摘要:
Methods of blocking stains on a substrate to be painted are disclosed, as are stain-blocking composites that are useful according to the disclosed methods. In a broad aspect, the methods include the steps of contacting a stained portion of the substrate with a dry film layer; applying pressure to the dry film layer to cause the dry film layer to adhere to the stained portion of the substrate and to at least a portion of the substrate adjacent the stained portion of the substrate; and subsequently coating the dry film layer and the adjacent substrate with one or more additional liquid coating layers. Stain blocking composites useful according to the methods described include a release layer, to which the pressure is applied; a dry film layer, that can be clear or pigmented, that serves to block the stain; and an optional adhesive layer, intended to assist in adhering the dry film layer to the stained portion of the substrate and to at least that portion of the substrate adjacent the stained portion of the substrate.
摘要:
Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
摘要:
Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
摘要:
A dermal patch having comprising at least two layers wherein at least one layer is a polymer matrix system having an active agent admixed therein. At least one of the layers includes a water-dispersible or water-dissipatable polymer. The dermal patch has an elongation factor of at least 50%.
摘要:
A sulfopolyester comprising repeat residue units from the reaction product dimethyl-5-sodiosulfoisophthalate, isophthalic acid, 1,4-cyclohexanedimethanol and diethylene glycol, has at least one property selected from: a) an acidity of greater than 0.030 measured as milliequivalents H+/gram of sulfopolyester; b) a titanium concentration, measured as metal, of less than about 27 ppm, based on the amount of sulfopolyester; or c) an acidity of greater than 0.010 measured as milliequivalents H+/gram of sulfopolyester, a pH of less than 6.0 and a concentration of a base compound of less than 0.0335 moles/kg of sulfopolyester.A method for making the water-dispersible or water-dissipative sulfopolyester of the present invention is disclosed.Aqueous dispersion having from 0.001 to about 35 weight % of the sulfopolyester of the present invention is also disclosed.The sulfopolyester is useful in making hair spray formulations suitable for pump or aerosol spray applicators.
摘要:
A sunscreen composition for the absorption of solar radiation that includes the combination of a phosphate surfactant and a sulfopolyester. The sunscreen formulas of the present invention are stable oil-in-water emulsions and require less phosphate surfactant than formulas omitting sulfopolyester.
摘要:
Compositions and methods useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Methods are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. The compositions and methods may be suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
摘要:
UV-absorbing polymers and copolymers suitable for Composition into sunscreens for the protection of human skin. The UV-absorbing chromophoric monomers chosen are simple and easily synthesized. With the correct choice of chromophoric monomer or mixture of monomers, protection against UV-A radiation or against both UV-A and UV-B radiation can be achieved. With the correct choice of comonomer, copolymers produced as aqueous latex emulsions or as Polyethylene Glycol solutions can also be achieved.
摘要:
A water-dissipatable film forming formulation includes a polymer having at least one water solubilizing or dissipating moiety; an active ingredient or agent; and at least one of a plasticizer or a humectant. The present invention also includes a method for delivering an active agent to the epidermis of a subject. The method includes applying the film forming formulation to a predetermined area of skin.
摘要:
Aqueous dispersions are disclosed, having a minimum film formation temperature no greater than about 50° C., that include a multi-stage emulsion polymer made by a process that includes a first polymerization stage, in which a first monomer mixture having a calculated glass transition temperature of at least about 50° C. is polymerized via free radical emulsion polymerization to obtain a first-stage emulsion polymer, and a second polymerization stage, in which a second monomer mixture, having a calculated glass transition temperature from about −30° C. to about 10° C., is polymerized via free radical emulsion polymerization, in the presence of the first-stage emulsion polymer. The dispersions are useful in a variety of coating compositions that exhibit improved block resistance.