公开(公告)号：US09505953B2

公开(公告)日：2016-11-29

申请号：US14660244

申请日：2015-03-17

Applicant: FUJIFILM Corporation

Inventor： Yu Iwai ,  Kazuhiro Fujimaki ,  Ichiro Koyama

IPC: C09J4/00 ,  H01L21/304 ,  C09J7/00 ,  C09J4/06 ,  H01L21/683 ,  C09J7/02 ,  H01L21/306 ,  H01L21/3105 ,  H01L21/311 ,  C09J133/06

CPC classification number: C09J4/00 ,  C08F222/10 ,  C09J4/06 ,  C09J7/00 ,  C09J7/385 ,  C09J133/06 ,  C09J2203/326 ,  C09J2400/22 ,  C09J2433/00 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/31058 ,  H01L21/31133 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: The invention is directed to a temporary adhesive containing (A) a polymer compound having a radical polymerizable group in its side chain, (B) a radical polymerizable monomer, and (C) a heat radical polymerization initiator, and a production method of semiconductor device having a member processed including: adhering a first surface of a member to be processed to a substrate through an adhesive layer formed from the temporary adhesive; conducting a mechanical or chemical processing on a second surface which is different from the first surface of the member to be processed to obtain the member processed; and releasing the first surface of the member processed from the adhesive layer.

Abstract translation: 本发明涉及一种临时粘合剂，其包含（A）在侧链具有自由基聚合性基团的高分子化合物，（B）自由基聚合性单体和（C）热自由基聚合引发剂，以及半导体装置的制造方法 其特征在于，包括：通过由所述临时粘合剂形成的粘合剂层将待加工的构件的第一表面粘附到基底; 在不同于待加工构件的第一表面的第二表面上进行机械或化学处理以获得处理的构件; 并释放从粘合剂层加工的构件的第一表面。

公开(公告)号：US09966295B2

公开(公告)日：2018-05-08

申请号：US14865755

申请日：2015-09-25

Applicant: FUJIFILM Corporation

Inventor： Ichiro Koyama ,  Yu Iwai ,  Kazuhiro Fujimaki

IPC: H01L21/683 ,  C09J4/00 ,  C09J123/16 ,  C09J125/14 ,  H01L21/324

CPC classification number: H01L21/6835 ,  C09J4/00 ,  C09J123/16 ,  C09J125/14 ,  H01L21/324 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834

Abstract: A temporary bonding laminate for use in the manufacture of semiconductor devices and a method for manufacturing semiconductor devices are provided. A member to be processed (a semiconductor wafer or the like) can be temporarily supported securely and readily during a mechanical or chemical process of the member, and then the processed member can be readily released from the temporary support without damaging the processed member even after a high temperature process. The laminate includes: (A) a release layer and (B) an adhesive layer. The release layer contains (a1) a compound being liquid at 25° C. and having a 5% mass reduction temperature of 250° C. or more when measured in a nitrogen gas stream under heating conditions of a constant heating rate of 20° C./min; and (a2) a binder having a 5% mass reduction temperature of 250° C. or more when measured under the same conditions.

公开(公告)号：US09177921B2

公开(公告)日：2015-11-03

申请号：US14324626

申请日：2014-07-07

Applicant: FUJIFILM CORPORATION

Inventor： Shiro Tan ,  Kazuhiro Fujimaki ,  Yu Iwai ,  Ichiro Koyama ,  Atsushi Nakamura

IPC: H01L21/00 ,  H01L23/00 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L23/562 ,  C09J7/22 ,  C09J7/35 ,  C09J2203/326 ,  C09J2205/302 ,  H01L21/67115 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for manufacturing a semiconductor device with a treated member, includes: subjecting an adhesive support having a substrate and an adhesive layer capable of increasing or decreasing in adhesiveness upon irradiation with an actinic ray, radiation or heat to irradiation of the adhesive layer with an actinic ray, radiation or heat, adhering a first surface of a to-be-treated member to the adhesive layer of the adhesive support, applying a mechanical or chemical treatment to a second surface different from the first surface of the to-be-treated member to obtain a treated member, and detaching a first surface of the treated member from the adhesive layer of the adhesive support, wherein the irradiation of the adhesive layer with an actinic ray, radiation or heat is conducted so that adhesiveness decreases toward an outer surface from an inner surface on the substrate side of the adhesive layer.

Abstract translation: 一种用于制造具有处理部件的半导体器件的方法，包括：对具有基底的粘合剂支撑体和能够增加或降低粘合性的粘合剂层进行照射时的光化射线，辐射或加热以对所述粘合剂层进行照射 光化射线，辐射或热，将待处理部件的第一表面粘附到粘合剂支撑体的粘合剂层上，对不同于被处理物体的第一表面的第二表面进行机械或化学处理 构件，以获得处理构件，并且从粘合剂支撑体的粘合剂层分离处理构件的第一表面，其中进行具有光化射线，辐射或热的粘合剂层的照射，使得粘附性朝向外表面减小 从粘合剂层的基板侧的内表面。

公开(公告)号：US20210356865A1

公开(公告)日：2021-11-18

申请号：US17386174

申请日：2021-07-27

Applicant: FUJIFILM Corporation

Inventor： Yusuke NAMBA ,  Kazuhiro Fujimaki ,  Taira Murakami

IPC: G03F7/033 ,  C08F236/06 ,  B41N1/12

Abstract: An object of the present invention is to provide a water-developable flexographic printing plate precursor which has excellent water developability and exhibits excellent printing durability in a case of being made into a flexographic printing plate, a flexographic printing plate, and a photosensitive resin composition. The water-developable flexographic printing plate precursor of the present invention includes a photosensitive layer, in which the photosensitive layer contains a monomer, a polymerization initiator, a base polymer, and water-dispersible particles, the water-dispersible particles have carbon-carbon double bonds, and an amount of the carbon-carbon double bonds on a surface of the water-dispersible particles is 21 or less.