公开(公告)号：US07250576B2

公开(公告)日：2007-07-31

申请号：US10908615

申请日：2005-05-19

申请人： Evan G. Colgan ,  David L. Edwards ,  Benjamin V. Fasano ,  Kamal K. Sikka ,  Jeffrey A. Zitz ,  Wei Zou

发明人： Evan G. Colgan ,  David L. Edwards ,  Benjamin V. Fasano ,  Kamal K. Sikka ,  Jeffrey A. Zitz ,  Wei Zou

IPC分类号： H05K1/16

CPC分类号： H01L23/04 ,  H01L23/3675 ,  H01L23/433 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A chip package including a chip extension for containing thermal interface material (TIM) and improves chip cooling, and a related method, are disclosed. In particular, the chip package includes a chip, a cooling structure coupled to the chip via a TIM, and a chip extension may be thermally coupled to an outer edge of the chip. A TIM placed between the chip and the cooling structure is contained during thermal cycling by the chip extension such that void formation at the edge of the chip, which can move between the chip and cooling structure, is suppressed. The chip extension also improves lateral heat dissipation by providing a greater thermal contact area between the cooling structure and the chip and, if needed, the substrate at a much lower cost than using larger die with lower production unit output from a wafer.

摘要翻译： 公开了一种包括用于包含热界面材料（TIM）并提高芯片冷却的芯片延伸的芯片封装以及相关方法。 特别地，芯片封装包括芯片，经由TIM耦合到芯片的冷却结构，并且芯片延伸部可热耦合到芯片的外边缘。 放置在芯片和冷却结构之间的TIM被芯片延伸部的热循环期间包含，从而可以抑制可在芯片和冷却结构之间移动的芯片边缘处的空隙形成。 芯片延伸还通过在冷却结构和芯片之间提供更大的热接触面积，并且如果需要，以比使用具有较低的晶片生产单位输出的较大模具的成本低得多的成本来改善侧向散热。

公开(公告)号：US08021925B2

公开(公告)日：2011-09-20

申请号：US11955598

申请日：2007-12-13

申请人： David L. Edwards ,  Sushumna Iruvanti ,  Hilton T. Toy ,  Wei Zou

发明人： David L. Edwards ,  Sushumna Iruvanti ,  Hilton T. Toy ,  Wei Zou

IPC分类号： H01L23/02

CPC分类号： H01L23/04 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/42 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/1616 ,  Y10S257/924

摘要： A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.

摘要翻译： 公开了半导体模块结构和形成半导体模块结构的方法。 该结构包括安装在基板上并被盖子覆盖的模具。 热化合物设置在模具和盖子之间的热间隙内。 围绕模具周边的屏障在盖和基板之间延伸，包含热化合物，并且在半导体模块循环期间响应于基板和盖的膨胀和收缩而弯曲。 更具体地，屏障由柔性材料形成或具有与基底和/或盖的柔性连接。 屏障有效地包含了模具和盖子之间的热化合物，从而提供可靠和可控的覆盖模具上的热化合物以进行散热。

公开(公告)号：US07268428B2

公开(公告)日：2007-09-11

申请号：US11160997

申请日：2005-07-19

申请人： David L. Edwards ,  Sushumna Iruvanti ,  Hilton T. Toy ,  Wei Zou

发明人： David L. Edwards ,  Sushumna Iruvanti ,  Hilton T. Toy ,  Wei Zou

IPC分类号： H01L23/34

CPC分类号： H01L23/04 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/42 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/1616 ,  Y10S257/924

摘要： A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.

摘要翻译： 公开了半导体模块结构和形成半导体模块结构的方法。 该结构包括安装在基板上并被盖子覆盖的模具。 热化合物设置在模具和盖子之间的热间隙内。 围绕模具周边的屏障在盖和基板之间延伸，包含热化合物，并且在半导体模块循环期间响应于基板和盖的膨胀和收缩而弯曲。 更具体地，屏障由柔性材料形成或具有与基底和/或盖的柔性连接。 屏障有效地包含了模具和盖子之间的热化合物，从而提供可靠和可控的覆盖模具上的热化合物以进行散热。

公开(公告)号：US20080299707A1

公开(公告)日：2008-12-04

申请号：US11955598

申请日：2007-12-13

申请人： David L. Edwards ,  Sushumna Iruvanti ,  Hilton T. Toy ,  Wei Zou

发明人： David L. Edwards ,  Sushumna Iruvanti ,  Hilton T. Toy ,  Wei Zou

IPC分类号： H01L21/52

CPC分类号： H01L23/04 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/42 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/1616 ,  Y10S257/924

摘要： A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.

摘要翻译： 公开了半导体模块结构和形成半导体模块结构的方法。 该结构包括安装在基板上并被盖子覆盖的模具。 热化合物设置在模具和盖子之间的热间隙内。 围绕模具周边的屏障在盖和基板之间延伸，包含热化合物，并且在半导体模块循环期间响应于基板和盖的膨胀和收缩而弯曲。 更具体地，屏障由柔性材料形成或具有与基底和/或盖的柔性连接。 屏障有效地包含了模具和盖子之间的热化合物，从而提供可靠和可控的覆盖模具上的热化合物以进行散热。

公开(公告)号：US08531025B2

公开(公告)日：2013-09-10

申请号：US11755019

申请日：2007-05-30

申请人： David L. Edwards ,  Sushumna Iruvanti ,  Hilton T. Toy ,  Wei Zou

发明人： David L. Edwards ,  Sushumna Iruvanti ,  Hilton T. Toy ,  Wei Zou

IPC分类号： H01L23/34

CPC分类号： H01L23/04 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/42 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/1616 ,  Y10S257/924

摘要： A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.

摘要翻译： 公开了半导体模块结构和形成半导体模块结构的方法。 该结构包括安装在基板上并被盖子覆盖的模具。 热化合物设置在模具和盖子之间的热间隙内。 围绕模具周边的屏障在盖和基板之间延伸，包含热化合物，并且在半导体模块循环期间响应于基板和盖的膨胀和收缩而弯曲。 更具体地，屏障由柔性材料形成或具有与基底和/或盖的柔性连接。 屏障有效地包含了模具和盖子之间的热化合物，从而提供可靠和可控的覆盖模具上的热化合物以进行散热。

公开(公告)号：US08638675B2

公开(公告)日：2014-01-28

申请号：US12863256

申请日：2008-01-17

申请人： Dongyao Wang ,  Wei Zou ,  Shan Jin

发明人： Dongyao Wang ,  Wei Zou ,  Shan Jin

IPC分类号： H04J1/16 ,  H04B3/36

CPC分类号： H04B7/155 ,  H04L47/6215

摘要： A method and a device for data relay transmission in a wireless relay communication network are provided, in which, the relay station directly obtains corresponding egress CID related information based on input MAC PDUs, then generates output MAC PDUs including the egress CID related information, and at last, according to the egress CID related information, performs QoS scheduling for the output MAC PDUs, so as to output them in an sequence of QoS. The invention omits the steps of de-cascading, de-segmenting or de-capsulating the MAC PDUs in order to obtain MAC SDUs, and the steps of scheduling by category, cascading, segmenting, and encapsulating the MAC SDUs in order to re-generate the MAC PDUs in the prior art, and the invention simplifies the data processing procedure and achieves the goal of decreasing the relay latency.

摘要翻译： 提供了一种在无线中继通信网络中进行数据中继传输的方法和装置，其中中继站基于输入的MAC PDU直接获得对应的出口CID相关信息，然后生成包括出口CID相关信息的输出MAC PDU，以及 最后，根据出口CID相关信息，对输出的MAC PDU进行QoS调度，以便以QoS的顺序输出。 本发明省略了为了获得MAC SDU而对MAC PDU进行解压，去分段或解封装的步骤，以及按类别进行调度，级联，分段和封装MAC SDU的步骤，以便重新生成 现有技术中的MAC PDU，并且本发明简化了数据处理过程并实现了降低中继等待时间的目标。

公开(公告)号：US20130012221A1

公开(公告)日：2013-01-10

申请号：US13521349

申请日：2010-01-19

申请人： Wei Zou ,  Zhenhong Li ,  Haifeng Wang ,  Gang Wu ,  Tao Chen

发明人： Wei Zou ,  Zhenhong Li ,  Haifeng Wang ,  Gang Wu ,  Tao Chen

IPC分类号： H04W72/10

CPC分类号： H04W72/10 ,  H04W72/0406 ,  H04W72/082 ,  H04W72/087 ,  H04W76/14

摘要： Device-to-device (D2D) communication is one alternative to communication between devices through a radio access network. One interesting D2D communication method is reuse-mode D2D, where D2D nodes communicate with each other using the same uplink (UL) radio resource that is being used by some other cellular user equipment(s) (UEs). In other words, the UL cellular resources occupied by cellular UEs are reused by D2D nodes in their short-range communications. Centralized control of D2D communication can be performed by appropriate signaling between a D2D-capable UE and an evolved Node B (eNB).

摘要翻译： 设备到设备（D2D）通信是通过无线电接入网络在设备之间进行通信的替代方案。 一种有趣的D2D通信方法是复用模式D2D，其中D2D节点使用正被一些其他蜂窝用户设备（UE）使用的相同上行链路（UL）无线电资源彼此通信。 换句话说，蜂窝UE占用的UL蜂窝资源在其短距离通信中被D2D节点重用。 D2D通信的集中控制可以通过D2D能力的UE和演进节点B（eNB）之间的适当的信令来执行。

公开(公告)号：US08345587B2

公开(公告)日：2013-01-01

申请号：US12298975

申请日：2007-04-17

申请人： Gang Shen ,  Wei Ni ,  Wei Zou ,  Jimin Liu ,  Shan Jin

发明人： Gang Shen ,  Wei Ni ,  Wei Zou ,  Jimin Liu ,  Shan Jin

IPC分类号： H04B7/14 ,  H04B7/15 ,  H04W4/00

CPC分类号： H04B7/2606 ,  H04W16/26 ,  H04W76/20 ,  H04W84/047

摘要： A method for extending a coverage of a base station in a wireless communication network is disclosed, characterized in that a relay station transfers control information and communication related information between the base station and the mobile station according to an indication of the base station.

摘要翻译： 公开了一种在无线通信网络中扩展基站覆盖的方法，其特征在于，中继站根据基站的指示，在基站与移动站之间传送控制信息和通信相关信息。

公开(公告)号：US08156998B2

公开(公告)日：2012-04-17

申请号：US12710951

申请日：2010-02-23

申请人： Bruce K. Furman ,  Sushumna Iruvanti ,  Paul A. Lauro ,  Yves C. Martin ,  Da Yuan Shih ,  Theodore G. Van Kessel ,  Wei Zou

发明人： Bruce K. Furman ,  Sushumna Iruvanti ,  Paul A. Lauro ,  Yves C. Martin ,  Da Yuan Shih ,  Theodore G. Van Kessel ,  Wei Zou

IPC分类号： F28F7/00

CPC分类号： H01L23/433 ,  F28F13/00 ,  F28F2013/005 ,  H01L2224/73253 ,  Y10T29/4935 ,  Y10T29/53113

摘要： The present invention is a patterned metal thermal interface. In one embodiment a system for dissipating heat from a heat-generating device includes a heat sink having a first surface adapted for thermal coupling to a first surface of the heat generating device and a thermal interface having at least one patterned surface, the thermal interface being adapted to thermally couple the first surface of the heat sink to the first surface of the heat generating device. The patterned surface of the thermal interface allows the thermal interface to deform under compression between the heat sink and the heat generating device, leading to better conformity of the thermal interface to the surfaces of the heat sink and the heat generating device.

摘要翻译： 本发明是图案化的金属热界面。 在一个实施例中，用于从发热装置散热的系统包括具有适于热耦合到发热装置的第一表面的第一表面的散热器和具有至少一个图案化表面的热界面，所述热界面是 适于将散热器的第一表面热耦合到发热装置的第一表面。 热界面的图案化表面允许热界面在散热器和发热装置之间的压缩下变形，导致热界面与散热器和发热装置的表面更好地一致。

公开(公告)号：US07727447B2

公开(公告)日：2010-06-01

申请号：US11143364

申请日：2005-06-02

申请人： Hai-Min Song ,  Shih-Ming Liu ,  Wei Zou ,  Wen-Che Chen ,  Hsin-Pei Chang

发明人： Hai-Min Song ,  Shih-Ming Liu ,  Wei Zou ,  Wen-Che Chen ,  Hsin-Pei Chang

IPC分类号： B29C45/14 ,  B29C70/76

CPC分类号： B29C63/04 ,  B29K2313/00 ,  B29K2711/08 ,  B32B3/04 ,  B32B3/266 ,  B32B7/08 ,  B32B9/025 ,  B32B9/041 ,  B32B15/04 ,  B32B15/043 ,  B32B15/08 ,  B32B15/14 ,  B32B2274/00 ,  B32B2451/00 ,  Y10T428/31678

摘要： A method to produce a product includes the steps of: providing a mold including an upper mold (40) and a lower mold (30), the upper mold defining a plurality of through holes (43); providing a metal piece (10), a hot melt adhesive, and a nonmetal cover layer (50) between the upper and lower molds, the hot melt adhesive arranged between the hot melt adhesive and the cover layer; closing the mold; heating the mold to melt the hot melt adhesive; conducting high-pressure gas into the mold via the through holes to press the cover layer toward the metal piece; opening the mold to pick up an intermediary product having the metal piece and the cover layer attached thereto by means of the adhesive; and applying a sealing layer (60) which joins corresponding free edges of the metal piece and the cover layer to the intermediary product through injection molding technology.

摘要翻译： 一种制造产品的方法包括以下步骤：提供包括上模具（40）和下模具（30）的模具，所述上模具限定多个通孔（43）; 在所述上模和下模之间提供金属片（10），热熔粘合剂和非金属覆盖层（50），所述热熔粘合剂布置在所述热熔粘合剂和所述覆盖层之间; 关闭模具; 加热模具以熔化热熔胶; 通过所述通孔将高压气体导入所述模具中，以朝向所述金属片推压所述覆盖层; 打开模具以通过粘合剂拿起具有金属片和覆盖层的中间产品; 以及通过注射成型技术施加将金属片和覆盖层的相应的自由边缘连接到中间产品的密封层（60）。