公开(公告)号：US09640985B2

公开(公告)日：2017-05-02

申请号：US14614473

申请日：2015-02-05

申请人： GE Energy Power Conversion Technology Ltd

发明人： Fei Xu ,  Wenqiang Yang

IPC分类号： H02H9/00 ,  H02H9/02 ,  H02H3/02

CPC分类号： H02H9/023 ,  H01H9/548 ,  H01H33/596 ,  H01H2009/543 ,  H02H3/025 ,  H02H3/087 ,  H02H7/001 ,  H02H7/222 ,  Y02E40/68

摘要： A circuit breaker comprising a superconducting fault current limiter and a circuit breaker module, wherein the superconducting fault current limiter and the circuit breaker module are connected in series. The circuit breaker module includes a disconnector, a first semiconductor switch unit, and a second semiconductor switch unit, wherein the disconnector is connected in series with the first semiconductor switch unit, and also connected in series with the superconducting fault current limiter, and the second semiconductor switch unit is connected in parallel with the disconnector and first semiconductor switch unit that are connected in series. The circuit breaker can quickly and securely interrupt a circuit when an overcurrent fault occurs on the circuit.

公开(公告)号：US09484275B2

公开(公告)日：2016-11-01

申请号：US14811394

申请日：2015-07-28

申请人： GE Energy Power Conversion Technology Ltd

发明人： Fei Xu ,  Pengcheng Zhu ,  Yingqi Zhang

IPC分类号： H01L23/051 ,  H01L23/22 ,  H01L23/42 ,  H01L23/473 ,  H01L25/065 ,  H01L23/492 ,  H01L23/00 ,  H01L23/12 ,  H01L25/10 ,  H01L23/10 ,  H01L25/07 ,  H01L25/11

CPC分类号： H01L23/051 ,  H01L23/10 ,  H01L23/12 ,  H01L23/22 ,  H01L23/42 ,  H01L23/473 ,  H01L23/492 ,  H01L24/33 ,  H01L24/72 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/105 ,  H01L25/11 ,  H01L25/112 ,  H01L25/115 ,  H01L25/117 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2225/1047 ,  H01L2225/1076 ,  H01L2225/1094 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00

摘要： A semiconductor module comprising a plurality of electrically conductive top plates, an electrically conductive base plate, a plurality of semiconductor chips installed on the base plate, a first power supply connected to the plates, a second power supply connected to the plates and an electrically insulating outer casing component. The semiconductor chips are individually in contact with the top plates. Each semiconductor chip comprises a first electrode electrically coupled with the base plate, and a second electrical pole electrically coupled with the corresponding top plate. The first power supply connecting plate is equipped with protruding parts that are individually in electrical contact with the top plates. The second power supply connecting plate is electrically connected to the base plate. The outer casing component is used to integrate the first power supply connecting plate and the second power supply connecting plate. The outer casing component comprises at least one opening.

摘要翻译： 一种半导体模块，包括多个导电顶板，导电基板，安装在基板上的多个半导体芯片，连接到所述板的第一电源，连接到所述板的第二电源和电绝缘的 外壳组件。 半导体芯片分别与顶板接触。 每个半导体芯片包括与基板电耦合的第一电极和与相应的顶板电耦合的第二电极。 第一电源连接板配备有与顶板电接触的突出部分。 第二电源连接板电连接到基板。 外壳部件用于集成第一电源连接板和第二电源连接板。 外壳部件包括至少一个开口。