公开(公告)号：US09331046B2

公开(公告)日：2016-05-03

申请号：US14315766

申请日：2014-06-26

申请人： FREESCALE SEMICONDUCTOR, INC.

发明人： Chu-Chung Lee ,  Kian Leong Chin ,  Kevin J. Hess ,  James Patrick Johnston ,  Tu-Anh N. Tran ,  Heng Keong Yip

IPC分类号： H01L21/44 ,  H01L23/00 ,  H01L21/56

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L23/62 ,  H01L24/11 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit package includes a semiconductor die attached to a package support. The die has a plurality of peripheral bond pads along a periphery of the die and a first bond pad on an interior portion of the die wherein the first bond pad is a power supply bond pad. A conductive distributor is over the die and within a perimeter of the die and has a first opening. The plurality of bond pads are located between the perimeter of the die and a perimeter of the conductive distributor. The first bond pad is in the first opening. A first bond wire is connected between the first bond pad and the conductive distributor. A second bond wire is connected between a first peripheral bond pad of the plurality of peripheral bond pads and the conductive distributor.

摘要翻译： 集成电路封装包括附接到封装支撑件的半导体管芯。 所述管芯具有沿着所述管芯的周边的多个外围接合焊盘和所述管芯的内部部分上的第一接合焊盘，其中所述第一接合焊盘是电源接合焊盘。 导电分布器在模具之上并且在模具的周边内并且具有第一开口。 多个接合焊盘位于管芯的周边和导电分布器的周边之间。 第一个焊盘在第一个开口。 第一接合线连接在第一接合焊盘和导电分布器之间。 第二接合线连接在多个外围接合焊盘的第一外围接合焊盘和导电分布器之间。