公开(公告)号：US09000881B2

公开(公告)日：2015-04-07

申请号：US13901068

申请日：2013-05-23

申请人： Fu Hua Chu ,  David Shau Chew Wang ,  Chun Teng Tseng ,  Yi An Sha

发明人： Fu Hua Chu ,  David Shau Chew Wang ,  Chun Teng Tseng ,  Yi An Sha

IPC分类号： H01C7/10 ,  H01C7/13 ,  H02H3/08 ,  H01C7/12 ,  H02H9/04

CPC分类号： H02H3/08 ,  H01C1/1406 ,  H01C7/02 ,  H01C7/021 ,  H01C7/12 ,  H02H9/044

摘要： A surface-mountable over-current protection device comprises a PTC material layer, first and second conductive layers, first and second electrodes, first and second electrically conductive connecting members. The PTC material layer has a resistivity less than 0.18 Ω-cm. The conductive layers are in contact with opposite surfaces of the PTC material layer. The first electrode comprises pair of first metal foils and is insulated from the second conductive layer. The second electrode comprises a pair of second metal foils and is insulated from the first conductive layer. The first electrically conductive connecting member connects to the first metal foils and conductive layer. The second electrically conductive connecting member connects to the second metal foils and conductive layer. The first electrically conductive connecting member comprises 40%-100% by area of the first lateral surface, and the second electrically conductive connecting member comprises 40%-100% by area of the second lateral surface.

摘要翻译： 表面安装式过流保护装置包括PTC材料层，第一和第二导电层，第一和第二电极，第一和第二导电连接构件。 PTC材料层的电阻率小于0.18＆OHgr; -cm。 导电层与PTC材料层的相对表面接触。 第一电极包括一对第一金属箔并且与第二导电层绝缘。 第二电极包括一对第二金属箔，并与第一导电层绝缘。 第一导电连接构件连接到第一金属箔和导电层。 第二导电连接构件连接到第二金属箔和导电层。 第一导电连接构件包括第一侧面的40％-100％的面积，第二导电连接构件包括第二侧面的40％-100％的面积。

公开(公告)号：US20120182118A1

公开(公告)日：2012-07-19

申请号：US13351700

申请日：2012-01-17

申请人： Tong Cheng Tsai ,  Yi An Sha ,  David Shau Chew Wang ,  Fu Hua Chu

发明人： Tong Cheng Tsai ,  Yi An Sha ,  David Shau Chew Wang ,  Fu Hua Chu

IPC分类号： H01C7/13 ,  H05B6/00 ,  C04B35/553

CPC分类号： H01C7/13 ,  Y10T29/49082 ,  Y10T29/49085

摘要： An over-current protection device includes a conductive composite having a first crystalline fluorinated polymer, a plurality of particulates, a conductive filler, and a non-conductive filler, wherein the plurality of particulates include a second crystalline fluorinated polymer. The first crystalline fluorinated polymer has a crystalline melting temperature of between 150 and 190 degrees Celsius. The plurality of particulates including the second crystalline fluorinated polymer are disposed in the conductive composite, having a crystalline melting temperature of between 320 and 390 degrees Celsius and having a particulate diameter of from 1 to 50 micrometers. The conductive filler and the non-conductive filler are dispersed in the conductive composite.

摘要翻译： 一种过电流保护装置包括具有第一结晶氟化聚合物，多个微粒，导电填料和非导电填料的导电复合材料，其中所述多个微粒包括第二结晶氟化聚合物。 第一结晶氟化聚合物的结晶熔融温度在150至190摄氏度之间。 包括第二结晶氟化聚合物的多个微粒设置在导电复合材料中，其结晶熔融温度为320-390℃，其粒径为1至50微米。 导电填料和非导电填料分散在导电复合材料中。

公开(公告)号：US08421584B2

公开(公告)日：2013-04-16

申请号：US13351700

申请日：2012-01-17

申请人： Tong Cheng Tsai ,  Yi An Sha ,  David Shau Chew Wang ,  Fu Hua Chu

发明人： Tong Cheng Tsai ,  Yi An Sha ,  David Shau Chew Wang ,  Fu Hua Chu

IPC分类号： H01C7/10

CPC分类号： H01C7/13 ,  Y10T29/49082 ,  Y10T29/49085

摘要： An over-current protection device includes a conductive composite having a first crystalline fluorinated polymer, a plurality of particulates, a conductive filler, and a non-conductive filler, wherein the plurality of particulates include a second crystalline fluorinated polymer. The first crystalline fluorinated polymer has a crystalline melting temperature of between 150 and 190 degrees Celsius. The plurality of particulates including the second crystalline fluorinated polymer are disposed in the conductive composite, having a crystalline melting temperature of between 320 and 390 degrees Celsius and having a particulate diameter of from 1 to 50 micrometers. The conductive filler and the non-conductive filler are dispersed in the conductive composite.

摘要翻译： 一种过电流保护装置包括具有第一结晶氟化聚合物，多个微粒，导电填料和非导电填料的导电复合材料，其中所述多个微粒包括第二结晶氟化聚合物。 第一结晶氟化聚合物的结晶熔融温度在150至190摄氏度之间。 包括第二结晶氟化聚合物的多个微粒设置在导电复合材料中，其结晶熔融温度为320-390℃，其粒径为1至50微米。 导电填料和非导电填料分散在导电复合材料中。

公开(公告)号：US08687336B2

公开(公告)日：2014-04-01

申请号：US13345129

申请日：2012-01-06

申请人： David Shau Chew Wang ,  Fu Hua Chu ,  Chun Teng Tseng

发明人： David Shau Chew Wang ,  Fu Hua Chu ,  Chun Teng Tseng

IPC分类号： H02H5/04

CPC分类号： H01C7/02

摘要： An over-current protection device is disposed on a circuit board and configured to protect a battery. The over-current protection device includes a resistive device, at least one insulation layer and a weld electrode layer. The resistive device exhibits positive temperature coefficient behavior. The insulation layer has a thickness of at least 0.03 mm. The weld electrode layer is configured to weld a strip interconnect member to electrically coupled to the battery, and has a thickness of at least 0.03 mm. The insulation layer and the resistive device are disposed between the weld electrode layer and the circuit board. The circuit board, the resistive device and the weld electrode layer are electrically coupled in series. The association of the resistive device and the weld electrode layer has a thermal mass capable of withstanding welding the strip interconnect member without significant damage to the over-current protection device.

摘要翻译： 过电流保护装置设置在电路板上并被配置为保护电池。 过电流保护器件包括电阻器件，至少一个绝缘层和焊接电极层。 电阻器件具有正温度系数特性。 绝缘层的厚度至少为0.03mm。 焊接电极层被配置为焊接条状互连构件以电耦合到电池，并且具有至少0.03mm的厚度。 绝缘层和电阻装置设置在焊接电极层和电路板之间。 电路板，电阻器件和焊接电极层电耦合在一起。 电阻器件和焊接电极层的关联具有能够耐受焊接条状互连部件而不对过电流保护器件造成显着损害的热质量。

公开(公告)号：US08003216B2

公开(公告)日：2011-08-23

申请号：US11699710

申请日：2007-01-30

申请人： David Shau Chew Wang ,  En Tien Yang ,  Jyh Ming Yu ,  Fu Hua Chu

发明人： David Shau Chew Wang ,  En Tien Yang ,  Jyh Ming Yu ,  Fu Hua Chu

IPC分类号： B32B15/092 ,  B32B27/20 ,  B32B27/38 ,  C08K3/14 ,  C08K3/20 ,  C08K3/22 ,  C08K3/28 ,  C08K3/34 ,  C08K3/38 ,  C08L63/00

CPC分类号： H05K1/0373 ,  H01B3/006 ,  H01B3/40 ,  H05K1/189 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/09309 ,  H05K2201/10106 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529

摘要： A heat-conductive dielectric polymer material having an inter-penetrating-network (IPN) structure includes a polymer component, a curing agent, and a heat-conductive filler uniformly dispersed in the polymer component. The polymer component includes a thermoplastic plastic and a thermosetting epoxy resin. The curing agent is used to cure the thermosetting epoxy resin at a curing temperature. The heat conductivity of the heat-conductive dielectric polymer material is larger than 0.5 W/mK. A heat dissipation substrate including the heat-conductive dielectric polymer material in the present invention has a thickness of less than 0.5 mm and bears a voltage of over 1000 volts.

摘要翻译： 具有穿透网络（IPN）结构的导热介电聚合物材料包括均匀分散在聚合物组分中的聚合物组分，固化剂和导热填料。 聚合物组分包括热塑性塑料和热固性环氧树脂。 固化剂用于在固化温度下固化热固性环氧树脂。 导热介电聚合物材料的导热率大于0.5W / mK。 包含本发明的导热介电聚合物材料的散热基板的厚度小于0.5mm，并具有超过1000伏特的电压。

公开(公告)号：US20080057333A1

公开(公告)日：2008-03-06

申请号：US11803039

申请日：2007-05-11

申请人： Fu Hua Chu ,  David Shau Chew Wang ,  Jyh Ming Yu ,  En Tien Yang ,  Kuo Hsun Chen

发明人： Fu Hua Chu ,  David Shau Chew Wang ,  Jyh Ming Yu ,  En Tien Yang ,  Kuo Hsun Chen

IPC分类号： B21D39/00

CPC分类号： H05K1/0373 ,  H05K1/034 ,  H05K1/0393 ,  H05K3/384 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/09309 ,  H05K2201/10106 ,  H05K2203/0307 ,  Y10T428/12472

摘要： A heat dissipation substrate for an electronic device comprises a first metal layer, a second metal layer, and a thermally conductive polymer dielectric insulating layer. A surface of the first metal layer carries the electronic device, e.g., a light-emitting diode (LED) device. The thermally conductive polymer dielectric insulating layer is stacked between the first metal layer and the second metal layer in a physical contact manner, and interfaces therebetween include at least one micro-rough surface with a roughness Rz larger than 7.0. The micro-rough surface includes a plurality of nodular projections, and the grain sizes of the nodular projections mainly are in a range of 0.1-100 μm. The heat dissipation substrate has a thermal conductivity larger than 1.0 W/m·K, and a thickness smaller than 0.5 mm, and comprises (1) a fluorine-containing polymer with a melting point higher than 150° C. and a volume percentage in a range of 30-60%, and (2) thermally conductive filler dispersed in the fluorine-containing polymer and having a volume percentage in a range of 40-70%.

摘要翻译： 电子器件的散热基板包括第一金属层，第二金属层和导热聚合物介电绝缘层。 第一金属层的表面承载电子装置，例如发光二极管（LED）装置。 导热性聚合物介电绝缘层以物理接触的方式堆叠在第一金属层和第二金属层之间，并且其间的界面包括至少一个粗糙度Rz大于7.0的微粗糙表面。 微粗糙表面包括多个结节状突起，并且结节状突起的粒径主要在0.1〜100μm的范围内。 散热基板的热导率大于1.0W / mK，厚度小于0.5mm，其特征在于，包含：（1）熔点高于150℃的含氟聚合物， 为30〜60％，（2）分散在含氟聚合物中的导热性填料，体积百分比为40〜70％。

公开(公告)号：US20080073623A1

公开(公告)日：2008-03-27

申请号：US11699710

申请日：2007-01-30

申请人： David Shau Chew Wang ,  En Tien Yang ,  Jyh Ming Yu ,  Fu Hua Chu

发明人： David Shau Chew Wang ,  En Tien Yang ,  Jyh Ming Yu ,  Fu Hua Chu

IPC分类号： H01B3/48

CPC分类号： H05K1/0373 ,  H01B3/006 ,  H01B3/40 ,  H05K1/189 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/09309 ,  H05K2201/10106 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529

摘要： A heat-conductive dielectric polymer material having an inter-penetrating-network (IPN) structure includes a polymer component, a curing agent, and a heat-conductive filler uniformly dispersed in the polymer component. The polymer component includes a thermoplastic plastic and a thermosetting epoxy resin. The curing agent is used to cure the thermosetting epoxy resin at a curing temperature. The heat conductivity of the heat-conductive dielectric polymer material is larger than 0.5 W/mK. A heat dissipation substrate including the heat-conductive dielectric polymer material in the present invention has a thickness of less than 0.5 mm and bears a voltage of over 1000 volts.

摘要翻译： 具有穿透网络（IPN）结构的导热介电聚合物材料包括均匀分散在聚合物组分中的聚合物组分，固化剂和导热填料。 聚合物组分包括热塑性塑料和热固性环氧树脂。 固化剂用于在固化温度下固化热固性环氧树脂。 导热介电聚合物材料的导热率大于0.5W / mK。 包含本发明的导热介电聚合物材料的散热基板的厚度小于0.5mm，并具有超过1000伏特的电压。

公开(公告)号：US09147509B2

公开(公告)日：2015-09-29

申请号：US14281038

申请日：2014-05-19

申请人： Fu Hua Chu ,  Yi An Sha ,  En Tien Yang ,  Tong Cheng Tsai

发明人： Fu Hua Chu ,  Yi An Sha ,  En Tien Yang ,  Tong Cheng Tsai

IPC分类号： H01C7/02 ,  H01C1/14 ,  H01C1/144 ,  H01C17/065 ,  H01C1/028

CPC分类号： H01C1/1406 ,  H01C1/028 ,  H01C1/144 ,  H01C7/027 ,  H01C17/0652 ,  H01C17/06566

摘要： A radial-leaded over-current protection device includes a PTC device, first and second electrode leads and an insulating encapsulation layer. The PTC device has first and a second conductive layers and a PTC material layer therebetween. The PTC material layer has a resistivity less than 0.18 Ω-cm and includes crystalline polymer and conductive ceramic filler. The ceramic filler has a resistivity less than 500 Ω-cm and is 35-65% by volume of the PTC material layer. The first electrode lead has an end connecting to the first conductive layer, whereas the second electrode lead has an end connecting to the second conductive layer. The insulating encapsulation layer wraps the PTC device and the ends of the conductive layers. The radial-leaded over-current protection device at 25° C. has a value of hold current thereof divided by an area of the PTC device ranging from 0.027-0.3A/mm2. Each electrode lead has a cross-sectional area of at least 0.16 mm2.

摘要翻译： 径向引线的过电流保护装置包括PTC器件，第一和第二电极引线以及绝缘封装层。 PTC器件具有第一和第二导电层和PTC材料层之间。 PTC材料层的电阻率小于0.18＆OHgr·-cm，并且包括结晶聚合物和导电陶瓷填料。 陶瓷填料的电阻率小于500Ω-OHgr·-cm，是PTC材料层的35-65％（体积）。 第一电极引线具有连接到第一导电层的端部，而第二电极引线具有连接到第二导电层的端部。 绝缘封装层包裹PTC器件和导电层的端部。 在25℃的径向引线的过电流保护器件，其保持电流值除以PTC器件的面积为0.027-0.3A / mm2。 每个电极引线的横截面积至少为0.16mm 2。

公开(公告)号：US08169294B2

公开(公告)日：2012-05-01

申请号：US12662667

申请日：2010-04-28

申请人： Yi An Sha ,  Kuo Chang Lo ,  Fu Hua Chu

发明人： Yi An Sha ,  Kuo Chang Lo ,  Fu Hua Chu

IPC分类号： H01C7/10

CPC分类号： H01C7/027 ,  H01C17/06553 ,  H01C17/06586

摘要： An over-current protection device comprises two metal foils and a positive temperature coefficient (PTC) material layer. The PTC material layer is sandwiched between the two metal foils and has a volume resistivity below 0.1 Ω-cm. The PTC material layer includes (i) plural crystalline polymers having at least one crystalline polymer of a melting point less than 115° C.; (ii) an electrically conductive nickel filler having a volume resistivity less than 500 μΩ-cm; and (iii) a non-conductive metal nitride filler. The electrically conductive nickel filler and non-conductive metal nitride filler are dispersed in the crystalline polymer.

摘要翻译： 过电流保护装置包括两个金属箔和正温度系数（PTC）材料层。 PTC材料层夹在两个金属箔之间，体积电阻率低于0.1＆OHgr; -cm。 PTC材料层包括（i）具有至少一种熔点低于115℃的结晶聚合物的多种结晶聚合物; （ii）体积电阻率小于500μΩ-OHgr的导电镍填料; 和（iii）非导电金属氮化物填料。 导电镍填料和非导电金属氮化物填料分散在结晶聚合物中。

公开(公告)号：US20110156859A1

公开(公告)日：2011-06-30

申请号：US12662667

申请日：2010-04-28

申请人： Yi An Sha ,  Kuo Chang Lo ,  Fu Hua Chu

发明人： Yi An Sha ,  Kuo Chang Lo ,  Fu Hua Chu

IPC分类号： H01C7/02 ,  H01C7/13

CPC分类号： H01C7/027 ,  H01C17/06553 ,  H01C17/06586

摘要： An over-current protection device comprises two metal foils and a positive temperature coefficient (PTC) material layer. The PTC material layer is sandwiched between the two metal foils and has a volume resistivity below 0.1 Ω-cm. The PTC material layer includes (i) plural crystalline polymers having at least one crystalline polymer of a melting point less than 115° C.; (ii) an electrically conductive nickel filler having a volume resistivity less than 500 μΩ-cm; and (iii) a non-conductive metal nitride filler. The electrically conductive nickel filler and non-conductive metal nitride filler are dispersed in the crystalline polymer.

摘要翻译： 过电流保护装置包括两个金属箔和正温度系数（PTC）材料层。 PTC材料层夹在两个金属箔之间，体积电阻率低于0.1＆OHgr; -cm。 PTC材料层包括（i）具有至少一种熔点低于115℃的结晶聚合物的多种结晶聚合物; （ii）体积电阻率小于500μΩ-OHgr的导电镍填料; 和（iii）非导电金属氮化物填料。 导电镍填料和非导电金属氮化物填料分散在结晶聚合物中。