公开(公告)号：US20200019057A1

公开(公告)日：2020-01-16

申请号：US16580262

申请日：2019-09-24

申请人： FUJIFILM Corporation

发明人： Kei FUKUHARA ,  Yu Iwai

IPC分类号： G03F7/037 ,  G03F7/038 ,  C08G73/10 ,  G03F7/031

摘要： Provided are a photosensitive resin composition in which warping of a cured film after curing is decreased and lithographic properties in a case of forming a pattern are excellent, a cured film, a laminate, a method for producing a cured film, and a semiconductor device. The photosensitive resin composition includes a polyimide precursor including a repeating unit including a biphenyl structure and a photopolymerization initiator having an oxime structure capable of generating an aryl radical by being irradiated with light.

公开(公告)号：US10096776B2

公开(公告)日：2018-10-09

申请号：US15053426

申请日：2016-02-25

申请人： FUJIFILM Corporation

发明人： Pawel Malinowski ,  Atsushi Nakamura ,  Yu Iwai

IPC分类号： H01L21/311 ,  H01L51/00 ,  H01L51/42 ,  H01L51/05 ,  H01L51/56

摘要： A method is provided for photolithographic patterning of an organic layer, comprising: providing a shielding layer on the organic layer; providing a photoresist layer on the shielding layer; illuminating the photoresist layer through a shadow mask; developing the photoresist layer, thereby forming a patterned photoresist layer; performing a first dry etching step using the patterned photoresist layer as a mask, thereby removing at least an upper portion of the photoresist layer and completely removing the shielding layer at locations not covered by the photoresist layer; performing a second dry etching step using the patterned shielding layer as a mask, thereby removing the organic layer at locations not covered by the shielding layer; and removing the shielding layer, wherein removing the shielding layer comprises exposing it to water. A method of the present disclosure may advantageously be used in a process for fabricating organic semiconductor based devices and circuits.

公开(公告)号：US11860538B2

公开(公告)日：2024-01-02

申请号：US16541794

申请日：2019-08-15

申请人： FUJIFILM Corporation

发明人： Takeshi Kawabata ,  Yu Iwai ,  Akinori Shibuya

IPC分类号： C08L79/08 ,  C08L79/04 ,  C08L79/00 ,  B32B15/08 ,  B32B27/28 ,  G03F7/031 ,  C08G73/12 ,  G03F7/038 ,  H01L23/29 ,  H01L23/532 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/38

CPC分类号： G03F7/031 ,  B32B27/281 ,  C08G73/128 ,  G03F7/038 ,  H01L23/293 ,  H01L23/5329 ,  B32B2255/10 ,  B32B2255/205 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/325 ,  G03F7/38

摘要： Provided are a photosensitive resin composition in which the progress of cyclization reaction is fast and storage stability over time is excellent, a heterocyclic ring-containing polymer precursor, a cured film, a laminate, a method for producing a cured film, and a semiconductor device, using the photosensitive resin composition. The photosensitive resin composition includes a heterocyclic ring-containing polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor, and a solvent, in which a solid content of the photosensitive resin composition has an amine value of 0.0002 to 0.0200 mmol/g.

公开(公告)号：US11567405B2

公开(公告)日：2023-01-31

申请号：US16689389

申请日：2019-11-20

申请人： FUJIFILM Corporation

发明人： Takeshi Kawabata ,  Kenta Yoshida ,  Yu Iwai ,  Akinori Shibuya

IPC分类号： G03F7/037 ,  G03F7/004 ,  C08G73/10 ,  C08G73/22 ,  H01L23/29 ,  H01L21/56 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/38

摘要： A photosensitive resin composition is also provided that includes a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; a photo-radical polymerization initiator; and a solvent, in which an acid value of an acid group contained in the polymer precursor and having a neutralization point in a pH range of 7.0 to 12.0 is in a range of 2.5 to 34.0 mgKOH/g, and either the polymer precursor contains a radically polymerizable group or the photosensitive resin composition includes a radically polymerizable compound other than the polymer precursor.

公开(公告)号：US10538627B2

公开(公告)日：2020-01-21

申请号：US15824360

申请日：2017-11-28

申请人： FUJIFILM Corporation

发明人： Takeshi Kawabata ,  Takuma Amemiya ,  Hidekazu Oohashi ,  Yu Iwai ,  Akinori Shibuya

IPC分类号： C08G73/10 ,  G03F7/021 ,  G03F7/023 ,  G03F7/038 ,  H01L23/29 ,  H01L23/31 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  C08F290/14 ,  G03F7/031 ,  G03F7/037 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  H01L23/00

摘要： A photosensitive resin composition using a polyimide precursor composition, a cured film, a method for producing a cured film, a semiconductor device, and a method for producing a polyimide precursor composition are provided. In the polyimide precursor composition, the molar ratio of repeating units represented by General Formula (1-2) among structural isomers of the polyimide precursor is 60% to 90% by mole. In General Formula (1-2), A1 and A2 each independently represents an oxygen atom or NH, R111 and R112 each independently represents a single bond or a divalent organic group, and R113 and R114 each independently represents a hydrogen atom or a monovalent organic group.

公开(公告)号：US10526448B2

公开(公告)日：2020-01-07

申请号：US15852992

申请日：2017-12-22

申请人： FUJIFILM Corporation

发明人： Akinori Shibuya ,  Yu Iwai ,  Takeshi Kawabata ,  Ichiro Koyama

IPC分类号： C08G73/10 ,  C08G73/22 ,  C08F110/02 ,  C08F136/00 ,  C08F290/14 ,  G03F7/031 ,  G03F7/038 ,  H01L21/02 ,  G03F7/023 ,  G03F7/037 ,  C08G73/14

摘要： Provided are photosensitive resin compositions having a wide exposure latitude, a precursor composition for providing such a photosensitive resin composition, a method for producing a precursor composition, a cured film, a method for producing a cured film; and a semiconductor device. The precursor composition is a precursor composition containing at least one kind of heterocycle-containing polymer precursor, in which the heterocycle-containing polymer precursor is selected from a polyimide precursor and a polybenzoxazole precursor; and the dispersity which is a weight-average molecular weight/a number-average molecular weight of the heterocycle-containing polymer precursor is 2.5 or more.

公开(公告)号：US10442961B2

公开(公告)日：2019-10-15

申请号：US15468288

申请日：2017-03-24

申请人： FUJIFILM Corporation

发明人： Yoshitaka Kamochi ,  Ichiro Koyama ,  Yu Iwai ,  Atsushi Nakamura ,  Mitsuru Sawano

IPC分类号： C09J7/00 ,  C09J11/06 ,  C09J121/00 ,  H01L21/02 ,  B32B7/12 ,  B32B25/04 ,  C09J153/02 ,  H01L21/683 ,  C08J3/09 ,  C09J7/10 ,  B32B7/04 ,  B32B7/06 ,  B32B9/04 ,  B32B15/06 ,  B32B25/12 ,  B32B25/14 ,  B32B25/16 ,  B32B25/18 ,  B32B25/20 ,  B32B27/06 ,  B32B27/08 ,  B32B27/36 ,  B32B25/08 ,  B32B27/20 ,  B32B27/26 ,  B32B27/28 ,  B32B27/30 ,  B32B27/32 ,  B32B27/34 ,  B32B27/38 ,  B32B27/42 ,  B32B3/08 ,  C08J5/18

摘要： Provided are a composition which has good elastomer solubility, is thus capable of increasing a concentration of solid contents, and is capable of forming a film having excellent drying properties, surface morphology, and heat resistance, a process for producing a sheet, a sheet, a laminate, and a laminate with a device wafer. This composition includes an elastomer having a 5% thermal mass reduction temperature of 375° C. or higher when heated at an elevation rate of 20° C./min from 25° C., a solvent represented by the following General Formula (1) and having a boiling point of 160° C. or higher, and a solvent having a boiling point of lower than 120° C. In General Formula (1), R1 to R6 each independently represent a hydrogen atom or an aliphatic hydrocarbon group.

公开(公告)号：US11487202B2

公开(公告)日：2022-11-01

申请号：US16689389

申请日：2019-11-20

申请人： FUJIFILM Corporation

发明人： Takeshi Kawabata ,  Kenta Yoshida ,  Yu Iwai ,  Akinori Shibuya

IPC分类号： G03F7/037 ,  G03F7/004 ,  C08G73/10 ,  C08G73/22 ,  H01L23/29 ,  H01L21/56 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/38

摘要： A photosensitive resin composition is also provided that includes a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; a photo-radical polymerization initiator; and a solvent, in which an acid value of an acid group contained in the polymer precursor and having a neutralization point in a pH range of 7.0 to 12.0 is in a range of 2.5 to 34.0 mgKOH/g, and either the polymer precursor contains a radically polymerizable group or the photosensitive resin composition includes a radically polymerizable compound other than the polymer precursor.

公开(公告)号：US11480876B2

公开(公告)日：2022-10-25

申请号：US16580262

申请日：2019-09-24

申请人： FUJIFILM Corporation

发明人： Kei Fukuhara ,  Yu Iwai

IPC分类号： G03F7/037 ,  G03F7/038 ,  G03F7/30 ,  C08G73/10 ,  G03F7/031 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  H01L23/532

摘要： Provided are a photosensitive resin composition in which warping of a cured film after curing is decreased and lithographic properties in a case of forming a pattern are excellent, a cured film, a laminate, a method for producing a cured film, and a semiconductor device. The photosensitive resin composition includes a polyimide precursor including a repeating unit including a biphenyl structure and a photopolymerization initiator having an oxime structure capable of generating an aryl radical by being irradiated with light.

公开(公告)号：US10501580B2

公开(公告)日：2019-12-10

申请号：US15824360

申请日：2017-11-28

申请人： FUJIFILM Corporation

发明人： Takeshi Kawabata ,  Takuma Amemiya ,  Hidekazu Oohashi ,  Yu Iwai ,  Akinori Shibuya

IPC分类号： C08G73/10 ,  G03F7/021 ,  G03F7/023 ,  G03F7/038 ,  H01L23/29 ,  H01L23/31 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  C08F290/14 ,  G03F7/031 ,  G03F7/037 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  H01L23/00

摘要： A photosensitive resin composition using a polyimide precursor composition, a cured film, a method for producing a cured film, a semiconductor device, and a method for producing a polyimide precursor composition are provided. In the polyimide precursor composition, the molar ratio of repeating units represented by General Formula (1-2) among structural isomers of the polyimide precursor is 60% to 90% by mole. In General Formula (1-2), A1 and A2 each independently represents an oxygen atom or NH, R111 and R112 each independently represents a single bond or a divalent organic group, and R113 and R114 each independently represents a hydrogen atom or a monovalent organic group.