公开(公告)号：US20070158815A1

公开(公告)日：2007-07-12

申请号：US10552046

申请日：2004-04-02

申请人： Fung Chen ,  Seong Kwang Kim ,  Wee Cha ,  Yi-Sheng Sun ,  Wolfgang Hetzel ,  Jochen Thomas

发明人： Fung Chen ,  Seong Kwang Kim ,  Wee Cha ,  Yi-Sheng Sun ,  Wolfgang Hetzel ,  Jochen Thomas

IPC分类号： H01L23/48

CPC分类号： H01L23/13 ,  H01L23/3121 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L25/105 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/85 ,  H01L2224/92147 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1094 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A BGA package is disclosed including a base IC structure having a base substrate, with an opening running length-wise there through. A first semiconductor chip is mounted face-down on the base substrate so the bond pads thereof are accessible through the opening. The package also includes a secondary IC structure including a secondary substrate, having an opening running there through, and a second semiconductor chip. The second chip is mounted face-down on the secondary substrate so that the bond pads thereof are accessible through the opening in the secondary substrate. An encapsulant fills the opening in the secondary substrate and forms a substantially planar surface over the underside of the secondary substrate. The substantially planar surface is mounted to the first chip of the base IC structure through an adhesive. Wires connect a conductive portion of the secondary IC structure to a conductive portion of the base IC structure.

摘要翻译： 公开了一种BGA封装，其包括具有基底基板的基底IC结构，其开口沿着贯穿的方向延伸。 第一半导体芯片正面朝下地安装在基底基板上，使得其接合焊盘可通过开口接近。 该封装还包括一个次级IC结构，该二级IC结构包括一个具有在其上延伸的开口的次级衬底和一个第二半导体芯片。 第二芯片正面朝下安装在二次基板上，使得其接合焊盘可通过次级基板中的开口接近。 密封剂填充次级基底中的开口并且在次级基底的下侧上形成基本平坦的表面。 基本平坦的表面通过粘合剂安装到基底IC结构的第一芯片上。 导线将次级IC结构的导电部分连接到基极IC结构的导电部分。

公开(公告)号：US20060026737A1

公开(公告)日：2006-02-09

申请号：US10916381

申请日：2004-08-07

申请人： Fung Chen

发明人： Fung Chen

IPC分类号： A41D19/00

CPC分类号： A41D19/0058 ,  A41D31/30 ,  A61B42/00 ,  A61B42/10 ,  A61B42/30

摘要： A type of multilayered glove consisting of an inner layer, an outer layer, and pigments between the layers is disclosed. The layers can be made of the same or different materials to incorporate desired barrier properties such as oil or chemical resistance to a glove. The layers can also be made of the same or different colors. The glove can have the same physical barrier protection as wearing two gloves, but without the discomfort of wearing two gloves. The glove enhances barrier protection and allows users to detect any breach of the outer layer during the surgical procedure, which enables the user to execute corrective actions before cross contamination occurs.

摘要翻译： 公开了一种由内层，外层和层之间的颜料组成的多层手套。 这些层可以由相同或不同的材料制成，以将期望的阻挡性能如油或化学抗性纳入到手套中。 这些层也可以由相同或不同的颜色制成。 手套可以具有与戴两只手套相同的物理屏障保护，但没有佩戴两只手套的不适。 手套增强了屏障保护，并允许用户在手术过程中检测到外层的任何破损，这使得用户能够在交叉污染发生之前执行校正动作。

公开(公告)号：US6139994A

公开(公告)日：2000-10-31

申请号：US344251

申请日：1999-06-25

申请人： Doug Van Den Broeke ,  Fung Chen

发明人： Doug Van Den Broeke ,  Fung Chen

IPC分类号： G03F1/00 ,  G03F7/20 ,  G03F9/00

CPC分类号： G03F7/70433 ,  G03F1/50

摘要： A method for creating an image on an image plane utilizing a photomask comprised of a plurality of intersecting subresolution features. Energy created by an energy source is projected through the subresolution features which diffract the light to produce constructive or positive interference thereby resulting in an image being formed on the image plane that is different than the image or pattern of subresolution features on the photomask.

摘要翻译： 一种利用由多个相交的子分解特征组成的光掩模在图像平面上创建图像的方法。 由能量产生的能量通过衍射光的子分解特征投影，从而产生建构性或正面的干涉，从而导致图像平面上形成的图像不同于光掩模上的分解特征的图像或图案。