专利检索 cpc:"H01L2224/69" 第 1 页

1.

发明申请
SEMICONDUCTOR PACKAGE WITH CLIP ALIGNMENT NOTCH 有权

公开(公告)号：US20180012829A1

公开(公告)日：2018-01-11

申请号：US15207462

申请日：2016-07-11

申请人： Amkor Technology, Inc.

发明人： Marc Alan Mangrum

IPC分类号： H01L23/495 , H01L23/00

CPC分类号： H01L23/49575 , H01L23/49513 , H01L23/49517 , H01L23/49524 , H01L23/49548 , H01L23/49562 , H01L23/49565 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/69 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/92 , H01L2224/29101 , H01L2224/32145 , H01L2224/32245 , H01L2224/37012 , H01L2224/37147 , H01L2224/40245 , H01L2224/48247 , H01L2224/69 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/84205 , H01L2224/84214 , H01L2224/84385 , H01L2224/84801 , H01L2224/8484 , H01L2224/8485 , H01L2224/84986 , H01L2224/92246 , H01L2924/00014 , H01L2924/1306 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2924/014 , H01L2924/00

摘要： An electronic component includes a leadframe and a first semiconductor die. The leadframe includes a leadframe top side, a leadframe bottom side opposite the leadframe top side, and a top notch at the leadframe top side. The top notch includes a top notch base located between the leadframe top side and the leadframe bottom side, and defining a notch length of the top notch, and can also include a top notch first sidewall extended, along the notch length, from the leadframe top side to the top notch base. The first semiconductor die can include a die top side a die bottom side opposite the die top side and mounted onto the leadframe top side, and a die perimeter. The top notch can be located outside the die perimeter. Other examples and related methods are also disclosed herein.

2.

发明授权
Cap for a chip device having a groove, device provided with said cap, assembly consisting of the device and a wire element, and manufacturing method thereof 有权

公开(公告)号：US09888573B2

公开(公告)日：2018-02-06

申请号：US14428454

申请日：2013-09-13

申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

发明人： Dominique Vicard , Jean Brun

IPC分类号： H05K1/18 , H05K3/46 , H01L23/10 , H01L23/31 , H05K1/11 , H01L23/00 , H05K3/00

CPC分类号： H05K1/11 , H01L23/10 , H01L23/3157 , H01L24/66 , H01L24/69 , H01L2224/66 , H01L2224/69 , H01L2224/72 , H01L2924/00014 , H01L2924/12041 , H05K1/181 , H05K1/182 , H05K3/0091 , H05K3/46 , H05K2201/09036 , H01L2224/48 , H01L2924/00

摘要： The cap (1) is intended to be assembled with at least one chipped element (2), said cap comprising a stack of a plurality of electrically insulating layers (1a) delimiting at least one shoulder (3) forming a part of a first groove (4) for housing a wired element (12). The cap further comprises: at least one electrical bump contact (6) arranged at an assembly surface (7) of the stack intended to be mounted on a face of the chipped element (2); at least one electrical connection terminal (5, 5′) arranged at a wall of the shoulder (3); an electrical link element (8), electrically linking said electrical connection terminal (5) to the electrical bump contact (6).

3.

发明授权
Via and trench filling using injection molded soldering 有权

公开(公告)号：US09773751B1

公开(公告)日：2017-09-26

申请号：US15214935

申请日：2016-07-20

申请人： International Business Machines Corporation

发明人： John U. Knickerbocker , Shriya Kumar , Jae-Woong Nah

IPC分类号： H01L23/00 , H01L23/498

CPC分类号： A61B5/68 , A61B2562/12 , A61M5/00 , A61M2207/00 , B23K3/0638 , B23K2101/36 , H01L21/486 , H01L21/76816 , H01L21/76852 , H01L21/76883 , H01L21/76898 , H01L23/15 , H01L23/49811 , H01L23/49827 , H01L23/49838 , H01L23/53228 , H01L23/53238 , H01L23/53242 , H01L23/53252 , H01L23/53266 , H01L23/5389 , H01L23/66 , H01L24/19 , H01L24/20 , H01L24/27 , H01L24/32 , H01L24/64 , H01L24/69 , H01L24/83 , H01L24/89 , H01L2223/6677 , H01L2224/27312 , H01L2224/32111 , H01L2224/32235 , H01L2224/325 , H01L2224/64 , H01L2224/69 , H01L2224/83801 , H01L2224/89 , H01L2224/96 , H01L2924/014 , H01L2924/1434 , H01L2924/15332 , H05K1/0306 , H05K3/4038 , H05K2201/0305

摘要： A method includes forming one or more vias in a first layer, forming one or more vias in at least a second layer different than the first layer, aligning at least a first via in the first layer with at least a second via in the second layer, and bonding the first layer to the second layer by filling the first via and the second via with solder material using injection molded soldering.

4.

发明申请
VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING 审中-公开

公开(公告)号：US20180344245A1

公开(公告)日：2018-12-06

申请号：US16054366

申请日：2018-08-03

申请人： International Business Machines Corporation

发明人： John U. Knickerbocker , Shriya Kumar , Jae-Woong Nah

IPC分类号： A61B5/00 , H05K3/40 , A61M5/00 , B23K3/06 , H01L21/48 , H01L21/768 , H01L23/15 , H01L23/498 , H01L23/532 , H05K1/03 , H01L23/00 , H01L23/66 , H01L23/538 , B23K101/36

CPC分类号： A61B5/68 , A61B2562/12 , A61M5/00 , A61M2207/00 , B23K3/0638 , B23K2101/36 , H01L21/486 , H01L21/76816 , H01L21/76852 , H01L21/76883 , H01L21/76898 , H01L23/15 , H01L23/49811 , H01L23/49827 , H01L23/49838 , H01L23/53228 , H01L23/53233 , H01L23/53238 , H01L23/53242 , H01L23/53252 , H01L23/53266 , H01L23/5389 , H01L23/66 , H01L24/19 , H01L24/20 , H01L24/27 , H01L24/32 , H01L24/64 , H01L24/69 , H01L24/83 , H01L24/89 , H01L2223/6677 , H01L2224/27312 , H01L2224/32111 , H01L2224/32235 , H01L2224/325 , H01L2224/64 , H01L2224/69 , H01L2224/83801 , H01L2224/89 , H01L2224/96 , H01L2924/014 , H01L2924/1434 , H01L2924/15332 , H05K1/0306 , H05K3/4038 , H05K2201/0305

摘要： An apparatus includes a substrate having one or more vias formed therein. At least one of the vias has at least one liner disposed on at least one sidewall thereof. The apparatus also includes at least one interconnect formed through the at least one via. The one or more interconnects comprise a solder material filled using injection molded soldering.

5.

发明申请
SEMICONDUCTOR ARRANGEMENT, SEMICONDUCTOR SYSTEM AND METHOD OF FORMING A SEMICONDUCTOR ARRANGEMENT 审中-公开
标题翻译：半导体布置，半导体系统和形成半导体布置的方法

公开(公告)号：US20160365295A1

公开(公告)日：2016-12-15

申请号：US15149207

申请日：2016-05-09

申请人： Infineon Technologies AG

发明人： Juergen HOEGERL , Edward FUERGUT

IPC分类号： H01L23/31 , H01L23/04 , H01L23/10 , H01L21/56 , H01L23/492

CPC分类号： H01L23/31 , H01L21/561 , H01L21/566 , H01L21/568 , H01L23/04 , H01L23/10 , H01L23/142 , H01L23/295 , H01L23/3121 , H01L23/3142 , H01L23/492 , H01L23/4924 , H01L23/4928 , H01L23/49562 , H01L23/49877 , H01L23/5386 , H01L23/544 , H01L24/06 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/40 , H01L24/48 , H01L24/50 , H01L24/66 , H01L24/69 , H01L24/73 , H01L24/82 , H01L24/83 , H01L24/86 , H01L24/89 , H01L24/92 , H01L24/97 , H01L29/7393 , H01L29/868 , H01L2223/54486 , H01L2224/04026 , H01L2224/06181 , H01L2224/24137 , H01L2224/2732 , H01L2224/291 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/29311 , H01L2224/29318 , H01L2224/29339 , H01L2224/29347 , H01L2224/29499 , H01L2224/32245 , H01L2224/33181 , H01L2224/40137 , H01L2224/48137 , H01L2224/73201 , H01L2224/73213 , H01L2224/73215 , H01L2224/73217 , H01L2224/73219 , H01L2224/73251 , H01L2224/73263 , H01L2224/73265 , H01L2224/73267 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83801 , H01L2224/83815 , H01L2224/83825 , H01L2224/8384 , H01L2224/8385 , H01L2224/83851 , H01L2224/83855 , H01L2224/84801 , H01L2224/8484 , H01L2224/8485 , H01L2224/92142 , H01L2224/92144 , H01L2224/92147 , H01L2224/92148 , H01L2224/92242 , H01L2224/92244 , H01L2224/92248 , H01L2224/97 , H01L2924/00014 , H01L2924/10155 , H01L2924/1016 , H01L2924/10252 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/1032 , H01L2924/10329 , H01L2924/10331 , H01L2924/10332 , H01L2924/10335 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15162 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/0103 , H01L2924/014 , H01L2224/83 , H01L2224/84 , H01L2224/85 , H01L2224/32 , H01L2224/69 , H01L2224/89 , H01L2224/82 , H01L2224/86 , H01L2224/45099

摘要： A semiconductor arrangement is provided. The semiconductor arrangement may include an electrically conductive plate having a surface, a plurality of power semiconductor devices arranged on the surface of the electrically conductive plate, wherein a first controlled terminal of each power semiconductor device of the plurality of power semiconductor devices may be electrically coupled to the electrically conductive plate, a plurality of electrically conductive blocks, wherein each electrically conductive block may be electrically coupled with a respective second controlled terminal of each power semiconductor device of the plurality of power semiconductor devices; and encapsulation material encapsulating the plurality of power semiconductor devices, wherein at least one edge region of the surface of the electrically conductive plate may be free from the encapsulation material.

摘要翻译： 提供了半导体布置。半导体布置可以包括具有表面的导电板，布置在导电板的表面上的多个功率半导体器件，其中多个功率半导体器件中的每个功率半导体器件的第一受控端可以电耦合导电板，多个导电块，其中每个导电块可以与多个功率半导体器件中的每个功率半导体器件的相应的第二受控端电耦合; 以及封装所述多个功率半导体器件的封装材料，其中所述导电板的表面的至少一个边缘区域可以不含所述封装材料。

6.

发明申请
USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND ASSEMBLY 有权
标题翻译：使用集成在LED器件安装和组件中的MEMS制造

公开(公告)号：US20160099393A1

公开(公告)日：2016-04-07

申请号：US14507862

申请日：2014-10-07

申请人： Epistar Corporation , IMEC Taiwan Co.

发明人： Guan Ru He , Jui-Hung Yeh , Kevin T. Y. Huang , Chih Chung Chen

IPC分类号： H01L33/62 , H01L33/36 , H01L25/075 , H01L33/48

CPC分类号： H01L33/62 , H01L21/6835 , H01L21/6836 , H01L24/29 , H01L24/40 , H01L24/48 , H01L24/64 , H01L24/66 , H01L24/69 , H01L24/73 , H01L24/80 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/89 , H01L24/92 , H01L24/94 , H01L25/0753 , H01L27/153 , H01L33/36 , H01L33/486 , H01L2221/68327 , H01L2221/6834 , H01L2221/68359 , H01L2221/68372 , H01L2221/68381 , H01L2224/29194 , H01L2224/40245 , H01L2224/48091 , H01L2224/48245 , H01L2224/64 , H01L2224/73251 , H01L2224/80006 , H01L2224/8085 , H01L2224/80862 , H01L2224/80874 , H01L2224/84439 , H01L2224/84444 , H01L2224/84447 , H01L2224/84455 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/89 , H01L2224/9222 , H01L2224/94 , H01L2924/00014 , H01L2924/12041 , H01L2933/0016 , H01L2933/0066 , H01L2221/68304 , H01L2224/45099 , H01L2224/32 , H01L2224/69 , H01L2224/83 , H01L2224/08 , H01L2224/80 , H01L2224/85 , H01L2224/84 , H01L2924/00012 , H01L2224/37099

摘要： LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.

摘要翻译： 提供了一种便于集成的LED芯片封装组件，用于通过可延伸金属布线的图案将预先布线的LED芯片安装成彼此电连接。通过可延伸的金属布线电连接的LED芯片分别代替LED芯片的拾取和放置安装以及引线接合工艺。晶圆级MEMS技术用于形成并联布线，并联连接到各种接触焊盘。连接LED芯片的接合线被制成水平布置的可延伸的金属布线，其可以是弹簧形状，并且允许连接的LED芯片之间的距离的扩展和收缩。进一步提供胶带以将其粘合到LED芯片，并且尺寸延伸以扩大LED芯片之间的距离，以超过一个或多个预定距离。