公开(公告)号：US20180288880A1

公开(公告)日：2018-10-04

申请号：US16001416

申请日：2018-06-06

Applicant: Futurewei Technologies, Inc.

Inventor： Fei Yu ,  Anwar A. Mohammed ,  Rui Niu

IPC: H05K1/18 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56 ,  H05K1/03 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K1/186 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/036 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/09118 ,  Y10T29/49124 ,  H01L2924/00

Abstract: A structure for a core layer of a substrate and a method for fabricating a core layer of a substrate are disclosed. The core layer comprises a molding compound encapsulating a die or a plurality of dies, a dielectric layer on the surfaces of the molding compound, and a conductive layer on top of the dielectric layer. A through hole is formed through the dielectric layer and the molding compound, which may be filled with a metal plate. A laser via is formed similarly. Build-up layers may be assembled next to the core layer to form the substrate, which can be used to package dies.

公开(公告)号：US10212818B2

公开(公告)日：2019-02-19

申请号：US16001416

申请日：2018-06-06

Applicant: Futurewei Technologies, Inc.

Inventor： Fei Yu ,  Anwar A. Mohammed ,  Rui Niu

IPC: H05K1/03 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L21/56 ,  H01L23/31

Abstract: A structure for a core layer of a substrate and a method for fabricating a core layer of a substrate are disclosed. The core layer comprises a molding compound encapsulating a die or a plurality of dies, a dielectric layer on the surfaces of the molding compound, and a conductive layer on top of the dielectric layer. A through hole is formed through the dielectric layer and the molding compound, which may be filled with a metal plate. A laser via is formed similarly. Build-up layers may be assembled next to the core layer to form the substrate, which can be used to package dies.

公开(公告)号：US20140027157A1

公开(公告)日：2014-01-30

申请号：US13907344

申请日：2013-05-31

Applicant: FutureWei Technologies, Inc.

Inventor： Fei Yu ,  Hang Yan ,  Feng Gao

IPC: H05K1/11

CPC classification number: H05K1/11 ,  H05K1/0245 ,  H05K3/103 ,  H05K3/4644 ,  H05K2201/10356

Abstract: A printed circuit board (PCB) includes a first dielectric layer and a differential cable structure embedded in the dielectric layer. The differential cable structure includes a first inner conductor, a second inner conductor, a dielectric surrounding portions of the first inner conductor and portions of the second inner conductor, and a ground shield surrounding the dielectric.

Abstract translation: 印刷电路板（PCB）包括嵌入电介质层中的第一电介质层和差分电缆结构。 差分电缆结构包括第一内部导体，第二内部导体，围绕第一内部导体的部分和第二内部导体的部分的电介质以及围绕电介质的接地屏蔽。

公开(公告)号：US09112091B2

公开(公告)日：2015-08-18

申请号：US13646486

申请日：2012-10-05

Applicant: FutureWei Technologies, Inc.

Inventor： Anwar A. Mohammed ,  Fei Yu ,  Qi Deng

IPC: H01L31/12

CPC classification number: H01L31/12 ,  Y10T29/49139

Abstract: An apparatus and method are disclosed for providing monolithic optical packages. An embodiment optical package includes a base made of aluminum-nitride (AlN) that is configured to support an optical component, a plurality of sidewalls made of AlN that are coupled to the base, the sidewalls are configured to surround the optical component, and a feed-through made of AlN that is coupled to one of the sidewalls, wherein the feed-through is configured to feed a plurality of leads through the one sidewall to provide an electrical connection to the optical component, wherein the base, the sidewalls, and the feed-through have a same coefficient of thermal expansion (CTE) for AlN. An embodiment method includes punching and printing AlN tapes to build a base, a plurality of sidewalls joined to the base, and a feed-through coupled to the sidewalls, and attaching a plurality of electrical leads into the feed-through.

Abstract translation: 公开了一种用于提供单片光学封装的装置和方法。 一种实施方式的光学封装包括由氮化铝（AlN）构成的基座，其被配置为支撑光学部件，由AlN制成的多个侧壁，所述多个侧壁与所述基座耦合，所述侧壁被配置为围绕所述光学部件，并且 馈通由耦合到所述侧壁中的一个的AlN制成，其中所述馈通被配置为将多个引线通过所述一个侧壁以提供到所述光学部件的电连接，其中所述基部，所述侧壁和 馈通对于AlN具有相同的热膨胀系数（CTE）。 一种实施方式包括冲压和印刷AlN带以构成基底，连接到基底的多个侧壁和连接到侧壁的馈通，以及将多个电引线附接到馈通中。