公开(公告)号：US11078390B2

公开(公告)日：2021-08-03

申请号：US16282739

申请日：2019-02-22

申请人： Evonik Operations GmbH ,  SI-Coatings GmbH

发明人： Willi Henkenjohann ,  Karl Kuhmann ,  Maximilian Gruhn ,  Andreas Pawlik ,  Martin Risthaus ,  Klaus Welsch ,  Sven Mang

IPC分类号： C09J163/00 ,  C09J177/02 ,  C09J177/06 ,  B32B7/12 ,  B32B15/08 ,  C09J5/06 ,  C08G18/80 ,  C08G59/40 ,  C08G59/62 ,  C09J175/04 ,  C08L61/06 ,  C08L63/00 ,  C08L75/04 ,  C08L77/00 ,  B32B15/092 ,  C09J167/00 ,  C09J177/00

摘要： The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.

公开(公告)号：US20190185724A1

公开(公告)日：2019-06-20

申请号：US16282739

申请日：2019-02-22

申请人： Evonik Degussa GmbH ,  SI-Coatings GmbH

发明人： Willi Henkenjohann ,  Karl Kuhmann ,  Maximilian Gruhn ,  Andreas Pawlik ,  Martin Risthaus ,  Klaus Welsch ,  Sven Mang

IPC分类号： C09J163/00 ,  C08L77/00 ,  C08L75/04 ,  B32B7/12 ,  B32B15/08 ,  C09J5/06 ,  C08G18/80 ,  C08G59/40 ,  C08G59/62 ,  C09J175/04 ,  C09J177/02 ,  C09J177/06 ,  C08L63/00 ,  C08L61/06 ,  C09J167/00 ,  B32B15/092 ,  C09J177/00

CPC分类号： C09J163/00 ,  B32B7/12 ,  B32B15/08 ,  B32B15/092 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2307/712 ,  C08G18/8061 ,  C08G59/4028 ,  C08G59/621 ,  C08L61/06 ,  C08L63/00 ,  C08L75/04 ,  C08L77/00 ,  C09J5/06 ,  C09J167/00 ,  C09J175/04 ,  C09J177/00 ,  C09J177/02 ,  C09J177/06 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2467/003 ,  C09J2477/00 ,  C09J2477/003 ,  Y10T428/31522 ,  Y10T428/31529

摘要： The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.

公开(公告)号：US10995188B2

公开(公告)日：2021-05-04

申请号：US15794811

申请日：2017-10-26

申请人： Evonik Operations GmbH

发明人： Suneel Bandi ,  Andreas Pawlik

IPC分类号： C08J5/04 ,  C08G69/26 ,  C08L77/06

摘要： The present invention relates to a thermoplastic composition that provides improved thermal aging stability. The thermoplastic composition includes a polyamide resin, glass fibers, tin(II) oxalate, and a functional additive. It has been found that a combination of a polyamide resin with tin(II) oxalate and a functional additive produces a superior product demonstrating greater thermal stability than the polyamide resin alone.