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公开(公告)号：US20150287893A1
公开(公告)日：2015-10-08
申请号：US14676821
申请日：2015-04-02
Applicant: Genesis Photonics Inc.
Inventor： Kuan-Chieh Huang , Chun-Ming Tseng , Wen-Jie Lu , Tsung-Tse Wu , Wei-Ling Su , Kuan-Yung Liao , Gwo-Jiun Sheu
CPC classification number: H01L33/507 , H01L33/54 , H01L2933/0091
Abstract: A package material for packaging a photoelectric device includes a first molding portion and a second molding portion. The first molding portion is disposed on the photoelectric device. The first molding portion includes a first molding compound and a plurality of nano-scale metal oxide particles, wherein the nano-scale metal oxide particles are doped in the first molding compound. The second molding portion is disposed on the first molding portion and away from the photoelectric device. The second molding portion includes a second molding compound and a plurality of submicron-scale metal oxide particles, wherein the submicron-scale metal oxide particles are doped in the second molding compound. A whole refractive index of the first molding portion is larger than a whole refractive index of the second molding portion.
Abstract translation: 用于封装光电装置的封装材料包括第一模制部分和第二模塑部分。 第一模制部分设置在光电装置上。 第一成型部分包括第一模塑料和多种纳米级金属氧化物颗粒，其中纳米级金属氧化物颗粒掺杂在第一模塑料中。 第二模制部分设置在第一模制部分上并远离光电装置。 第二成型部分包括第二模塑料和多个亚微米级金属氧化物颗粒，其中亚微米级金属氧化物颗粒掺杂在第二模塑料中。 第一成型部分的整体折射率大于第二成型部分的整体折射率。
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公开(公告)号：US20160067728A1
公开(公告)日：2016-03-10
申请号：US14944238
申请日：2015-11-18
Applicant: Genesis Photonics Inc.
Inventor： Tai-Cheng Tsai , Gwo-Jiun Sheu , Chin-Hua Hung , Po-Jen Su
CPC classification number: B05B12/084 , B05B12/008 , B05B12/12 , B05B15/555 , B05D1/02
Abstract: A method of forming a layer of glue on a work piece includes: spraying the glue on the work piece; obtaining specification data of the glue by measuring a weight of the glue being sprayed on the work piece; and adjusting the spraying amount of the glue in real time according to the specification data of the glue.
Abstract translation: 在工件上形成胶水层的方法包括：将胶水喷涂在工件上; 通过测量喷涂在工件上的胶水的重量来获得胶水的规格数据; 并根据胶水的规格数据实时调整胶水喷涂量。
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Patent Agency Ranking
公开(公告)号：US09229065B2
公开(公告)日：2016-01-05
申请号：US13836181
申请日：2013-03-15
Applicant: GENESIS PHOTONICS INC
Inventor： Tai-Wei Wu , Tai-Cheng Tsai , Hsin-Hung Lin , Ping-Tsung Tsai , Pei-Yi Huang , Gwo-Jiun Sheu , Shou-Wen Hsu , Yun-Li Li
CPC classification number: G01R31/44 , G01J2001/4252 , G01R31/2635
Abstract: A detection apparatus for light-emitting diode chip comprising a substrate with the function of photoelectric conversion and a probing device is disclosed. The substrate is designed to bear at least one light-emitting diode chip. The probing device comprises a power supply and at least two conductive elements. The two ends of the conductive elements are respectively electrically connected to the light-emitting diode chip and the power supply to enable the light-emitting diode chip to emit light beams. Some of the light beams are emitted from the light-emitting diode chip toward the substrate such that the light beams emitted by the light-emitting diode chip are converted into an electric signal by the substrate.
Abstract translation: 公开了一种包括具有光电转换功能的基板和探测装置的发光二极管芯片的检测装置。 基板被设计成承载至少一个发光二极管芯片。 探测装置包括电源和至少两个导电元件。 导电元件的两端分别电连接到发光二极管芯片和电源，以使得发光二极管芯片能够发射光束。 一些光束从发光二极管芯片朝向基板发射，使得由发光二极管芯片发射的光束被基板转换成电信号。
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公开(公告)号：US08767198B2
公开(公告)日：2014-07-01
申请号：US13838824
申请日：2013-03-15
Applicant: Genesis Photonics Inc
Inventor： Tai-Cheng Tsai , Tai-Wei Wu , Gwo-Jiun Sheu , Shou-Wen Hsu , Yun-Li Li
CPC classification number: G01J1/42 , G01J1/04 , G01J1/0407 , G01J1/0411 , G01J1/0422 , G01J1/0425 , G01J1/4257 , G01J2001/4247 , G01R31/2635 , G02B19/0066 , G02B19/0076
Abstract: A detection apparatus comprising a chuck, a probe device, a light-sensing device and a light-concentrating unit is disclosed. The chuck bears light-emitting diode chips. The probe device includes two probes and a power supply. The end point of the probes respectively electrically connects with one of the light-emitting diode chips and the power supply to make the light-emitting diode chip emits a plurality of light beams. The light-sensing device is disposed on one side of a light-emitting surface of the light-emitting diode chip so as to receive the light beams emitted by the light-emitting diode chip. The light-concentrating unit is disposed between the light-emitting diode chip and the light-sensing device to concentrate the light beams emitted by the light-emitting diode chip.
Abstract translation: 公开了一种包括卡盘，探针装置，感光装置和聚光装置的检测装置。 卡盘带有发光二极管芯片。 探头装置包括两个探针和一个电源。 探针的终点分别与发光二极管芯片和电源中的一个电连接，以使发光二极管芯片发射多个光束。 光感测装置设置在发光二极管芯片的发光面的一侧，以便接收由发光二极管芯片发射的光束。 光集中单元设置在发光二极管芯片和感光装置之间，以集中由发光二极管芯片发射的光束。
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公开(公告)号：US20150036128A1
公开(公告)日：2015-02-05
申请号：US14311362
申请日：2014-06-23
Applicant: Genesis Photonics Inc.
Inventor： Cheng-Pin Chen , Gwo-Jiun Sheu , Yun-Li Li
CPC classification number: G01N21/6489 , G01N21/8806 , G01N21/95 , G01N21/9501 , G01N2021/646 , G01N2021/8819
Abstract: An inspection apparatus is capable of inspecting a light-emitting diode (LED). The inspection apparatus includes a reflecting cover, a base plate, a light-collecting unit and at least one inspection light source. An enclosed space is defined by the base plate and the reflecting cover having an opening. The LED is disposed on the base plate and located in the enclosed space. The light-collecting unit is disposed above the LED and in the enclosed space. A vertical distance from the light-collecting unit to the LED is H, a width of the opening of the reflecting cover is W, and H/W=0.05 to 10. The inspection light source is in the enclosed space. An inspection light emitted from the inspection light source is reflected by the reflecting cover and then emitted into the LED.A dominant wavelength of the inspection light source is smaller than that of the LED.
Abstract translation: 检查装置能够检查发光二极管（LED）。 检查装置包括反射盖，基板，聚光单元和至少一个检查光源。 封闭空间由基板和具有开口的反射盖限定。 LED设置在基板上并位于封闭空间中。 集光单元设置在LED的上方和封闭空间中。 从集光单元到LED的垂直距离为H，反射盖的开口宽度为W，H / W = 0.05〜10。检查光源位于封闭空间内。 从检查光源发出的检查光被反射罩反射，然后发射到LED中。 检测光源的主波长小于LED的主波长。
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6.发明授权公开(公告)号：US09274164B2
公开(公告)日：2016-03-01
申请号：US13836762
申请日：2013-03-15
Applicant: GENESIS PHOTONICS INC
Inventor： Tai-Wei Wu , Tai-Cheng Tsai , Gwo-Jiun Sheu , Shou-Wen Hsu , Yun-Li Li
CPC classification number: G01R31/2635 , G01J1/0411 , G01J2001/4247 , G01R1/04 , G01R1/073 , G01R31/44 , G02B3/00 , H01L33/00
Abstract: A detection apparatus for light-emitting diode chips comprises a transparent chuck with the light-concentration capability, a probing device and a light-sensing device. The transparent chuck comprises a light-incident plane and a light-emitting plane. The light-incident plane is used to bear a plurality of light-emitting diode chips under detection. The probing device comprises two probe pins and a power supply. The two ends of each probe pin is electrically connected to one of the light-emitting diode chips and the power supply, respectively, to make the light-emitting diode chip emit a plurality of light beams. The light beams penetrate through the transparent chuck by emitting into the incident plane of the transparent chuck. The light-sensing device is disposed on one side of the light-emitting plane of the transparent chuck to receive the light beams which penetrate through the transparent chuck.
Abstract translation: 用于发光二极管芯片的检测装置包括具有光集中能力的透明卡盘，探测装置和光感测装置。 透明卡盘包括光入射面和发光面。 光入射面用于承受检测下的多个发光二极管芯片。 探测装置包括两个探针和电源。 每个探针的两端分别电连接到发光二极管芯片和电源之一，以使发光二极管芯片发射多个光束。 光束穿过透明卡盘通过发射到透明卡盘的入射平面中。 光感测装置设置在透明卡盘的发光平面的一侧，以容纳透过透明卡盘的光束。
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公开(公告)号：US20140159732A1
公开(公告)日：2014-06-12
申请号：US13836181
申请日：2013-03-15
Applicant: GENESIS PHOTONICS INC
Inventor： TAI-WEI WU , TAI-CHENG TSAI , Hsin-Hung Lin , Ping-Tsung Tsai , Pei-Yi Huang , Gwo-Jiun Sheu , Shou-Wen Hsu , YUN-LI LI
IPC: G01R31/44
CPC classification number: G01R31/44 , G01J2001/4252 , G01R31/2635
Abstract: A detection apparatus for light-emitting diode chip comprising a substrate with the function of photoelectric conversion and a probing device is disclosed. The substrate is designed to bear at least one light-emitting diode chip. The probing device comprises a power supply and at least two conductive elements. The two ends of the conductive elements are respectively electrically connected to the light-emitting diode chip and the power supply to enable the light-emitting diode chip to emit light beams. Some of the light beams are emitted from the light-emitting diode chip toward the substrate such that the light beams emitted by the light-emitting diode chip are converted into an electric signal by the substrate.
Abstract translation: 公开了一种包括具有光电转换功能的基板和探测装置的发光二极管芯片的检测装置。 基板被设计成承载至少一个发光二极管芯片。 探测装置包括电源和至少两个导电元件。 导电元件的两端分别电连接到发光二极管芯片和电源，以使得发光二极管芯片能够发射光束。 一些光束从发光二极管芯片朝向基板发射，使得由发光二极管芯片发射的光束被基板转换成电信号。
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