surface (25) of the chip and the conductor material track (28), a contact conductor (30) being immersed into the silver paste or the copper paste on the chip contact surface and into the silver paste or the copper paste on the conductor material track, a solvent contained in the silver paste or the copper paste being at least partially vaporized by heating and the contact connection being formed by sintering the silver paste or the copper paste by means of laser energy.

公开(公告)号：US20160027722A1

公开(公告)日：2016-01-28

申请号：US14878408

申请日：2015-10-08

申请人： Texas Instruments Incorporated

发明人： Osvaldo Jorge Lopez ,  Jonathan A. Noquil

IPC分类号： H01L23/495 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L23/49575 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/165 ,  H01L25/50 ,  H01L2224/27312 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/32147 ,  H01L2224/32148 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/41051 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48111 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/73271 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2224/83464 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/8391 ,  H01L2224/84439 ,  H01L2224/84444 ,  H01L2224/84447 ,  H01L2224/84455 ,  H01L2224/84464 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/8491 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/92147 ,  H01L2224/92157 ,  H01L2224/9221 ,  H01L2224/92242 ,  H01L2224/92247 ,  H01L2224/92252 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/1425 ,  H01L2924/14252 ,  H01L2924/1426 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/20752 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/07812 ,  H01L2224/83447 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/85 ,  H01L2224/27

摘要： A system has a leadframe with leads and a pad. The pad surface having a portion recessed with a depth and an outline suitable for attaching a semiconductor chip. A first chip is vertically stacked to the opposite pad surface. A clip is vertically stacked on the first chip and tied to a lead. A second chip has a terminal attached to the recessed portion and terminals co-planar with the un-recessed portion. A second chip is attached to the clip.

摘要翻译： 系统具有带引线和焊盘的引线框架。 焊盘表面具有凹陷的部分，其具有适于附接半导体芯片的深度和轮廓。 第一芯片垂直堆叠到相对的焊盘表面。 一个夹子垂直堆放在第一个芯片上并绑在一个引线上。 第二芯片具有附接到凹部的端子和与未凹部共同的端子。 第二个芯片连接到夹子上。